JPWO2013157231A1 - X線平面検出器の製造方法およびx線平面検出器用tftアレイ基板 - Google Patents
X線平面検出器の製造方法およびx線平面検出器用tftアレイ基板 Download PDFInfo
- Publication number
- JPWO2013157231A1 JPWO2013157231A1 JP2014511099A JP2014511099A JPWO2013157231A1 JP WO2013157231 A1 JPWO2013157231 A1 JP WO2013157231A1 JP 2014511099 A JP2014511099 A JP 2014511099A JP 2014511099 A JP2014511099 A JP 2014511099A JP WO2013157231 A1 JPWO2013157231 A1 JP WO2013157231A1
- Authority
- JP
- Japan
- Prior art keywords
- flat panel
- signal line
- panel detector
- ray flat
- common wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 43
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 23
- 238000007689 inspection Methods 0.000 claims abstract description 27
- 239000010409 thin film Substances 0.000 claims abstract description 21
- 239000010408 film Substances 0.000 claims description 41
- 238000006243 chemical reaction Methods 0.000 claims description 26
- 238000000034 method Methods 0.000 claims description 22
- 230000001681 protective effect Effects 0.000 claims description 19
- 239000003990 capacitor Substances 0.000 claims description 18
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 14
- 230000003321 amplification Effects 0.000 claims description 2
- 238000003199 nucleic acid amplification method Methods 0.000 claims description 2
- 238000005070 sampling Methods 0.000 description 37
- 229910021417 amorphous silicon Inorganic materials 0.000 description 17
- 239000010410 layer Substances 0.000 description 16
- 238000010586 diagram Methods 0.000 description 12
- 239000011521 glass Substances 0.000 description 10
- 230000002829 reductive effect Effects 0.000 description 9
- 230000002950 deficient Effects 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 239000000523 sample Substances 0.000 description 4
- 230000010354 integration Effects 0.000 description 3
- 239000011241 protective layer Substances 0.000 description 3
- 230000002441 reversible effect Effects 0.000 description 3
- 229910004205 SiNX Inorganic materials 0.000 description 2
- 229910010413 TiO 2 Inorganic materials 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- GGCZERPQGJTIQP-UHFFFAOYSA-N sodium;9,10-dioxoanthracene-2-sulfonic acid Chemical compound [Na+].C1=CC=C2C(=O)C3=CC(S(=O)(=O)O)=CC=C3C(=O)C2=C1 GGCZERPQGJTIQP-UHFFFAOYSA-N 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 238000003491 array Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 210000004072 lung Anatomy 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000036961 partial effect Effects 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/14—Measuring as part of the manufacturing process for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
- H01L27/14687—Wafer level processing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14632—Wafer-level processed structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/0203—Particular design considerations for integrated circuits
- H01L27/0248—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14643—Photodiode arrays; MOS imagers
- H01L27/14658—X-ray, gamma-ray or corpuscular radiation imagers
- H01L27/14663—Indirect radiation imagers, e.g. using luminescent members
