JPWO2016152722A1 - 導電パターン形成用組成物及び導電パターン形成方法 - Google Patents
導電パターン形成用組成物及び導電パターン形成方法 Download PDFInfo
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- JPWO2016152722A1 JPWO2016152722A1 JP2017508293A JP2017508293A JPWO2016152722A1 JP WO2016152722 A1 JPWO2016152722 A1 JP WO2016152722A1 JP 2017508293 A JP2017508293 A JP 2017508293A JP 2017508293 A JP2017508293 A JP 2017508293A JP WO2016152722 A1 JPWO2016152722 A1 JP WO2016152722A1
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- Prior art keywords
- metal
- conductive pattern
- carboxylic acid
- organic carboxylic
- silver
- Prior art date
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- Granted
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- 239000000203 mixture Substances 0.000 title claims abstract description 70
- 238000000034 method Methods 0.000 title claims abstract description 27
- 239000002184 metal Substances 0.000 claims abstract description 127
- 229910052751 metal Inorganic materials 0.000 claims abstract description 127
- 150000002736 metal compounds Chemical class 0.000 claims abstract description 52
- 239000007769 metal material Substances 0.000 claims abstract description 48
- 150000001732 carboxylic acid derivatives Chemical class 0.000 claims abstract description 44
- 150000003839 salts Chemical class 0.000 claims abstract description 38
- 125000004432 carbon atom Chemical group C* 0.000 claims abstract description 26
- 125000002524 organometallic group Chemical group 0.000 claims abstract description 21
- 239000003446 ligand Substances 0.000 claims abstract description 20
- 229920005989 resin Polymers 0.000 claims abstract description 17
- 239000011347 resin Substances 0.000 claims abstract description 17
- 239000002904 solvent Substances 0.000 claims abstract description 11
- 230000007261 regionalization Effects 0.000 claims abstract description 9
- 125000004429 atom Chemical group 0.000 claims abstract description 7
- 150000004696 coordination complex Chemical class 0.000 claims abstract description 6
- 239000002923 metal particle Substances 0.000 claims description 47
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 claims description 45
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 30
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 27
- 239000002070 nanowire Substances 0.000 claims description 25
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 24
- 229910052802 copper Inorganic materials 0.000 claims description 24
- 239000010949 copper Substances 0.000 claims description 24
- 229910052709 silver Inorganic materials 0.000 claims description 24
- 239000004332 silver Substances 0.000 claims description 24
- 239000002253 acid Substances 0.000 claims description 18
- 239000002071 nanotube Substances 0.000 claims description 16
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 claims description 12
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 12
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 claims description 12
- 229910052759 nickel Inorganic materials 0.000 claims description 12
- 239000007787 solid Substances 0.000 claims description 10
