JPWO2015025410A1 - 基板収納容器 - Google Patents
基板収納容器 Download PDFInfo
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- JPWO2015025410A1 JPWO2015025410A1 JP2015532658A JP2015532658A JPWO2015025410A1 JP WO2015025410 A1 JPWO2015025410 A1 JP WO2015025410A1 JP 2015532658 A JP2015532658 A JP 2015532658A JP 2015532658 A JP2015532658 A JP 2015532658A JP WO2015025410 A1 JPWO2015025410 A1 JP WO2015025410A1
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- 239000000758 substrate Substances 0.000 title claims abstract description 156
- 238000003860 storage Methods 0.000 title claims abstract description 100
- 230000002093 peripheral effect Effects 0.000 claims abstract description 23
- 239000004065 semiconductor Substances 0.000 claims abstract description 6
- 238000000034 method Methods 0.000 claims description 33
- -1 polybutylene terephthalate Polymers 0.000 claims description 27
- 238000000137 annealing Methods 0.000 claims description 25
- 229920001707 polybutylene terephthalate Polymers 0.000 claims description 20
- 239000004743 Polypropylene Substances 0.000 claims description 15
- 238000003795 desorption Methods 0.000 claims description 14
- 238000002290 gas chromatography-mass spectrometry Methods 0.000 claims description 14
- 229920006324 polyoxymethylene Polymers 0.000 claims description 14
- 229920001155 polypropylene Polymers 0.000 claims description 12
- 229930182556 Polyacetal Natural products 0.000 claims description 11
- 238000010438 heat treatment Methods 0.000 claims description 9
- 238000005520 cutting process Methods 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 5
- 235000012431 wafers Nutrition 0.000 description 11
- 239000007789 gas Substances 0.000 description 10
- 229920000515 polycarbonate Polymers 0.000 description 6
- 239000004417 polycarbonate Substances 0.000 description 6
- 238000012360 testing method Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- 230000029058 respiratory gaseous exchange Effects 0.000 description 3
- 239000011521 glass Substances 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 229920000106 Liquid crystal polymer Polymers 0.000 description 1
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 230000004308 accommodation Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 229920002725 thermoplastic elastomer Polymers 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67373—Closed carriers characterised by locking systems
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67389—Closed carriers characterised by atmosphere control
- H01L21/67393—Closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67386—Closed carriers characterised by the construction of the closed carrier
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D2585/00—Containers, packaging elements or packages specially adapted for particular articles or materials
