JPWO2021010236A5 - - Google Patents
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- Publication number
- JPWO2021010236A5 JPWO2021010236A5 JP2021532993A JP2021532993A JPWO2021010236A5 JP WO2021010236 A5 JPWO2021010236 A5 JP WO2021010236A5 JP 2021532993 A JP2021532993 A JP 2021532993A JP 2021532993 A JP2021532993 A JP 2021532993A JP WO2021010236 A5 JPWO2021010236 A5 JP WO2021010236A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- brush
- cleaning unit
- chuck cleaning
- cleans
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019132256 | 2019-07-17 | ||
| JP2019132256 | 2019-07-17 | ||
| PCT/JP2020/026624 WO2021010236A1 (ja) | 2019-07-17 | 2020-07-08 | 基板加工装置、基板処理システム、及び基板処理方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2021010236A1 JPWO2021010236A1 (https=) | 2021-01-21 |
| JPWO2021010236A5 true JPWO2021010236A5 (https=) | 2022-04-13 |
| JP7224467B2 JP7224467B2 (ja) | 2023-02-17 |
Family
ID=74209850
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021532993A Active JP7224467B2 (ja) | 2019-07-17 | 2020-07-08 | 基板加工装置、基板処理システム、及び基板処理方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US12191153B2 (https=) |
| JP (1) | JP7224467B2 (https=) |
| KR (1) | KR102944323B1 (https=) |
| CN (1) | CN114096379B (https=) |
| TW (1) | TWI860380B (https=) |
| WO (1) | WO2021010236A1 (https=) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102714919B1 (ko) * | 2019-06-28 | 2024-10-07 | 삼성전자주식회사 | 반도체 장치의 제조 설비 |
| EP3859448A1 (en) * | 2020-01-28 | 2021-08-04 | ASML Netherlands B.V. | Positioning device and method to use a positioning device |
| JP7563847B2 (ja) * | 2021-02-10 | 2024-10-08 | 東京エレクトロン株式会社 | 研削装置 |
| CN114248125B (zh) * | 2022-03-02 | 2022-04-29 | 冈田精机(常州)有限公司 | 分离式交换工作台 |
| JP7802577B2 (ja) * | 2022-03-08 | 2026-01-20 | 株式会社東京精密 | 加工システム |
| CN114589553B (zh) * | 2022-03-11 | 2022-12-20 | 浙江芯晖装备技术有限公司 | 一种应用于硬脆薄片材料的双面减薄工艺 |
| KR102695203B1 (ko) * | 2023-12-04 | 2024-08-16 | 주식회사 스맥 | 반도체 웨이퍼 클리닝 유닛 |
| KR102800501B1 (ko) * | 2023-12-04 | 2025-04-29 | 주식회사 스맥 | 반도체 웨이퍼 폴리싱 유닛 |
| KR102672300B1 (ko) * | 2023-12-04 | 2024-06-05 | 주식회사 스맥 | 반도체 웨이퍼 폴리싱 및 클리닝 장치 |
| KR102717768B1 (ko) * | 2023-12-04 | 2024-10-16 | 주식회사 스맥 | 반도체 웨이퍼 폴리싱 및 클리닝 방법 |
Family Cites Families (38)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61297072A (ja) * | 1985-06-26 | 1986-12-27 | Nisshin Kogyo Kk | ウエ−ハ自動平面研削盤のアンロ−ダ装置 |
| US5329732A (en) * | 1992-06-15 | 1994-07-19 | Speedfam Corporation | Wafer polishing method and apparatus |
| JPH08330260A (ja) * | 1995-05-30 | 1996-12-13 | Tokyo Electron Ltd | 研磨方法及びその装置 |
| JP3696690B2 (ja) * | 1996-04-23 | 2005-09-21 | 不二越機械工業株式会社 | ウェーハの研磨装置システム |
| JP3348429B2 (ja) * | 1996-12-26 | 2002-11-20 | 信越半導体株式会社 | 薄板ワーク平面研削方法 |
| JPH10329015A (ja) * | 1997-03-24 | 1998-12-15 | Canon Inc | 研磨装置および研磨方法 |
| JP3231659B2 (ja) * | 1997-04-28 | 2001-11-26 | 日本電気株式会社 | 自動研磨装置 |
| JP2000254857A (ja) * | 1999-01-06 | 2000-09-19 | Tokyo Seimitsu Co Ltd | 平面加工装置及び平面加工方法 |
| US6358128B1 (en) * | 1999-03-05 | 2002-03-19 | Ebara Corporation | Polishing apparatus |
| JP2001157959A (ja) * | 1999-11-30 | 2001-06-12 | Tokyo Seimitsu Co Ltd | 平面加工装置 |