- 229910017052 cobalt Inorganic materials 0.000 claims description 9
- 239000010941 cobalt Substances 0.000 claims description 9
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 claims description 8
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 8
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 claims description 7
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 claims description 7
- 150000002148 esters Chemical class 0.000 claims description 7
- 239000003822 epoxy resin Substances 0.000 claims description 6
- 229920000647 polyepoxide Polymers 0.000 claims description 6
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 claims description 5
- 239000002202 Polyethylene glycol Substances 0.000 claims description 5
- 229920001223 polyethylene glycol Polymers 0.000 claims description 5
- 229920001451 polypropylene glycol Polymers 0.000 claims description 5
- FPZWZCWUIYYYBU-UHFFFAOYSA-N 2-(2-ethoxyethoxy)ethyl acetate Chemical compound CCOCCOCCOC(C)=O FPZWZCWUIYYYBU-UHFFFAOYSA-N 0.000 claims description 4
- 229920001145 Poly(N-vinylacetamide) Polymers 0.000 claims description 4
- 229920002678 cellulose Polymers 0.000 claims description 4
- 239000001913 cellulose Substances 0.000 claims description 4
- 229940028356 diethylene glycol monobutyl ether Drugs 0.000 claims description 4
- 235000011187 glycerol Nutrition 0.000 claims description 4
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 claims description 4
- 229920000191 poly(N-vinyl pyrrolidone) Polymers 0.000 claims description 4
- 229920002635 polyurethane Polymers 0.000 claims description 4
- 239000004814 polyurethane Substances 0.000 claims description 4
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 claims description 3
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 claims description 3
- 229940075557 diethylene glycol monoethyl ether Drugs 0.000 claims description 3
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 claims description 2
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 claims description 2
- 239000000463 material Substances 0.000 abstract description 6
- 239000002245 particle Substances 0.000 description 43
- 239000006185 dispersion Substances 0.000 description 23
- 238000009472 formulation Methods 0.000 description 20
- 239000000126 substance Substances 0.000 description 19
- 239000000758 substrate Substances 0.000 description 19
- 230000000052 comparative effect Effects 0.000 description 16
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 13
- 239000010408 film Substances 0.000 description 13
- 238000005245 sintering Methods 0.000 description 10
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 9
- 238000010438 heat treatment Methods 0.000 description 9
- 238000007639 printing Methods 0.000 description 9
- -1 silver ethoxide Chemical compound 0.000 description 9
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 8
- YRKCREAYFQTBPV-UHFFFAOYSA-N acetylacetone Chemical compound CC(=O)CC(C)=O YRKCREAYFQTBPV-UHFFFAOYSA-N 0.000 description 8
- 239000003638 chemical reducing agent Substances 0.000 description 8
