JPWO2018020956A1 - 試料保持具 - Google Patents
試料保持具 Download PDFInfo
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- JPWO2018020956A1 JPWO2018020956A1 JP2018529465A JP2018529465A JPWO2018020956A1 JP WO2018020956 A1 JPWO2018020956 A1 JP WO2018020956A1 JP 2018529465 A JP2018529465 A JP 2018529465A JP 2018529465 A JP2018529465 A JP 2018529465A JP WO2018020956 A1 JPWO2018020956 A1 JP WO2018020956A1
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- JP
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- Prior art keywords
- peripheral wall
- wall portion
- sample
- ceramic body
- convex portions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
- H01L21/6833—Details of electrostatic chucks
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
- B23Q3/15—Devices for holding work using magnetic or electric force acting directly on the work
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
また、第1の周壁部6の上面の表面粗さよりも複数の凸部7の上面の表面粗さのほうが大きくてもよい。これにより、第1の周壁部6において封止を行ないつつも、試料を吸着した後の複数の凸部7からの試料の離脱を容易に行なうことができる。凸部7の上面の表面粗さは、例えば、Ra0.15〜0.25μmに設定できる。第1の周壁部6の上面の表面粗さは、例えば、Ra0.05〜0.15μmに設定できる。
2:吸着電極
3:ベースプレート
4:試料保持面
5:接着層
6:第1の周壁部
7:凸部
8:ガス孔
9:第2の周壁部
10:試料保持具
Claims (5)
- 上面が試料を保持する試料保持面となる円板状のセラミック体と、該セラミック体の内部に設けられた吸着電極とを備え、
前記セラミック体の上面には、外周に沿って突出して設けられた環状の第1の周壁部と該第1の周壁部の内側に設けられた複数の凸部とを有し、前記第1の周壁部の上面と側面との間の角部がR面になっており、
前記セラミック体を平面視による中心を通るように切断した切断面で見たときに、前記第1の周壁部における内側に位置するR面の曲率半径よりも外側に位置するR面の曲率半径のほうが小さい試料保持具。 - 前記複数の凸部の高さが前記第1の周壁部の高さよりも低くなっている請求項1に記載の試料保持具。
- 前記セラミック体の上面には、前記第1の周壁部よりも内側に離して設けられた環状の第2の周壁部を有し、該第2の周壁部の上面と側面との間の角部がR面になっており、前記第1の周壁部の外側に位置するR面の曲率半径よりも前記第2の周壁部のR面の曲率半径のほうが大きい請求項1または請求項2に記載の試料保持具。
- 前記複数の凸部の上面と側面との間の角部がR面になっており、前記第1の周壁部の外側に位置するR面の曲率半径よりも前記複数の凸部のR面の曲率半径のほうが大きい請求項1乃至請求項3のうちのいずれかに記載の試料保持具。
- 前記第1の周壁部の上面の表面粗さよりも前記複数の凸部の上面の表面粗さのほうが大きい請求項1乃至請求項4のうちのいずれかに記載の試料保持具。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016145188 | 2016-07-25 | ||
JP2016145188 | 2016-07-25 | ||
PCT/JP2017/024133 WO2018020956A1 (ja) | 2016-07-25 | 2017-06-30 | 試料保持具 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2018020956A1 true JPWO2018020956A1 (ja) | 2019-04-11 |
JP6612985B2 JP6612985B2 (ja) | 2019-11-27 |
Family
ID=61016839
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018529465A Active JP6612985B2 (ja) | 2016-07-25 | 2017-06-30 | 試料保持具 |
Country Status (4)
Country | Link |
---|---|
US (1) | US11139194B2 (ja) |
JP (1) | JP6612985B2 (ja) |
KR (2) | KR102474583B1 (ja) |
WO (1) | WO2018020956A1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2021021513A1 (en) * | 2019-07-29 | 2021-02-04 | Applied Materials, Inc. | Semiconductor substrate supports with improved high temperature chucking |
US20210247178A1 (en) * | 2019-12-26 | 2021-08-12 | Nanjing LiAn Semiconductor Limited | Tool architecture for wafer geometry measurement in semiconductor industry |
