JP7127746B2 - 樹脂シート及び樹脂多層基板 - Google Patents
樹脂シート及び樹脂多層基板 Download PDFInfo
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- JP7127746B2 JP7127746B2 JP2021537343A JP2021537343A JP7127746B2 JP 7127746 B2 JP7127746 B2 JP 7127746B2 JP 2021537343 A JP2021537343 A JP 2021537343A JP 2021537343 A JP2021537343 A JP 2021537343A JP 7127746 B2 JP7127746 B2 JP 7127746B2
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- resin
- lcp
- resin sheet
- thermal expansion
- conductor layer
- Prior art date
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- H05K1/034—Organic insulating material consisting of one material containing halogen
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- H—ELECTRICITY
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
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- H—ELECTRICITY
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
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- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
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- H—ELECTRICITY
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- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0141—Liquid crystal polymer [LCP]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/065—Binding insulating layers without adhesive, e.g. by local heating or welding, before lamination of the whole PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
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- Engineering & Computer Science (AREA)
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- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Description
1種以上の樹脂材料と、前記1種以上の樹脂材料の重量の合計より少ない重量の液晶ポリマーとを、含んでおり、
前記1種以上の樹脂材料を含み、かつ、前記液晶ポリマーを含まない比較樹脂シートが有する面方向の熱膨張係数より小さい面方向の熱膨張係数を有している。
以下に、本発明の実施形態に係る樹脂多層基板10の構造について図面を参照しながら説明する。図1は、樹脂多層基板10の分解斜視図である。図2は、樹脂多層基板10の断面図である。図3、電子機器1の正面図である。
次に、本実施形態に係る樹脂シートの樹脂材料について説明する。なお、積層前の樹脂シートを積層後の樹脂シート16a~16dと区別して、樹脂シート16と呼ぶ。
ΔL=αLΔT・・・(A)
樹脂シート16の主面が広がる方向(面方向)の熱膨張係数:α
樹脂シート16の主面が広がる方向(面方向)における樹脂シート16の長さ:L
樹脂シート16の主面が広がる方向(面方向)における樹脂シート16の伸び量:ΔL
温度上昇:ΔT
なお、本願発明者は、熱膨張係数の測定を以下の手法により行った。本願発明者は、幅5mm、長さ16mmに切り出したサンプルを作製した。そして、本願発明者は、TA instruments社製熱機械的分析装置(商品名:TMA Q400)により、荷重0.1Nの引張りモードで室温から170℃までサンプルを昇温させた。そして、本願発明者は、サンプルを室温まで冷却する過程において、50℃~80℃の範囲内の熱膨張係数の平均値を求めることにより、熱膨張係数を測定した。
ところで、LCPは、図2に示すように、繊維状の粒子を含んでいることが好ましい。具体的には、LCPは、LCP-NF(ナノファイバー液晶ポリマー)であることが好ましい。以下に、LCP-NFについて説明する。
次に、樹脂シート16の製造方法について説明する。樹脂シート16の製造方法では、まず、LCP-NFを作製する。LCP-NFの製造方法は、粗粉砕工程と、微粉砕工程と、粗粒除去工程と、繊維化工程とを、この順で備えている。
本発明に係る樹脂シートは前記実施形態に係る樹脂シート16,16a~16dに限らず、その要旨の範囲内において変更可能である。
10:樹脂多層基板
12:積層体
12a:曲げ部
16,16a~16d:樹脂シート
17a,17b:レジスト層
18:信号導体層
20:第1グランド導体層
22:第2グランド導体層
Claims (11)
- 1種以上の樹脂材料と、前記1種以上の樹脂材料の重量の合計より少ない重量の液晶ポリマーとを、含んでおり、
前記1種以上の樹脂材料を含み、かつ、前記液晶ポリマーを含まない比較樹脂シートが有する面方向の熱膨張係数より小さい面方向の熱膨張係数を有しており、
前記液晶ポリマーは、ナノファイバー液晶ポリマーである、
樹脂シート。 - 前記1種以上の樹脂材料の比誘電率は、前記液晶ポリマーの比誘電率より小さい、
請求項1に記載の樹脂シート。 - 前記1種以上の樹脂材料の誘電正接は、前記液晶ポリマーの誘電正接より小さい、
請求項1に記載の樹脂シート。 - 前記液晶ポリマーは、繊維状の粒子を含んでいる、
請求項1ないし請求項3のいずれかに記載の樹脂シート。 - 前記繊維状の粒子は、繊維径に対する長手方向の長さの比であるアスペクト比が10倍以上であり、
前記繊維状の粒子の平均径は、1μm以下である、
請求項4に記載の樹脂シート。 - 前記1種以上の樹脂材料の融点の内の最も高い融点は、前記液晶ポリマーの融点より30℃以上低い、
請求項1ないし請求項5のいずれかに記載の樹脂シート。 - 前記1種以上の樹脂材料は、フッ素樹脂である、
請求項1ないし請求項6のいずれかに記載の樹脂シート。 - 前記フッ素樹脂は、パーフルオロアルコキシアルカンである、
請求項7に記載の樹脂シート。 - 前記樹脂シートの面方向の熱膨張係数は、5ppm/℃以上20ppm/℃以下である、
請求項1ないし請求項8のいずれかに記載の樹脂シート。 - 請求項1ないし請求項9のいずれかに記載の複数の樹脂シートが積層された構造を有する積層体を備えている、
樹脂多層基板。 - 前記樹脂多層基板は、前記樹脂シートの積層方向が変化する曲げ部を、有している、
請求項10に記載の樹脂多層基板。
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