- 230000000694 effects Effects 0.000 description 8
- 230000001603 reducing effect Effects 0.000 description 8
- XYIBRDXRRQCHLP-UHFFFAOYSA-N ethyl acetoacetate Chemical compound CCOC(=O)CC(C)=O XYIBRDXRRQCHLP-UHFFFAOYSA-N 0.000 description 7
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 6
- 239000002042 Silver nanowire Substances 0.000 description 6
- 150000001412 amines Chemical class 0.000 description 6
- 239000012298 atmosphere Substances 0.000 description 6
- 150000001875 compounds Chemical class 0.000 description 6
- 238000010304 firing Methods 0.000 description 6
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 6
- CQLFBEKRDQMJLZ-UHFFFAOYSA-M silver acetate Chemical compound [Ag+].CC([O-])=O CQLFBEKRDQMJLZ-UHFFFAOYSA-M 0.000 description 6
- 229940071536 silver acetate Drugs 0.000 description 6
- GGCZERPQGJTIQP-UHFFFAOYSA-N sodium;9,10-dioxoanthracene-2-sulfonic acid Chemical compound [Na+].C1=CC=C2C(=O)C3=CC(S(=O)(=O)O)=CC=C3C(=O)C2=C1 GGCZERPQGJTIQP-UHFFFAOYSA-N 0.000 description 6
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 5
- 150000001735 carboxylic acids Chemical class 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 229940093858 ethyl acetoacetate Drugs 0.000 description 5
- 239000002082 metal nanoparticle Substances 0.000 description 5
- 238000002360 preparation method Methods 0.000 description 5
- 239000004642 Polyimide Substances 0.000 description 4
- 239000011230 binding agent Substances 0.000 description 4
- 239000004020 conductor Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 229910044991 metal oxide Inorganic materials 0.000 description 4
- 150000004706 metal oxides Chemical class 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 239000002060 nanoflake Substances 0.000 description 4
- 239000003960 organic solvent Substances 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- NQPDZGIKBAWPEJ-UHFFFAOYSA-N valeric acid Chemical compound CCCCC(O)=O NQPDZGIKBAWPEJ-UHFFFAOYSA-N 0.000 description 4
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 3
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- GWYFCOCPABKNJV-UHFFFAOYSA-M 3-Methylbutanoic acid Natural products CC(C)CC([O-])=O GWYFCOCPABKNJV-UHFFFAOYSA-M 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 150000007513 acids Chemical class 0.000 description 3
- 238000002296 dynamic light scattering Methods 0.000 description 3
- 229910052500 inorganic mineral Inorganic materials 0.000 description 3
- GWYFCOCPABKNJV-UHFFFAOYSA-N isovaleric acid Chemical compound CC(C)CC(O)=O GWYFCOCPABKNJV-UHFFFAOYSA-N 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 239000011707 mineral Substances 0.000 description 3
- IUGYQRQAERSCNH-UHFFFAOYSA-N pivalic acid Chemical compound CC(C)(C)C(O)=O IUGYQRQAERSCNH-UHFFFAOYSA-N 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 150000005846 sugar alcohols Polymers 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- ODIGIKRIUKFKHP-UHFFFAOYSA-N (n-propan-2-yloxycarbonylanilino) acetate Chemical compound CC(C)OC(=O)N(OC(C)=O)C1=CC=CC=C1 ODIGIKRIUKFKHP-UHFFFAOYSA-N 0.000 description 2