KR20230034366A (ko) * | 2020-07-06 | 2023-03-09 | 어플라이드 머티어리얼스, 인코포레이티드 | 온도 제어가 개선된 정전 척 |
US20230114751A1 (en) * | 2021-10-08 | 2023-04-13 | Applied Materials, Inc. | Substrate support |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002237375A (ja) * | 2000-12-05 | 2002-08-23 | Ibiden Co Ltd | 半導体製造・検査装置用セラミック基板およびその製造方法 |
JP2002261157A (ja) * | 2001-02-27 | 2002-09-13 | Kyocera Corp | 静電チャック及び処理装置 |
JP2002329775A (ja) * | 2001-04-27 | 2002-11-15 | Kyocera Corp | 静電チャック |
JP2006156938A (ja) * | 2004-10-29 | 2006-06-15 | Tokyo Electron Ltd | 基板載置台、基板処理装置、および基板の温度制御方法 |
JP2010123843A (ja) * | 2008-11-21 | 2010-06-03 | Kyocera Corp | 静電チャック |
JP2012216774A (ja) * | 2011-04-01 | 2012-11-08 | Hitachi Kokusai Electric Inc | 基板処理装置、半導体装置の製造方法、基板処理方法及びサセプタカバー |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101142000B1 (ko) | 2004-06-28 | 2012-05-17 | 쿄세라 코포레이션 | 정전척 |
KR101411123B1 (ko) * | 2004-12-15 | 2014-06-25 | 가부시키가이샤 니콘 | 기판 유지 장치, 노광 장치 및 디바이스 제조방법 |
US7718007B2 (en) * | 2005-03-17 | 2010-05-18 | Tokyo Electron Limited | Substrate supporting member and substrate processing apparatus |
JP6684710B2 (ja) * | 2013-11-22 | 2020-04-22 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | 静電チャック表面向けのパッド設計 |
US10020218B2 (en) * | 2015-11-17 | 2018-07-10 | Applied Materials, Inc. | Substrate support assembly with deposited surface features |
-
2017
- 2017-06-30 US US16/317,253 patent/US11139194B2/en active Active
- 2017-06-30 KR KR1020217003689A patent/KR102474583B1/ko active IP Right Grant
- 2017-06-30 WO PCT/JP2017/024133 patent/WO2018020956A1/ja active Application Filing
- 2017-06-30 JP JP2018529465A patent/JP6612985B2/ja active Active
- 2017-06-30 KR KR1020197001005A patent/KR20190017953A/ko active Application Filing
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002237375A (ja) * | 2000-12-05 | 2002-08-23 | Ibiden Co Ltd | 半導体製造・検査装置用セラミック基板およびその製造方法 |
JP2002261157A (ja) * | 2001-02-27 | 2002-09-13 | Kyocera Corp | 静電チャック及び処理装置 |
JP2002329775A (ja) * | 2001-04-27 | 2002-11-15 | Kyocera Corp | 静電チャック |
JP2006156938A (ja) * | 2004-10-29 | 2006-06-15 | Tokyo Electron Ltd | 基板載置台、基板処理装置、および基板の温度制御方法 |
JP2010123843A (ja) * | 2008-11-21 | 2010-06-03 | Kyocera Corp | 静電チャック |
JP2012216774A (ja) * | 2011-04-01 | 2012-11-08 | Hitachi Kokusai Electric Inc | 基板処理装置、半導体装置の製造方法、基板処理方法及びサセプタカバー |
Also Published As
Publication number | Publication date |
---|---|
WO2018020956A1 (ja) | 2018-02-01 |
US20190259646A1 (en) | 2019-08-22 |
JP6612985B2 (ja) | 2019-11-27 |
US11139194B2 (en) | 2021-10-05 |
KR102474583B1 (ko) | 2022-12-06 |
KR20190017953A (ko) | 2019-02-20 |
KR20210018531A (ko) | 2021-02-17 |
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