JPWO2018061644A1 - 金属窒化物含有粒子、分散組成物、硬化性組成物、硬化膜、及びそれらの製造方法、並びにカラーフィルタ、固体撮像素子、固体撮像装置、赤外線センサ - Google Patents

金属窒化物含有粒子、分散組成物、硬化性組成物、硬化膜、及びそれらの製造方法、並びにカラーフィルタ、固体撮像素子、固体撮像装置、赤外線センサ Download PDF

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Publication number
JPWO2018061644A1
JPWO2018061644A1 JP2018542042A JP2018542042A JPWO2018061644A1 JP WO2018061644 A1 JPWO2018061644 A1 JP WO2018061644A1 JP 2018542042 A JP2018542042 A JP 2018542042A JP 2018542042 A JP2018542042 A JP 2018542042A JP WO2018061644 A1 JPWO2018061644 A1 JP WO2018061644A1
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atom
group
metal nitride
curable composition
containing particles
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Pending
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Japanese (ja)
Inventor
浜田 大輔
大輔 浜田
久保田 誠
誠 久保田
貴規 田口
貴規 田口
裕貴 坂本
裕貴 坂本
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Fujifilm Corp
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Fujifilm Corp
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Publication of JPWO2018061644A1 publication Critical patent/JPWO2018061644A1/ja
Priority to JP2022039454A priority Critical patent/JP7373000B2/ja
Pending legal-status Critical Current

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    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01BNON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B21/00Nitrogen; Compounds thereof
    • C01B21/06Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron
    • C01B21/076Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron with titanium or zirconium or hafnium
    • C01B21/0763Preparation from titanium, zirconium or hafnium halides
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01GCOMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
    • C01G23/00Compounds of titanium
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00Processes of polymerisation
    • C08F2/44Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/04Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polycarbonamides, polyesteramides or polyimides
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/28Nitrogen-containing compounds
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00Optical elements other than lenses
    • G02B5/20Filters
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70SSIS architectures; Circuits associated therewith

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  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Optics & Photonics (AREA)
  • Inorganic Chemistry (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • General Life Sciences & Earth Sciences (AREA)
  • Geology (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Inorganic Compounds Of Heavy Metals (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Materials For Photolithography (AREA)
  • Optical Filters (AREA)
JP2018542042A 2016-09-30 2017-09-05 金属窒化物含有粒子、分散組成物、硬化性組成物、硬化膜、及びそれらの製造方法、並びにカラーフィルタ、固体撮像素子、固体撮像装置、赤外線センサ Pending JPWO2018061644A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2022039454A JP7373000B2 (ja) 2016-09-30 2022-03-14 金属窒化物含有粒子、分散組成物、硬化性組成物、硬化膜、及びそれらの製造方法、並びにカラーフィルタ、固体撮像素子、固体撮像装置、赤外線センサ

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2016193263 2016-09-30
JP2016193263 2016-09-30
PCT/JP2017/031852 WO2018061644A1 (fr) 2016-09-30 2017-09-05 Particules à teneur en nitrure de métal, composition de dispersion, composition durcissable, film durci, procédés de fabrication de ceux-ci, filtre coloré, élément d'imagerie à semi-conducteurs, dispositif d'imagerie à semi-conducteurs, et capteur de rayons infrarouges

Related Child Applications (1)

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JP2022039454A Division JP7373000B2 (ja) 2016-09-30 2022-03-14 金属窒化物含有粒子、分散組成物、硬化性組成物、硬化膜、及びそれらの製造方法、並びにカラーフィルタ、固体撮像素子、固体撮像装置、赤外線センサ

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JP2022039454A Active JP7373000B2 (ja) 2016-09-30 2022-03-14 金属窒化物含有粒子、分散組成物、硬化性組成物、硬化膜、及びそれらの製造方法、並びにカラーフィルタ、固体撮像素子、固体撮像装置、赤外線センサ

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JP (2) JPWO2018061644A1 (fr)
KR (1) KR102294518B1 (fr)
TW (1) TWI751196B (fr)
WO (1) WO2018061644A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113104822A (zh) * 2021-03-31 2021-07-13 攀枝花学院 氧化钛还原氮化的方法