- JWDSCUIQYJUHHM-UHFFFAOYSA-N 2-ethylacetoacetic acid Chemical compound CCC(C(C)=O)C(O)=O JWDSCUIQYJUHHM-UHFFFAOYSA-N 0.000 description 2
- GCXJINGJZAOJHR-UHFFFAOYSA-N 2-methylacetoacetic acid Chemical compound CC(=O)C(C)C(O)=O GCXJINGJZAOJHR-UHFFFAOYSA-N 0.000 description 2
- 229920000298 Cellophane Polymers 0.000 description 2
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 2
- 239000005751 Copper oxide Substances 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- TUCQZIYCSGJNMZ-UHFFFAOYSA-N [4-(hydroxymethyl)cyclohexyl]methyl acetate Chemical compound CC(=O)OCC1CCC(CO)CC1 TUCQZIYCSGJNMZ-UHFFFAOYSA-N 0.000 description 2
- KSIFEWSPJQDERU-UHFFFAOYSA-N [4-(methoxymethyl)cyclohexyl]methanol Chemical compound COCC1CCC(CO)CC1 KSIFEWSPJQDERU-UHFFFAOYSA-N 0.000 description 2
- WDJHALXBUFZDSR-UHFFFAOYSA-M acetoacetate Chemical compound CC(=O)CC([O-])=O WDJHALXBUFZDSR-UHFFFAOYSA-M 0.000 description 2
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- HUMNYLRZRPPJDN-UHFFFAOYSA-N benzaldehyde Chemical compound O=CC1=CC=CC=C1 HUMNYLRZRPPJDN-UHFFFAOYSA-N 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- OXFZSJOUPRCPJO-UHFFFAOYSA-N copper ethyl 3-oxobutanoate Chemical compound [Cu+2].CCOC(=O)[CH-]C(C)=O.CCOC(=O)[CH-]C(C)=O OXFZSJOUPRCPJO-UHFFFAOYSA-N 0.000 description 2
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- SVOAENZIOKPANY-CVBJKYQLSA-L copper;(z)-octadec-9-enoate Chemical compound [Cu+2].CCCCCCCC\C=C/CCCCCCCC([O-])=O.CCCCCCCC\C=C/CCCCCCCC([O-])=O SVOAENZIOKPANY-CVBJKYQLSA-L 0.000 description 2
- SEKCXMNFUDONGJ-UHFFFAOYSA-L copper;2-ethylhexanoate Chemical compound [Cu+2].CCCCC(CC)C([O-])=O.CCCCC(CC)C([O-])=O SEKCXMNFUDONGJ-UHFFFAOYSA-L 0.000 description 2
- LZJJVTQGPPWQFS-UHFFFAOYSA-L copper;propanoate Chemical compound [Cu+2].CCC([O-])=O.CCC([O-])=O LZJJVTQGPPWQFS-UHFFFAOYSA-L 0.000 description 2
- NNBZCPXTIHJBJL-UHFFFAOYSA-N decalin Chemical compound C1CCCC2CCCCC21 NNBZCPXTIHJBJL-UHFFFAOYSA-N 0.000 description 2
- 238000006731 degradation reaction Methods 0.000 description 2
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- 238000000445 field-emission scanning electron microscopy Methods 0.000 description 2
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- 239000001384 succinic acid Substances 0.000 description 2
- 229910052724 xenon Inorganic materials 0.000 description 2
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- UVPKUTPZWFHAHY-UHFFFAOYSA-L 2-ethylhexanoate;nickel(2+) Chemical compound [Ni+2].CCCCC(CC)C([O-])=O.CCCCC(CC)C([O-])=O UVPKUTPZWFHAHY-UHFFFAOYSA-L 0.000 description 1
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- ZXOTUROOJVAZGM-UHFFFAOYSA-L 3-hydroxy-2-(hydroxymethyl)-2-methylpropanoate;nickel(2+) Chemical compound [Ni+2].OCC(C)(CO)C([O-])=O.OCC(C)(CO)C([O-])=O ZXOTUROOJVAZGM-UHFFFAOYSA-L 0.000 description 1
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- KDMCQAXHWIEEDE-UHFFFAOYSA-L cobalt(2+);7,7-dimethyloctanoate Chemical compound [Co+2].CC(C)(C)CCCCCC([O-])=O.CC(C)(C)CCCCCC([O-])=O KDMCQAXHWIEEDE-UHFFFAOYSA-L 0.000 description 1