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/08—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors
- H01L31/10—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors characterised by potential barriers, e.g. phototransistors
- H01L31/115—Devices sensitive to very short wavelength, e.g. X-rays, gamma-rays or corpuscular radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14665—Imagers using a photoconductor layer
- H01L27/14676—X-ray, gamma-ray or corpuscular radiation imagers
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Measurement Of Radiation (AREA)
- Apparatus For Radiation Diagnosis (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Semiconductor Integrated Circuits (AREA)
Abstract
Description
図1は、第1実施形態によるX線平面検出器の模式的斜視図である。図2は、本実施形態によるX線平面検出器の回路図である。図3は、本実施形態によるTFTアレイの一部拡大断面図である。図4は、本実施形態によるX線平面検出器の増幅回路の回路図である。
図6は、第2実施形態によるX線平面検出器用TFTアレイ基板の模式的回路図である。
図7は、第3実施形態によるX線平面検出器用TFTアレイ基板の模式的回路図である。
図8は、第4実施形態によるX線平面検出器用TFTアレイ基板の模式的回路図である。
本発明のいくつかの実施形態を説明したが、これらの実施形態は、例として提示したものであり、発明の範囲を限定することは意図していない。これら新規な実施形態は、その他の様々な形態で実施されることが可能であり、発明の要旨を逸脱しない範囲で、種々の省略、置き換え、変更を行うことができる。これら実施形態やその変形は、発明の範囲や要旨に含まれるとともに、特許請求の範囲に記載された発明とその均等の範囲に含まれる。
Claims (12)
- 絶縁基板と、前記絶縁基板の表面に薄膜トランジスタおよび光電変換膜を含み二次元配列された複数の画素と、前記複数の画素のそれぞれの行に対して設けられた走査線と、前記複数の画素のそれぞれの列に対して設けられた信号線と、前記走査線の端部に設けられた走査線接続パッドと、前記信号線の端部に設けられた信号線接続パッドと、前記複数の画素を囲む共通配線リングと、前記走査線および前記信号線と前記共通配線リングとの間のそれぞれに設けられた保護ダイオードと、前記信号線の同じ側の前記保護ダイオードと前記共通配線リングとの接続部と前記走査線の同じ側の前記保護ダイオードと前記共通配線リングとの接続部との間に接続された外部電圧印加パッドと、を有するX線平面検出器用TFTアレイ基板を製造するパネル製造工程と、
前記外部電圧印加用パッドに基準バイアス電圧を印加し、前記走査線接続パッドに前記薄膜トランジスタをONする信号を与えて前記信号線を流れる電気信号を前記信号線接続パッドから読み出して前記X線平面検出器用TFTアレイ基板を検査する検査工程と、
を具備することを特徴とするX線平面検出器の製造方法。 - 前記保護ダイオードは互いに極性が逆で並列接続された対として設けられていることを特徴とする請求項1に記載のX線平面検出器の製造方法。
- 前記基準バイアス電圧は前記検査工程で読み出す電気信号の増幅回路に与えるバイアス電圧と同じであることを特徴とする請求項1または請求項2に記載のX線平面検出器の製造方法。
- 前記外部電圧印加用パッドは、前記信号線の同じ側の前記保護ダイオードと前記共通配線リングとの接続部を挟んで両側に設けられていることを特徴とする請求項1ないし請求項3のいずれか1項に記載のX線平面検出器の製造方法。
- 前記外部電圧印加用パッドは、前記信号線の両側の前記保護ダイオードと前記共通配線リングとのそれぞれの接続部の近傍に設けられていることを特徴とする請求項1ないし請求項4のいずれか1項に記載のX線平面検出器の製造方法。
- 前記共通配線リングの前記信号線の同じ側の前記保護ダイオードとの接続部分間の電気抵抗は、前記共通配線リングの前記信号線に接続された前記保護ダイオードとの接続部分と前記共通配線リングの前記走査線に接続された前記保護ダイオードとの接続部分との間の電気抵抗よりも小さいことを特徴とする請求項5に記載のX線平面検出器の製造方法。
- 前記外部電圧印加用パッドの近傍と前記信号線の反対側の前記保護ダイオードと前記共通配線リングとの接続部の近傍とを接続する前記共通配線リングよりも電気抵抗が小さい接続配線をさらに具備することを特徴とする請求項5または請求項6に記載のX線平面検出器の製造方法。
- 前記検査工程の後に前記画素を覆う蛍光体層を形成する蛍光体形成工程をさらに具備することを特徴とする請求項1ないし請求項7のいずれか1項に記載のX線平面検出器の製造方法。
- 前記X線平面検出器用TFTアレイ基板を前記信号線パッドおよび前記走査線パッドと前記共通配線リングとの間で切断して切り出すパネル切断工程をさらに具備することを特徴とする請求項1ないし請求項8のいずれか1項に記載のX線平面検出器の製造方法。
- 前記パネル切断工程の後に前記走査線接続パッドに前記TFTを駆動するゲート駆動回路を接続する工程と、
前記パネル切断工程の後に前記信号線接続パッドに前記キャパシタから電荷信号を読み出す信号読出回路を接続する工程と、
をさらに具備することを特徴とする請求項9に記載のX線平面検出器の製造方法。 - 絶縁基板と、
前記絶縁基板の表面に薄膜トランジスタおよび光電変換膜を含み二次元配列された複数の画素と、
前記複数の画素のそれぞれの行に対して設けられた走査線と、
前記複数の画素のそれぞれの列に対して設けられた信号線と、
前記走査線の端部に設けられた走査線接続パッドと、
前記信号線の端部に設けられた信号線接続パッドと、
前記複数の画素を囲む共通配線リングと、
前記走査線および前記信号線と前記共通配線リングとの間のそれぞれに設けられた保護ダイオードと、
前記信号線の同じ側の前記保護ダイオードと前記共通配線リングとの接続部と前記走査線の同じ側の前記保護ダイオードと前記共通配線リングとの接続部との間に接続された外部電圧印加パッドと、
を具備することを特徴とするX線平面検出器用TFTアレイ基板。 - 前記外部電圧印加用パッドの近傍と前記信号線の反対側の前記保護ダイオードと前記共通配線リングとの接続部の近傍とを接続する前記共通配線リングよりも電気抵抗が小さい接続配線をさらに具備することを特徴とする請求項11に記載のX線平面検出器用TFTアレイ基板。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012093989 | 2012-04-17 | ||