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JP7029546B2 (ja) * 2018-09-11 2022-03-03 富士フイルム株式会社 遮光性組成物、硬化膜、カラーフィルタ、遮光膜、固体撮像素子、画像表示装置
DE102019124713A1 (de) 2018-11-27 2020-05-28 Samsung Electronics Co., Ltd. Vorrichtungen und Verfahren zur Steuerung einer Exposition gegenüber drahtloser Kommunikation
JP2020200376A (ja) * 2019-06-07 2020-12-17 三菱ケミカル株式会社 樹脂組成物、積層フィルム、積層フィルムの製造方法及び積層フィルムの使用用途

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JPH11263639A (ja) * 1998-03-16 1999-09-28 Sumitomo Metal Mining Co Ltd 熱線遮蔽膜形成用塗布液及び熱線遮蔽膜
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JP2007029859A (ja) * 2005-07-27 2007-02-08 Nisshin Seifun Group Inc 微粒子の製造方法および装置
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JP2012208374A (ja) * 2011-03-30 2012-10-25 Fujifilm Corp 感放射線性組成物、パターン形成方法、カラーフィルタ及びその製造方法、並びに、固体撮像素子
JP2012237952A (ja) * 2011-02-25 2012-12-06 Fujifilm Corp 遮光性組成物、遮光性組成物の製造方法、ソルダレジスト、パターン形成方法、及び固体撮像素子
JP2013237816A (ja) * 2012-05-17 2013-11-28 Fujifilm Corp 着色感放射線性組成物、これを用いたカラーフィルタ
JP2015063663A (ja) * 2013-08-27 2015-04-09 太陽インキ製造株式会社 硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板
JP2015227282A (ja) * 2009-06-15 2015-12-17 東レ株式会社 黒色複合微粒子、黒色樹脂組成物、カラーフィルター基板および液晶表示装置
JP2016038587A (ja) * 2014-08-08 2016-03-22 太陽インキ製造株式会社 硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板
JP5941180B1 (ja) * 2015-03-20 2016-06-29 太陽インキ製造株式会社 硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板

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JP5099094B2 (ja) 2008-09-18 2012-12-12 東レ株式会社 黒色樹脂組成物、樹脂ブラックマトリクス、カラーフィルターおよび液晶表示装置
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JPH0222110A (ja) * 1988-04-23 1990-01-25 Tioxide Group Plc 窒素化合物
JPH11263639A (ja) * 1998-03-16 1999-09-28 Sumitomo Metal Mining Co Ltd 熱線遮蔽膜形成用塗布液及び熱線遮蔽膜
JP2001049190A (ja) * 1999-08-11 2001-02-20 Sumitomo Metal Mining Co Ltd 日射フィルター膜形成用塗布液
JP2006206891A (ja) * 2004-12-28 2006-08-10 Ishihara Sangyo Kaisha Ltd 黒色系酸窒化チタン
JP2007029859A (ja) * 2005-07-27 2007-02-08 Nisshin Seifun Group Inc 微粒子の製造方法および装置
JP2008269820A (ja) * 2007-04-17 2008-11-06 Mitsubishi Materials Corp 導電性黒色粉末とその黒色膜および製造方法
JP2010031158A (ja) * 2008-07-29 2010-02-12 Mitsubishi Materials Corp 黒色顔料分散液とその製造方法および用途
JP2010030841A (ja) * 2008-07-29 2010-02-12 Mitsubishi Materials Corp 黒色チタン酸窒化物粉末とその製造方法および用途
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JP2015063663A (ja) * 2013-08-27 2015-04-09 太陽インキ製造株式会社 硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板
JP2016038587A (ja) * 2014-08-08 2016-03-22 太陽インキ製造株式会社 硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板
JP5941180B1 (ja) * 2015-03-20 2016-06-29 太陽インキ製造株式会社 硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113104822A (zh) * 2021-03-31 2021-07-13 攀枝花学院 氧化钛还原氮化的方法

Also Published As

Publication number Publication date
TWI751196B (zh) 2022-01-01
TW201815682A (zh) 2018-05-01
JP7373000B2 (ja) 2023-11-01
KR102294518B1 (ko) 2021-08-27
KR20190041493A (ko) 2019-04-22
JP2022079500A (ja) 2022-05-26
WO2018061644A1 (fr) 2018-04-05

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