- CTIHZTFULZJBGQ-UHFFFAOYSA-L cobalt(2+);decanoate Chemical compound [Co+2].CCCCCCCCCC([O-])=O.CCCCCCCCCC([O-])=O CTIHZTFULZJBGQ-UHFFFAOYSA-L 0.000 description 1
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- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
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- MNSHGRXIICSKRQ-UHFFFAOYSA-L nickel(2+);3-oxobutanoate Chemical compound [Ni+2].CC(=O)CC([O-])=O.CC(=O)CC([O-])=O MNSHGRXIICSKRQ-UHFFFAOYSA-L 0.000 description 1
- JMWUYEFBFUCSAK-UHFFFAOYSA-L nickel(2+);octadecanoate Chemical compound [Ni+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O JMWUYEFBFUCSAK-UHFFFAOYSA-L 0.000 description 1
- DVTHIMLUHWEZOM-UHFFFAOYSA-L nickel(2+);octanoate Chemical compound [Ni+2].CCCCCCCC([O-])=O.CCCCCCCC([O-])=O DVTHIMLUHWEZOM-UHFFFAOYSA-L 0.000 description 1
- DOLZKNFSRCEOFV-UHFFFAOYSA-L nickel(2+);oxalate Chemical compound [Ni+2].[O-]C(=O)C([O-])=O DOLZKNFSRCEOFV-UHFFFAOYSA-L 0.000 description 1
- BMKPTNXFXMPREV-UHFFFAOYSA-L nickel(2+);oxaldehydate Chemical compound [Ni+2].[O-]C(=O)C=O.[O-]C(=O)C=O BMKPTNXFXMPREV-UHFFFAOYSA-L 0.000 description 1
- YOQIGCBZXAYLBT-UHFFFAOYSA-N nickel;phthalic acid Chemical compound [Ni].OC(=O)C1=CC=CC=C1C(O)=O YOQIGCBZXAYLBT-UHFFFAOYSA-N 0.000 description 1
- NAVSKFYJNZQECG-UHFFFAOYSA-N nickel;propanoic acid Chemical compound [Ni].CCC(O)=O NAVSKFYJNZQECG-UHFFFAOYSA-N 0.000 description 1
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 1
- 125000000962 organic group Chemical group 0.000 description 1
- 239000012044 organic layer Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- QNGNSVIICDLXHT-UHFFFAOYSA-N para-ethylbenzaldehyde Natural products CCC1=CC=C(C=O)C=C1 QNGNSVIICDLXHT-UHFFFAOYSA-N 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- IPBVNPXQWQGGJP-UHFFFAOYSA-N phenyl acetate Chemical group CC(=O)OC1=CC=CC=C1 IPBVNPXQWQGGJP-UHFFFAOYSA-N 0.000 description 1
- ACVYVLVWPXVTIT-UHFFFAOYSA-N phosphinic acid Chemical compound O[PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-N 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 229950010765 pivalate Drugs 0.000 description 1
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 1
- 229920001515 polyalkylene glycol Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920006316 polyvinylpyrrolidine Polymers 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 238000004062 sedimentation Methods 0.000 description 1
- QTMJPFXBYCSQOJ-UHFFFAOYSA-M silver 3-methylbutanoate Chemical compound [Ag+].CC(C)CC([O-])=O QTMJPFXBYCSQOJ-UHFFFAOYSA-M 0.000 description 1
- AQRYNYUOKMNDDV-UHFFFAOYSA-M silver behenate Chemical compound [Ag+].CCCCCCCCCCCCCCCCCCCCCC([O-])=O AQRYNYUOKMNDDV-UHFFFAOYSA-M 0.000 description 1
- XNGYKPINNDWGGF-UHFFFAOYSA-L silver oxalate Chemical compound [Ag+].[Ag+].[O-]C(=O)C([O-])=O XNGYKPINNDWGGF-UHFFFAOYSA-L 0.000 description 1
- YRSQDSCQMOUOKO-KVVVOXFISA-M silver;(z)-octadec-9-enoate Chemical compound [Ag+].CCCCCCCC\C=C/CCCCCCCC([O-])=O YRSQDSCQMOUOKO-KVVVOXFISA-M 0.000 description 1
- YWZDCTBAHKRVGL-UHFFFAOYSA-M silver;2,2-bis(hydroxymethyl)butanoate Chemical compound [Ag+].CCC(CO)(CO)C([O-])=O YWZDCTBAHKRVGL-UHFFFAOYSA-M 0.000 description 1