- B65D2585/68—Containers, packaging elements or packages specially adapted for particular articles or materials for machines, engines, or vehicles in assembled or dismantled form
- B65D2585/86—Containers, packaging elements or packages specially adapted for particular articles or materials for machines, engines, or vehicles in assembled or dismantled form for electrical components
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Packaging Frangible Articles (AREA)
- Ceramic Engineering (AREA)
- Packages (AREA)
Abstract
Description
2 容器本体
3 蓋体
5 外装部品
21 容器本体開口部
22 奥壁
24 下壁
28 開口周縁部
31 蓋体外面
32 蓋体本体
221、241 外面
511A 一方の壁状部(一の外装部品壁部)
511B 他方の壁状部(他の外装部品壁部)
521 後壁(一の外装部品壁部)
522 底部識別部(他の外装部品壁部)
525A 平面状の部分(一の外装部品壁部)
525B 縁部壁部(他の外装部品壁部)
531 側壁(他の外装部品壁部)
531A 壁部(一の外装部品壁部)
551 回転部材平板部(一の外装部品壁部)
552 回転部材周縁壁(他の外装部品壁部)
561 長尺状部(一の外装部品壁部)
562 側板部(他の外装部品壁部)
571 側板部(一の外装部品壁部)
572 一端部側連結板(他の外装部品壁部)
573 他端部側連結板(他の外装部品壁部)
Claims (6)
- 半導体ウェーハからなる基板を収納して、全体が密閉された容器収容袋に収容された状態で輸送される基板収納容器であって、
複数の基板を収納可能な基板収納空間を形成する本体内面と、前記基板収納空間に連通する容器本体開口部が形成された開口周縁部と、を有する容器本体と、
蓋体内面と蓋体外面とを有する蓋体本体を備え、前記開口周縁部に対して着脱可能であり前記容器本体開口部を閉塞可能であり、前記容器本体開口部を閉塞しているときに、前記蓋体内面が前記本体内面と共に前記基板収納空間を形成する蓋体と、
前記本体内面以外の前記容器本体の部分、前記蓋体内面以外の前記蓋体本体の部分、のうちの少なくとも1つに装着された樹脂製の外装部品と、を備え、
前記外装部品には、アニール処理が施されている基板収納容器。 - 前記容器本体は、一端部に容器本体開口部が形成され他端部が閉塞された筒状の壁部であって、奥壁、上壁、下壁、及び一対の側壁を有し前記上壁の一端部、前記下壁の一端部、及び前記側壁の一端部によって前記容器本体開口部が形成された壁部を備え、
前記上壁の内面、前記下壁の内面、前記側壁の内面、及び前記奥壁の内面は、本体内面を構成し、
前記外装部品は、前記奥壁の外面、前記上壁の外面、前記下壁の外面、前記側壁の外面、及び、前記蓋体外面のうちの前記外装部品が装着される前記外面又は前記蓋体外面に沿った方向において、前記外装部品が装着される前記外面又は前記蓋体外面からはみ出さずに、前記外装部品が装着される前記外面又は前記蓋体外面の範囲に収まる大きさを有する請求項1に記載の基板収納容器。 - 前記外装部品は、一の外装部品壁部と、前記一の外装部品壁部に対して所定の角度で交差する位置関係を有して前記一の外装部品壁部に接続された他の外装部品壁部と、を有する請求項1又は請求項2に記載の基板収納容器。
- 前記外装部品は、ポリブチレンテレフタレート、ポリアセタール、ポリプロピレンのいずれかにより構成されている請求項1〜請求項3のいずれかに記載の基板収納容器。
- ポリブチレンテレフタレート又はポリアセタールにより構成されている前記アニール処理前の前記外装部品を、所定の寸法に裁断して加熱脱着GC−MS装置において100℃で1時間加熱してDHS法により得られるアウトガスの量と、ポリブチレンテレフタレート又はポリアセタールにより構成されている前記アニール処理後の前記外装部品を、前記所定の寸法に裁断して加熱脱着GC−MS装置において100℃で1時間加熱してDHS法により得られるアウトガスの量と、から得られる、前記外装部品の単位重量あたりのアウトガスの低減率の値は、20%以上である請求項1〜請求項4のいずれかに記載の基板収納容器。
- ポリプロピレンにより構成されている前記アニール処理前の前記外装部品を、所定の寸法に裁断して加熱脱着GC−MS装置において80℃で1時間加熱してDHS法により得られるアウトガスの量と、ポリプロピレンにより構成されている前記アニール処理後の前記外装部品を、前記所定の寸法に裁断して加熱脱着GC−MS装置において80℃で1時間加熱してDHS法により得られるアウトガスの量と、から得られる、前記外装部品の単位重量あたりのアウトガスの低減率の値は、20%以上である請求項1〜請求項4のいずれかに記載の基板収納容器。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2013/072471 WO2015025410A1 (ja) | 2013-08-22 | 2013-08-22 | 基板収納容器 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP6067123B2 JP6067123B2 (ja) | 2017-01-25 |
JPWO2015025410A1 true JPWO2015025410A1 (ja) | 2017-03-02 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015532658A Active JP6067123B2 (ja) | 2013-08-22 | 2013-08-22 | 基板収納容器 |
Country Status (5)
Country | Link |
---|---|
US (1) | US10580674B2 (ja) |
JP (1) | JP6067123B2 (ja) |
KR (1) | KR102154303B1 (ja) |
TW (1) | TWI616385B (ja) |
WO (1) | WO2015025410A1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2016163166A1 (ja) * | 2015-04-10 | 2016-10-13 | 信越ポリマー株式会社 | 基板収納容器 |
