JPWO2014030382A1 - 成膜方法 - Google Patents

成膜方法 Download PDF

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Publication number
JPWO2014030382A1
JPWO2014030382A1 JP2014531517A JP2014531517A JPWO2014030382A1 JP WO2014030382 A1 JPWO2014030382 A1 JP WO2014030382A1 JP 2014531517 A JP2014531517 A JP 2014531517A JP 2014531517 A JP2014531517 A JP 2014531517A JP WO2014030382 A1 JPWO2014030382 A1 JP WO2014030382A1
Authority
JP
Japan
Prior art keywords
film
layer
chamber
vapor deposition
film thickness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2014531517A
Other languages
English (en)
Japanese (ja)
Inventor
吉田　隆
吉田　　隆
松本　昌弘
昌弘 松本
谷　典明
典明 谷
進 池田
進 池田
昌司 久保
昌司 久保
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ulvac Inc
Original Assignee
Ulvac Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ulvac Inc filed Critical Ulvac Inc
Publication of JPWO2014030382A1 publication Critical patent/JPWO2014030382A1/ja
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • C23C14/542—Controlling the film thickness or evaporation rate
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12—Organic material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/60—Deposition of organic layers from vapour phase
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/24—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3471—Introduction of auxiliary energy into the plasma
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • C23C14/542—Controlling the film thickness or evaporation rate
    • C23C14/545—Controlling the film thickness or evaporation rate using measurement on deposited material
    • C23C14/547—Controlling the film thickness or evaporation rate using measurement on deposited material using optical methods
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physical Vapour Deposition (AREA)
  • Plasma & Fusion (AREA)
  • General Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Human Computer Interaction (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
JP2014531517A 2012-08-24 2013-04-04 成膜方法 Pending JPWO2014030382A1 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012185443 2012-08-24
JP2012185443 2012-08-24
PCT/JP2013/060318 WO2014030382A1 (ja) 2012-08-24 2013-04-04 成膜方法

Publications (1)

Publication Number Publication Date
JPWO2014030382A1 true JPWO2014030382A1 (ja) 2016-07-28

Family

ID=50149702

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014531517A Pending JPWO2014030382A1 (ja) 2012-08-24 2013-04-04 成膜方法

Country Status (5)

Country Link
JP (1) JPWO2014030382A1 (zh)
KR (1) KR20150003302A (zh)
CN (1) CN104271796B (zh)
TW (1) TW201408800A (zh)
WO (1) WO2014030382A1 (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106367723A (zh) * 2016-08-31 2017-02-01 广东欧珀移动通信有限公司 工件、电子设备及真空溅射镀膜方法
CN110029311B (zh) * 2019-03-29 2022-03-18 新冶高科技集团有限公司 一种蒸镀装置及方法
CN111445489B (zh) * 2019-11-18 2020-10-13 北京邮电大学 一种离子束入射角度确定方法及装置
CN111921280B (zh) * 2020-06-29 2022-04-08 安徽世倾环保科技有限公司 中小型燃煤锅炉烟气净化用滤袋的制备方法