- WXENESFPQCWDHY-UHFFFAOYSA-M silver;2-ethylhexanoate Chemical compound [Ag+].CCCCC(CC)C([O-])=O WXENESFPQCWDHY-UHFFFAOYSA-M 0.000 description 1
- FSTLSTSWWPYEPR-UHFFFAOYSA-M silver;2-methyl-3-oxobutanoate Chemical compound [Ag+].CC(=O)C(C)C([O-])=O FSTLSTSWWPYEPR-UHFFFAOYSA-M 0.000 description 1
- GYEMIEGAEOIJQR-UHFFFAOYSA-M silver;2-methylpropanoate Chemical compound [Ag+].CC(C)C([O-])=O GYEMIEGAEOIJQR-UHFFFAOYSA-M 0.000 description 1
- VYHCRGQRPKVHNS-UHFFFAOYSA-M silver;3-hydroxy-2-(hydroxymethyl)-2-methylpropanoate Chemical compound [Ag+].OCC(C)(CO)C([O-])=O VYHCRGQRPKVHNS-UHFFFAOYSA-M 0.000 description 1
- IHPDLWRQAUIWEQ-UHFFFAOYSA-M silver;3-oxo-3-phenylpropanoate Chemical compound [Ag+].[O-]C(=O)CC(=O)C1=CC=CC=C1 IHPDLWRQAUIWEQ-UHFFFAOYSA-M 0.000 description 1
- JIKVETCBELSHNU-UHFFFAOYSA-M silver;3-oxobutanoate Chemical compound [Ag+].CC(=O)CC([O-])=O JIKVETCBELSHNU-UHFFFAOYSA-M 0.000 description 1
- VUVIFASYSFGOAK-UHFFFAOYSA-M silver;3-oxopentanoate Chemical compound [Ag+].CCC(=O)CC([O-])=O VUVIFASYSFGOAK-UHFFFAOYSA-M 0.000 description 1
- LAGFIZWAMNTAIN-UHFFFAOYSA-M silver;4-methyl-3-oxopentanoate Chemical compound [Ag+].CC(C)C(=O)CC([O-])=O LAGFIZWAMNTAIN-UHFFFAOYSA-M 0.000 description 1
- RQZVTOHLJOBKCW-UHFFFAOYSA-M silver;7,7-dimethyloctanoate Chemical compound [Ag+].CC(C)(C)CCCCCC([O-])=O RQZVTOHLJOBKCW-UHFFFAOYSA-M 0.000 description 1
- JKOCEVIXVMBKJA-UHFFFAOYSA-M silver;butanoate Chemical compound [Ag+].CCCC([O-])=O JKOCEVIXVMBKJA-UHFFFAOYSA-M 0.000 description 1
- OIZSSBDNMBMYFL-UHFFFAOYSA-M silver;decanoate Chemical compound [Ag+].CCCCCCCCCC([O-])=O OIZSSBDNMBMYFL-UHFFFAOYSA-M 0.000 description 1
- MNMYRUHURLPFQW-UHFFFAOYSA-M silver;dodecanoate Chemical compound [Ag+].CCCCCCCCCCCC([O-])=O MNMYRUHURLPFQW-UHFFFAOYSA-M 0.000 description 1
- FTNNQMMAOFBTNJ-UHFFFAOYSA-M silver;formate Chemical compound [Ag+].[O-]C=O FTNNQMMAOFBTNJ-UHFFFAOYSA-M 0.000 description 1
- LLISFGHXLYQOBX-UHFFFAOYSA-M silver;hexanoate Chemical compound [Ag+].CCCCCC([O-])=O LLISFGHXLYQOBX-UHFFFAOYSA-M 0.000 description 1
- ORYURPRSXLUCSS-UHFFFAOYSA-M silver;octadecanoate Chemical compound [Ag+].CCCCCCCCCCCCCCCCCC([O-])=O ORYURPRSXLUCSS-UHFFFAOYSA-M 0.000 description 1
- ZYPJJPHRTZPKKY-UHFFFAOYSA-M silver;octanoate Chemical compound [Ag+].CCCCCCCC([O-])=O ZYPJJPHRTZPKKY-UHFFFAOYSA-M 0.000 description 1
- RTTFYYVFBVGCFC-UHFFFAOYSA-M silver;oxaldehydate Chemical compound [Ag+].[O-]C(=O)C=O RTTFYYVFBVGCFC-UHFFFAOYSA-M 0.000 description 1
- CYLMOXYXYHNGHZ-UHFFFAOYSA-M silver;propanoate Chemical compound [Ag+].CCC([O-])=O CYLMOXYXYHNGHZ-UHFFFAOYSA-M 0.000 description 1
- 229940116411 terpineol Drugs 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000013008 thixotropic agent Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- PXXNTAGJWPJAGM-UHFFFAOYSA-N vertaline Natural products C1C2C=3C=C(OC)C(OC)=CC=3OC(C=C3)=CC=C3CCC(=O)OC1CC1N2CCCC1 PXXNTAGJWPJAGM-UHFFFAOYSA-N 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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Abstract
Description
配合例1
