JPWO2019233526A5 - - Google Patents

Download PDF

Info

Publication number
JPWO2019233526A5
JPWO2019233526A5 JP2020567220A JP2020567220A JPWO2019233526A5 JP WO2019233526 A5 JPWO2019233526 A5 JP WO2019233526A5 JP 2020567220 A JP2020567220 A JP 2020567220A JP 2020567220 A JP2020567220 A JP 2020567220A JP WO2019233526 A5 JPWO2019233526 A5 JP WO2019233526A5
Authority
JP
Japan
Prior art keywords
solution
supply device
processing apparatus
upward
solution tank
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2020567220A
Other languages
English (en)
Japanese (ja)
Other versions
JP2021526733A (ja
JP7393353B2 (ja
Publication date
Application filed filed Critical
Priority claimed from PCT/DE2019/100488 external-priority patent/WO2019233526A1/de
Publication of JP2021526733A publication Critical patent/JP2021526733A/ja
Publication of JPWO2019233526A5 publication Critical patent/JPWO2019233526A5/ja
Application granted granted Critical
Publication of JP7393353B2 publication Critical patent/JP7393353B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2020567220A 2018-06-04 2019-06-03 物体を処理する方法及びその方法を実施するための装置 Active JP7393353B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102018113264 2018-06-04
DE102018113264.6 2018-06-04
PCT/DE2019/100488 WO2019233526A1 (de) 2018-06-04 2019-06-03 Verfahren zur behandlung von objekten sowie vorrichtung zur durchführung des verfahrens

Publications (3)

Publication Number Publication Date
JP2021526733A JP2021526733A (ja) 2021-10-07
JPWO2019233526A5 true JPWO2019233526A5 (zh) 2022-06-03
JP7393353B2 JP7393353B2 (ja) 2023-12-06

Family

ID=66866869

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020567220A Active JP7393353B2 (ja) 2018-06-04 2019-06-03 物体を処理する方法及びその方法を実施するための装置

Country Status (6)

Country Link
US (1) US20210159105A1 (zh)
EP (1) EP3803959B1 (zh)
JP (1) JP7393353B2 (zh)
CN (1) CN112534556A (zh)
TW (1) TWI809115B (zh)
WO (1) WO2019233526A1 (zh)

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3953276A (en) * 1972-10-26 1976-04-27 Zenith Radio Corporation Etching apparatus with plural nozzle arrangements
JP2690851B2 (ja) * 1992-09-18 1997-12-17 大日本スクリーン製造株式会社 浸漬型基板処理装置
DE19717511C2 (de) * 1997-04-25 2000-09-14 Atotech Deutschland Gmbh Verfahren zur spezifischen naßchemischen Behandlung von flachem Behandlungsgut in Durchlaufanlagen
US6699356B2 (en) * 2001-08-17 2004-03-02 Applied Materials, Inc. Method and apparatus for chemical-mechanical jet etching of semiconductor structures
JP2003059884A (ja) * 2001-08-20 2003-02-28 Tokyo Electron Ltd 基板処理装置及び基板処理方法
JP2004281597A (ja) * 2003-03-14 2004-10-07 Dainippon Screen Mfg Co Ltd 基板処理方法および基板処理装置
DE102007054090A1 (de) * 2007-11-13 2009-05-20 Rena Sondermaschinen Gmbh Vorrichtung und Verfahren zur einseitigen Nassbehandlung von Gut
DE102011000861A1 (de) * 2011-02-22 2012-08-23 Rena Gmbh Verfahren zum Behandeln eines Objekts, insbesondere eines Solarzellensubstrats, und Vorrichtung zur Durchführung des Verfahrens
CN102861744A (zh) * 2011-07-08 2013-01-09 吉富新能源科技(上海)有限公司 可提升玻璃洁净度的清洁技术方法
DE102011118441B8 (de) 2011-11-12 2018-10-04 RENA Technologies GmbH Anlage und Verfahren zur Behandlung von flachen Substraten
JP6509104B2 (ja) * 2015-09-30 2019-05-08 東京エレクトロン株式会社 基板液処理装置
DE102015121636A1 (de) * 2015-12-11 2017-06-14 Nexwafe Gmbh Vorrichtung und Verfahren zum einseitigen Ätzen einer Halbleiterschicht
DE102016210883A1 (de) * 2016-06-17 2017-12-21 Singulus Technologies Ag Vorrichtung und Verfahren zur Behandlung von Substraten unter Verwendung einer Auflagerolle mit porösem Material

Similar Documents

Publication Publication Date Title
EP2012941B1 (de) Verfahren sowie vorrichtung zum behandeln von flaschen oder dergleichen behälter
JPH05154419A (ja) Ｄｉ缶表面処理方法およびその装置
EP0820351B1 (en) Fluid delivery apparatus and method
JP6568838B2 (ja) 乾燥装置
JPS62114677A (ja) ペイントスプレブ−ス
TWI593470B (zh) Substrate processing apparatus, substrate processing method, substrate manufacturing apparatus, and substrate manufacturing method
TWI227035B (en) Substrate processing device of transporting type
JPWO2019233526A5 (zh)
EP3573453B1 (en) An apparatus and method for washing shell eggs
RU2651082C2 (ru) Устройство для травления цилиндра
KR101696826B1 (ko) 이물질 제거장치
US20040226579A1 (en) Apparatus and process for the continuous treatment of a continuous material
JP7393353B2 (ja) 物体を処理する方法及びその方法を実施するための装置
WO2002049086A1 (fr) Dispositif de traitement de substrat de transfert
KR101256604B1 (ko) 롤링 방식의 연속 전기도금장치
JP2004203668A (ja) 板材の酸処理設備
US20080241325A1 (en) Device and Method for Removing Liquid From a Food Strand
JP2005177778A (ja) 溶接スパッタの除去方法
CN218695287U (zh) 一种高频焊接钢管焊后冷却装置
JP3595606B2 (ja) 基板表面処理装置
KR101501042B1 (ko) 수평식 전처리를 이용한 이물질 제거장치
JP2023505125A (ja) 飲料産業における移送システムおよび移送システムを作動させるためのコンピュータ制御または電子的方法
BG109039A (bg) Устройство и метод за отстраняване на отлагания от цистерна
JP2004035949A (ja) 金属箔テープの連続表面処理槽及び液中方向転換ロール
KR20230063152A (ko) 이동형 스팀젯을 활용한 기판의 박리 공정 및 세정 방법과 그 시스템