Citations (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61119668A (ja) * 1984-11-16 1986-06-06 Seiko Instr & Electronics Ltd 亜鉛合金製携帯時計ケ−スの製造方法
JPH04249146A (ja) * 1991-02-05 1992-09-04 Matsushita Electric Ind Co Ltd 撥水撥油防汚性被膜及びその製造方法
JPH09263934A (ja) * 1996-03-29 1997-10-07 Toppan Printing Co Ltd 膜形成方法及びその装置
US5955139A (en) * 1995-05-03 1999-09-21 Sony Corporation Automatic film deposition control
JP2000082337A (ja) * 1998-09-07 2000-03-21 Toyobo Co Ltd 透明導電性フィルム、透明タッチパネルおよび液晶表示素子
JP2001181850A (ja) * 1999-12-17 2001-07-03 Sekisui Chem Co Ltd 常圧プラズマを用いた連続成膜法
JP2002050230A (ja) * 2000-08-03 2002-02-15 Toyobo Co Ltd 透明導電性フィルム、透明導電性シートおよびタッチパネル
JP2005200699A (ja) * 2004-01-15 2005-07-28 Fuji Electric Advanced Technology Co Ltd 透明電極薄膜の製造方法
JP2005336521A (ja) * 2004-05-25 2005-12-08 Konica Minolta Holdings Inc 薄膜形成装置及び薄膜形成方法
WO2006090448A1 (ja) * 2005-02-23 2006-08-31 Jsr Corporation 透明導電性積層体の製造方法およびタッチパネル
JP2007211311A (ja) * 2006-02-10 2007-08-23 Shincron:Kk 薄膜形成装置および薄膜形成方法
JP2007308728A (ja) * 2006-05-16 2007-11-29 Bridgestone Corp 結晶性薄膜の成膜方法
JP2010053447A (ja) * 2008-07-31 2010-03-11 Sumitomo Metal Mining Co Ltd 成膜方法及び成膜装置
JP2011171723A (ja) * 2010-01-20 2011-09-01 Semiconductor Energy Lab Co Ltd 信号処理回路、及び信号処理回路の駆動方法
JP2012031494A (ja) * 2010-08-02 2012-02-16 Ulvac Japan Ltd 成膜方法及び成膜装置
WO2012060338A1 (ja) * 2010-11-05 2012-05-10 株式会社アルバック 積層体
JP2012131194A (ja) * 2010-12-24 2012-07-12 Konica Minolta Holdings Inc ガスバリア性フィルム

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE60128508D1 (de) * 2000-03-28 2007-07-05 Toyo Boseki Transparenter leitender Film, transparentes leitendes Blatt und berührungsempfindliche Tafel

Patent Citations (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61119668A (ja) * 1984-11-16 1986-06-06 Seiko Instr & Electronics Ltd 亜鉛合金製携帯時計ケ−スの製造方法
JPH04249146A (ja) * 1991-02-05 1992-09-04 Matsushita Electric Ind Co Ltd 撥水撥油防汚性被膜及びその製造方法
US5955139A (en) * 1995-05-03 1999-09-21 Sony Corporation Automatic film deposition control
JPH09263934A (ja) * 1996-03-29 1997-10-07 Toppan Printing Co Ltd 膜形成方法及びその装置
JP2000082337A (ja) * 1998-09-07 2000-03-21 Toyobo Co Ltd 透明導電性フィルム、透明タッチパネルおよび液晶表示素子
JP2001181850A (ja) * 1999-12-17 2001-07-03 Sekisui Chem Co Ltd 常圧プラズマを用いた連続成膜法
JP2002050230A (ja) * 2000-08-03 2002-02-15 Toyobo Co Ltd 透明導電性フィルム、透明導電性シートおよびタッチパネル
JP2005200699A (ja) * 2004-01-15 2005-07-28 Fuji Electric Advanced Technology Co Ltd 透明電極薄膜の製造方法
JP2005336521A (ja) * 2004-05-25 2005-12-08 Konica Minolta Holdings Inc 薄膜形成装置及び薄膜形成方法
WO2006090448A1 (ja) * 2005-02-23 2006-08-31 Jsr Corporation 透明導電性積層体の製造方法およびタッチパネル
JP2007211311A (ja) * 2006-02-10 2007-08-23 Shincron:Kk 薄膜形成装置および薄膜形成方法
JP2007308728A (ja) * 2006-05-16 2007-11-29 Bridgestone Corp 結晶性薄膜の成膜方法
JP2010053447A (ja) * 2008-07-31 2010-03-11 Sumitomo Metal Mining Co Ltd 成膜方法及び成膜装置
JP2011171723A (ja) * 2010-01-20 2011-09-01 Semiconductor Energy Lab Co Ltd 信号処理回路、及び信号処理回路の駆動方法
JP2012031494A (ja) * 2010-08-02 2012-02-16 Ulvac Japan Ltd 成膜方法及び成膜装置
WO2012060338A1 (ja) * 2010-11-05 2012-05-10 株式会社アルバック 積層体
JP2012131194A (ja) * 2010-12-24 2012-07-12 Konica Minolta Holdings Inc ガスバリア性フィルム

Also Published As

Publication number Publication date
CN104271796B (zh) 2016-03-30
CN104271796A (zh) 2015-01-07
TW201408800A (zh) 2014-03-01
WO2014030382A1 (ja) 2014-02-27
KR20150003302A (ko) 2015-01-08

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Effective date: 20160426