Silver acetylacetonate(Aldrich社製)0.502gを、jER1256(三菱化学株式会社製 フェノキシタイプのエポキシ樹脂)を25質量%溶解したブチルカルビトールアセテート(ジエチレングリコールモノブチルエーテルアセテート 株式会社ダイセル製)0.528gに溶解させ、その後、銀粒子としてAg Nano Flake N300@BCA(トクセン工業株式会社製扁平銀粒子N300(厚さ:30nm、D50=470nm、Ag含有量92.6質量%のブチルカルビトールアセテート分散ペースト))2.535gとよく混合し、分散ペーストとした。扁平銀粒子N300のD50は参考値として日機装株式会社製ナノトラックUPA−EX150(動的光散乱法)により測定し、球近似により粒径を求めたメジアン径である。
酢酸銀(和光純薬工業株式会社製)0.509gを、jER1256(三菱化学株式会社製)を25質量%溶解したブチルカルビトールアセテート(ジエチレングリコールモノブチルエーテルアセテート 株式会社ダイセル製)0.647gに乳鉢中でよく分散させ、その後、銀粒子としてAg Nano Flake N300@BCA(トクセン工業株式会社製、Ag含有量92.6質量%のブチルカルビトールアセテート分散ペースト)3.141gとよく混合し、分散ペーストとした。
エチルアセト酢酸銅(II)(STREM CHEMICALS社製)0.508gをブチルカルビトールアセテート(ジエチレングリコールモノブチルエーテルアセテート 株式会社ダイセル製)0.286gに溶解したものを、jER1256(三菱化学株式会社製)を25質量%溶解したブチルカルビトールアセテート(ジエチレングリコールモノブチルエーテルアセテート 株式会社ダイセル製)0.201gに溶解させ、その後、銅粒子として1030Y(三井金属鉱業株式会社製、球状、D50=385nm)0.894gとよく混合し、分散ペーストとした。1030YのD50も日機装株式会社製ナノトラックUPA−EX150(動的光散乱法)を用いて同様に求めた。
2−エチルヘキサン酸銅(II)(STREM CHEMICALS社製)0.918gをブチルカルビトールアセテート(ジエチレングリコールモノブチルエーテルアセテート 株式会社ダイセル製)0.349gに溶解したものを、jER1256(三菱化学株式会社製)を25質量%溶解したブチルカルビトールアセテート(ジエチレングリコールモノブチルエーテルアセテート 株式会社ダイセル製)0.364gに溶解させ、その後、銅粒子として1030Y(三井金属鉱業株式会社製)1.635gとよく混合し、分散ペーストとした。
オレイン酸銅(II)(和光純薬工業株式会社製)1.264gをブチルカルビトールアセテート(ジエチレングリコールモノブチルエーテルアセテート 株式会社ダイセル製)0.447gに溶解したものを、jER1256(三菱化学株式会社製)を25質量%溶解したブチルカルビトールアセテート(ジエチレングリコールモノブチルエーテルアセテート)0.259gに溶解させ、その後、銅粒子として1030Y(三井金属鉱業株式会社製)1.145gとよく混合し、分散ペーストとした。
Silver acetylacetonate(Aldrich社製)0.221gを、jER1256(三菱化学株式会社製)を25質量%溶解したブチルカルビトールアセテート(ジエチレングリコールモノブチルエーテルアセテート 株式会社ダイセル製)0.471gに溶解させ、その後、銀粒子としてAg Nano Flake N300@BCA(トクセン工業株式会社製、Ag含有量92.6質量%のブチルカルビトールアセテート分散ペースト)2.405gとよく混合し、分散ペーストとした。
Silver acetylacetonate(Aldrich社製)2.813gをブチルカルビトールアセテート(ジエチレングリコールモノブチルエーテルアセテート 株式会社ダイセル製)2.010gに溶解したものを、jER1256(三菱化学株式会社製)を25質量%溶解したブチルカルビトールアセテート(ジエチレングリコールモノブチルエーテルアセテート 株式会社ダイセル製)0.586gに溶解させ、その後、銀粒子としてAg Nano Flake N300@BCA(トクセン工業株式会社製、Ag含有量92.6質量%のブチルカルビトールアセテート分散ペースト)1.567gとよく混合し、分散ペーストとした。
酢酸銀(和光純薬工業株式会社製)2.016gと、ブチルカルビトールアセテート(ジエチレングリコールモノブチルエーテルアセテート 株式会社ダイセル製)2.066gと、jER1256(三菱化学株式会社製)を25質量%溶解したブチルカルビトールアセテート(ジエチレングリコールモノブチルエーテルアセテート 株式会社ダイセル製)0.274gとを乳鉢中でよく混合し、分散ペーストとした。
銀粒子としてAg Nano Flake N300@BCA(トクセン工業株式会社製、Ag含有量92.6質量%のブチルカルビトールアセテート分散ペースト)2.164gを、jER1256(三菱化学株式会社製)を25質量%溶解したブチルカルビトールアセテート(ジエチレングリコールモノブチルエーテルアセテート 株式会社ダイセル製)0.411gとをよく混合し、分散ペーストとした。
エチルアセト酢酸銅(II)(STREM CHEMICALS社製)0.503gをブチルカルビトールアセテート(ジエチレングリコールモノブチルエーテルアセテート 株式会社ダイセル製)0.512gに溶解したものを、jER1256(三菱化学株式会社製)を25質量%溶解したブチルカルビトールアセテート(ジエチレングリコールモノブチルエーテルアセテート 株式会社ダイセル製)0.021gと混合し、ほぼ溶解したものを分散ペーストとした。
銅粒子として1030Y(三井金属鉱業株式会社製)2.503gをブチルカルビトールアセテート(ジエチレングリコールモノブチルエーテルアセテート 株式会社ダイセル製)0.106gに分散したものを、jER1256(三菱化学株式会社製)を25質量%溶解したブチルカルビトールアセテート(ジエチレングリコールモノブチルエーテルアセテート 株式会社ダイセル製)0.501gとよく混合し、分散ペーストとした。
バーコーターを用いて、ポリイミド(PI)フィルム(カプトン(登録商標)100N、東レ・デュポン株式会社製)にベタ状(略10cm角)に塗布した。塗布後、HISPEC横型高温器HT−320N(楠本化成株式会社製)を用いて100℃−60分で溶剤を乾燥した。
NovaCentrix社製のキセノン照射装置Pulse Forge3300を使用して配合例1〜7及び比較配合例2,4の分散ペーストを塗布した実施例1〜7及び比較例1、2の基板の分散ペーストパターンにパルス光照射を行った。光焼成条件を表2に示した。
三菱化学株式会社製LORESTA(登録商標)−GP MCP−T610 4探針法表面抵抗率、体積抵抗率測定装置を使用して、形成された薄膜導電パターンの焼成後の体積抵抗率を測定した。結果を表2に示す。
新しい刃を付けたカッターナイフを用いて実施例1〜7及び比較例1,2の基板の塗膜(導電パターン)に1mm間隔で切込みを11本入れた後、90°向きを変えてさらに11本引いて100個の1mm角のマス目を形成した。カットした印刷面に付着するようにセロハン粘着テープをはりつけ、セロハン粘着テープ上を消しゴムでこすって塗膜にテープを付着させた。テープを付着させてから1〜2分後にテープの端を持って印刷面に直角に保ち、瞬間的にひきはがして、旧JIS K5400に従って図2に示す基準で判定した。結果を表2に示す。