| US20020013122A1 (en) * | 1999-12-22 | 2002-01-31 | Nikon Corporation | Process and apparatus for chemimechanically polishing a substrate |
| JP2001326201A (ja) * | 2000-05-16 | 2001-11-22 | Ebara Corp | ポリッシング装置 |
| TW509993B (en) * | 2000-08-22 | 2002-11-11 | Nikon Corp | CMP device and production method for semiconductor device |
| US6666948B2 (en) * | 2001-04-23 | 2003-12-23 | Phuong Van Nguyen | Silicon wafer polisher |
| JP2002343756A (ja) * | 2001-05-21 | 2002-11-29 | Tokyo Seimitsu Co Ltd | ウェーハ平面加工装置 |
| WO2003011523A1 (en) * | 2001-08-02 | 2003-02-13 | Applied Materials, Inc. | Multiport polishing fluid delivery system |
| JP2006516825A (ja) * | 2003-01-27 | 2006-07-06 | イン クウォン ジェオン | 1つ以上のピボット可能なロード/アンロードカップを使用して半導体ウェーハを研磨するための装置及び方法 |
| JP4464113B2 (ja) * | 2003-11-27 | 2010-05-19 | 株式会社ディスコ | ウエーハの加工装置 |
| KR100595135B1 (ko) * | 2004-12-29 | 2006-06-30 | 동부일렉트로닉스 주식회사 | 두 개의 웨이퍼 이송용 모듈을 갖는 웨이퍼 이송장치 |
| JP2007235069A (ja) * | 2006-03-03 | 2007-09-13 | Tokyo Seimitsu Co Ltd | ウェーハ加工方法 |
| JP4838614B2 (ja) * | 2006-03-29 | 2011-12-14 | 株式会社岡本工作機械製作所 | 半導体基板の平坦化装置および平坦化方法 |
| TW200817131A (en) * | 2006-08-08 | 2008-04-16 | Inopla Inc | Apparatus and method for polishing semiconductor wafers |
| US8578953B2 (en) * | 2006-12-20 | 2013-11-12 | Tokyo Electron Limited | Substrate cleaning apparatus, substrate cleaning method, and computer-readable storage medium |
| JP2008264913A (ja) | 2007-04-18 | 2008-11-06 | Disco Abrasive Syst Ltd | 研削加工装置 |
| US20090061739A1 (en) * | 2007-09-05 | 2009-03-05 | Jeong In-Kwon | Polishing apparatus and method for polishing semiconductor wafers using load-unload stations |
| JP5335245B2 (ja) * | 2008-01-09 | 2013-11-06 | 株式会社ディスコ | ウェーハの研削方法および研削加工装置 |
| JP5149020B2 (ja) * | 2008-01-23 | 2013-02-20 | 株式会社ディスコ | ウエーハの研削方法 |
| JP5731158B2 (ja) * | 2010-09-30 | 2015-06-10 | 株式会社ディスコ | 加工装置 |
| JP2014053510A (ja) * | 2012-09-07 | 2014-03-20 | Toshiba Corp | 端面加工方法及び端面加工装置 |
| JP2016047561A (ja) * | 2014-08-27 | 2016-04-07 | 株式会社ディスコ | 研削装置 |
| JP6425639B2 (ja) * | 2015-04-08 | 2018-11-21 | 東京エレクトロン株式会社 | 基板処理システム |
| KR20160125585A (ko) * | 2015-04-21 | 2016-11-01 | 삼성전자주식회사 | 기판 처리 장치 및 기판 처리 방법 |
| US9831110B2 (en) * | 2015-07-30 | 2017-11-28 | Lam Research Corporation | Vision-based wafer notch position measurement |
| CN105415146B (zh) * | 2015-12-01 | 2019-06-11 | 北京中电科电子装备有限公司 | 一种分度回转工作台及分度回转工作台系统 |
| JP6858539B2 (ja) * | 2016-12-08 | 2021-04-14 | 株式会社ディスコ | 研削装置 |
| WO2019013037A1 (ja) * | 2017-07-12 | 2019-01-17 | 東京エレクトロン株式会社 | 研削装置、研削方法及びコンピュータ記憶媒体 |
| JP6906859B2 (ja) * | 2017-09-13 | 2021-07-21 | 株式会社ディスコ | 加工装置 |
| JP7417362B2 (ja) * | 2019-04-05 | 2024-01-18 | 株式会社ディスコ | 研削装置 |
-
2020
- 2020-07-03 TW TW109122499A patent/TWI860380B/zh active
- 2020-07-08 WO PCT/JP2020/026624 patent/WO2021010236A1/ja not_active Ceased
- 2020-07-08 US US17/627,147 patent/US12191153B2/en active Active
- 2020-07-08 KR KR1020227004081A patent/KR102944323B1/ko active Active
- 2020-07-08 CN CN202080050049.1A patent/CN114096379B/zh active Active
- 2020-07-08 JP JP2021532993A patent/JP7224467B2/ja active Active
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