KR20180098448A (ko) | 2017-02-24 | 2018-09-04 | 삼성전자주식회사 | 잔류 가스 제거 장치 및 이를 포함하는 기판 처리 설비 |
WO2020122261A2 (ja) * | 2020-03-31 | 2020-06-18 | ミライアル株式会社 | 基板収納容器 |
TWI822366B (zh) * | 2022-09-28 | 2023-11-11 | 家登精密工業股份有限公司 | 鎖附導正結構 |
Family Cites Families (30)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH06275709A (ja) | 1993-03-18 | 1994-09-30 | Hitachi Ltd | 精密物品収納容器 |
KR0136331Y1 (ko) * | 1996-01-24 | 1999-03-20 | 김광호 | 반도체 웨이퍼박스 포장구조 |
JP3312725B2 (ja) | 1997-06-09 | 2002-08-12 | 三菱マテリアルシリコン株式会社 | ウェーハケース |
JP3506208B2 (ja) | 1998-02-20 | 2004-03-15 | 三菱住友シリコン株式会社 | ウェーハケース |
US6871741B2 (en) * | 1998-05-28 | 2005-03-29 | Entegris, Inc. | Composite substrate carrier |
JP3370279B2 (ja) * | 1998-07-07 | 2003-01-27 | 信越ポリマー株式会社 | 精密基板収納容器 |
JP3556480B2 (ja) * | 1998-08-17 | 2004-08-18 | 信越ポリマー株式会社 | 精密基板収納容器 |
JP2000068363A (ja) | 1998-08-26 | 2000-03-03 | Kakizaki Mamufacuturing Co Ltd | 薄板収納・輸送容器 |
JP3556519B2 (ja) * | 1999-04-30 | 2004-08-18 | 信越ポリマー株式会社 | 基板収納容器の識別構造及び基板収納容器の識別方法 |
JP3874230B2 (ja) | 1999-07-22 | 2007-01-31 | 株式会社Sumco | ウェーハケース |
TWI259501B (en) * | 2000-12-07 | 2006-08-01 | Shinetsu Polymer Co | Seal and substrate container using same |
JP3944699B2 (ja) * | 2001-11-06 | 2007-07-11 | 信越化学工業株式会社 | 基板収納容器 |
US20040074808A1 (en) * | 2002-07-05 | 2004-04-22 | Entegris, Inc. | Fire retardant wafer carrier |
JP4282369B2 (ja) | 2003-05-15 | 2009-06-17 | 信越ポリマー株式会社 | 精密基板収納容器 |
JP4567956B2 (ja) * | 2003-08-05 | 2010-10-27 | 信越化学工業株式会社 | 基板収納ケース |
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JP4457950B2 (ja) * | 2005-04-15 | 2010-04-28 | 信越半導体株式会社 | 半導体ウェーハ収納容器用材料の評価方法および評価用容器ならびに樹脂材料の評価方法 |
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JP5025962B2 (ja) | 2006-02-15 | 2012-09-12 | ミライアル株式会社 | 薄板収納容器 |
EP2272088B1 (en) * | 2008-03-13 | 2016-12-07 | Entegris, Inc. | Wafer container with tubular environmental control components |
CN102017118B (zh) * | 2008-04-25 | 2013-03-06 | 信越聚合物株式会社 | 保持器及包括保持器的基板收纳容器 |
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JP5715898B2 (ja) | 2011-07-06 | 2015-05-13 | ミライアル株式会社 | 基板収納容器 |
EP2742526A4 (en) | 2011-08-12 | 2015-01-14 | Entegris Inc | TRENCH BEARER |
-
2013
- 2013-08-22 WO PCT/JP2013/072471 patent/WO2015025410A1/ja active Application Filing
- 2013-08-22 JP JP2015532658A patent/JP6067123B2/ja active Active
- 2013-08-22 US US14/912,845 patent/US10580674B2/en active Active
- 2013-08-22 KR KR1020157036414A patent/KR102154303B1/ko active IP Right Grant
-
2014
- 2014-08-11 TW TW103127425A patent/TWI616385B/zh active
Also Published As
Publication number | Publication date |
---|---|
US10580674B2 (en) | 2020-03-03 |
KR20160045637A (ko) | 2016-04-27 |
WO2015025410A1 (ja) | 2015-02-26 |
US20160204011A1 (en) | 2016-07-14 |
TWI616385B (zh) | 2018-03-01 |
TW201518188A (zh) | 2015-05-16 |
KR102154303B1 (ko) | 2020-09-09 |
JP6067123B2 (ja) | 2017-01-25 |
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