ポリビニルピロリドンK−90(株式会社日本触媒製)(0.049g)、AgNO3(0.052g)及びFeCl3(0.04mg)を、2−メチル−1,3−プロパンジオール(12.5ml)に溶解させ、150℃で1時間加熱反応させた。得られた析出物を遠心分離により単離し、析出物を乾燥して目的の銀ナノワイヤ120mgを得た。この銀ナノワイヤの任意の100個をSEM(日立ハイテク株式会社製 FE−SEM S−5200)で観察したところ平均径は90nm、平均長さは40μmであった。銀ナノワイヤをエタノール48gに分散させ、銀濃度0.25質量%の分散液を得た。
オクタデシルアミン0.648g(2.4mmol)、グルコース0.007g(0.04mmol)及び塩化銅0.054g(0.4mmol)を水30mlに溶解させて、オイルバス温度120℃、24時間で反応させた。遠心分離器により生成したナノワイヤを沈降させ、水、ヘキサン及びイソプロパノールで順次洗浄し、銅ナノワイヤを得た。得られた銅ナノワイヤの任意の100個をSEM(日立ハイテク株式会社製 FE−SEM S−5200)で観察したところ、平均径は40nm、平均長さは50μmであった。
配合例8
Silver acetylacetonato(Aldrich社製)1.05gを、jER(登録商標)1256(三菱化学株式会社製 フェノキシタイプのエポキシ樹脂)を25質量%溶解させたブチルカルビトールアセテート(ジエチレングリコールモノブチルエーテルモノアセテート 株式会社ダイセル製)0.598gに溶解させ、その後、銀粒子としてN300@BCA(トクセン工業株式会社製扁平銀粒子N300(厚さ:30nm、D50=470nm)を92.6質量%含むブチルカルビトールアセテート分散ペースト)2.535g、銀ナノワイヤを含む前記分散液48.12gとをよく混合し、エバポレーターによりエタノールを留去して、分散ペーストとした。扁平銀粒子N300のD50は参考値として日機装株式会社製ナノトラックUPA−EX150(動的光散乱法)により測定し、球近似により粒径を求めたメジアン径である。
Claims (8)
- 導電パターン形成用組成物であって、
(A)炭素原子数が2〜18の有機カルボン酸の金属塩及び有機カルボン酸を配位子として含まない有機金属錯体から選択される少なくとも一種の金属化合物と、
(B)金属材料と、
(C)樹脂と、
(D)溶媒と、
を含み、
前記(A)炭素原子数が2〜18の有機カルボン酸の金属塩及び有機カルボン酸を配位子として含まない有機金属錯体から選択される少なくとも一種の金属化合物の総量の金属原子換算の質量と前記(B)金属材料の総金属質量との質量割合が、(A)炭素原子数が2〜18の有機カルボン酸の金属塩及び有機カルボン酸を配位子として含まない有機金属錯体から選択される少なくとも一種の金属化合物:(B)金属材料=80:20〜2:98であることを特徴とする導電パターン形成用組成物。 - 前記(B)金属材料が、(B1)金属粒子を含む、請求項1に記載の導電パターン形成用組成物。
- 前記(B)金属材料が、さらに(B2)金属ナノワイヤ及び/又は金属ナノチューブを含む、請求項2に記載の導電パターン形成用組成物。
- 前記(A)炭素原子数が2〜18の有機カルボン酸の金属塩及び有機カルボン酸を配位子として含まない有機金属錯体から選択される少なくとも一種の金属化合物、及び(B)金属材料を構成する金属が、銀、銅、ニッケル又はコバルトである、請求項1〜3のいずれかに記載の導電パターン形成用組成物。
- 前記(A)炭素原子数が2〜18の有機カルボン酸の金属塩及び有機カルボン酸を配位子として含まない有機金属錯体から選択される少なくとも一種の金属化合物が、炭素原子数が2〜18のアルカン酸の金属塩、α又はβ位にカルボニル基を持つカルボン酸金属塩、又はネオカルボン酸金属塩、1,3−ジケトン又はβ−ケトカルボン酸エステルとの金属錯体である、請求項1〜4のいずれかに記載の導電パターン形成用組成物。
- 前記(C)樹脂が、ポリ−N−ビニルピロリドン、ポリ−N−ビニルアセトアミド、常温で固形状のフェノキシタイプのエポキシ樹脂、セルロース、ポリエチレングリコール、ポリプロピレングリコール、ポリウレタンからなる少なくとも一種を含む請求項1〜5のいずれかに記載の導電パターン形成用組成物。
- 前記(D)溶媒が、エチレングリコール、プロピレングリコール、グリセリン、酢酸、蓚酸、ジエチレングリコールモノエチルエーテル、ジエチレングリコールモノブチルエーテル、ジエチレングリコールモノエチルエーテルモノアセテート(エチルカルビトールアセテート)、ジエチレングリコールモノブチルエーテルモノアセテート(ブチルカルビトールアセテート)、γ−ブチロラクトンからなる少なくとも一種を含む請求項1〜6のいずれかに記載の導電パターン形成用組成物。
- 請求項1から請求項7のいずれか一項に記載の導電パターン形成用組成物を準備し、
前記導電パターン形成用組成物に光照射又はマイクロ波照射を行う、
ことを特徴とする導電パターン形成方法。
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Publication number | Priority date | Publication date | Assignee | Title |
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JP2005229109A (ja) * | 2004-02-10 | 2005-08-25 | E I Du Pont De Nemours & Co | インクジェット印刷可能な厚膜インク組成物および方法 |
JP2008226727A (ja) * | 2007-03-14 | 2008-09-25 | Sumitomo Bakelite Co Ltd | 導電性ペースト |
JP2011210454A (ja) * | 2010-03-29 | 2011-10-20 | Shinshu Univ | 電気伝導体及びその形成方法 |
JP2012505966A (ja) * | 2008-10-17 | 2012-03-08 | エヌシーシー ナノ, エルエルシー | 低温基板上の薄膜を還元する方法 |
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US9578752B2 (en) | 2009-02-05 | 2017-02-21 | Lg Chem, Ltd. | Method of forming conductive pattern and substrate having conductive pattern manufactured by the same method |
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