JP2012093989 | 2012-04-17 | ||
PCT/JP2013/002486 WO2013157231A1 (ja) | 2012-04-17 | 2013-04-11 | X線平面検出器の製造方法およびx線平面検出器用tftアレイ基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2013157231A1 true JPWO2013157231A1 (ja) | 2015-12-21 |
JP6017542B2 JP6017542B2 (ja) | 2016-11-02 |
Family
ID=49383204
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014511099A Active JP6017542B2 (ja) | 2012-04-17 | 2013-04-11 | X線平面検出器の製造方法、x線平面検出器用tftアレイ基板、およびx線平面検出器 |
Country Status (6)
Country | Link |
---|---|
US (1) | US9589855B2 (ja) |
JP (1) | JP6017542B2 (ja) |
KR (1) | KR101655004B1 (ja) |
CN (1) | CN104396017B (ja) |
TW (1) | TWI493215B (ja) |
WO (1) | WO2013157231A1 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6187320B2 (ja) * | 2014-03-03 | 2017-08-30 | 株式会社デンソー | 受光チップ |
WO2015166937A1 (ja) * | 2014-04-30 | 2015-11-05 | シャープ株式会社 | アクティブマトリクス基板及び当該アクティブマトリクス基板を備える表示装置 |
CN108507599B (zh) * | 2017-02-24 | 2021-05-14 | 奕瑞影像科技(太仓)有限公司 | 具有高兼容性的x射线传感器面板、x射线探测器 |
KR102466811B1 (ko) * | 2017-12-12 | 2022-11-11 | 엘지디스플레이 주식회사 | 플렉서블 디지털 엑스레이 검출기용 패널 및 그 제조 방법 |
JP6929267B2 (ja) * | 2018-12-26 | 2021-09-01 | キヤノン株式会社 | 撮像装置及び撮像システム |
KR20210070780A (ko) * | 2019-12-05 | 2021-06-15 | 엘지디스플레이 주식회사 | 디지털 엑스레이 검출기용 박막 트랜지스터 어레이 기판과 디지털 엑스레이 검출기 및 그 제조 방법 |
KR102678978B1 (ko) * | 2019-12-20 | 2024-06-26 | 엘지디스플레이 주식회사 | 디지털 엑스레이 검출기용 박막 트랜지스터 어레이 기판 및 이를 포함하는 디지털 엑스레이 검출기 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004303925A (ja) * | 2003-03-31 | 2004-10-28 | Canon Inc | 撮像用基板 |
JP2008305959A (ja) * | 2007-06-07 | 2008-12-18 | Fujifilm Corp | 放射線画像検出器の補修方法、画像処理方法、放射線画像検出器および画像処理装置 |
JP2009170768A (ja) * | 2008-01-18 | 2009-07-30 | Mitsubishi Electric Corp | フォトセンサーアレイ基板とフォトセンサー |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1316634C (zh) * | 2001-10-03 | 2007-05-16 | 株式会社东芝 | X光平面检测器 |
US7470942B2 (en) * | 2005-09-07 | 2008-12-30 | Chunghwa Picture Tube., Ltd. | Thin film transistor array and electrostatic discharge protective device thereof |
JP2007155564A (ja) | 2005-12-07 | 2007-06-21 | Acrorad Co Ltd | 放射線検出器および放射線画像検出装置 |
JP2009290171A (ja) | 2008-06-02 | 2009-12-10 | Epson Imaging Devices Corp | 固体撮像装置 |
JP5774806B2 (ja) | 2008-08-11 | 2015-09-09 | コニカミノルタ株式会社 | 放射線検出パネルの製造方法および放射線画像検出器の製造方法 |
-
2013
- 2013-04-11 KR KR1020147031238A patent/KR101655004B1/ko active IP Right Grant
- 2013-04-11 WO PCT/JP2013/002486 patent/WO2013157231A1/ja active Application Filing
- 2013-04-11 JP JP2014511099A patent/JP6017542B2/ja active Active
- 2013-04-11 CN CN201380031789.0A patent/CN104396017B/zh active Active
- 2013-04-17 TW TW102113701A patent/TWI493215B/zh active
-
2014
- 2014-10-17 US US14/517,182 patent/US9589855B2/en active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004303925A (ja) * | 2003-03-31 | 2004-10-28 | Canon Inc | 撮像用基板 |
JP2008305959A (ja) * | 2007-06-07 | 2008-12-18 | Fujifilm Corp | 放射線画像検出器の補修方法、画像処理方法、放射線画像検出器および画像処理装置 |
JP2009170768A (ja) * | 2008-01-18 | 2009-07-30 | Mitsubishi Electric Corp | フォトセンサーアレイ基板とフォトセンサー |
Also Published As
Publication number | Publication date |
---|---|
US9589855B2 (en) | 2017-03-07 |
CN104396017A (zh) | 2015-03-04 |
TW201350895A (zh) | 2013-12-16 |
CN104396017B (zh) | 2018-08-24 |
JP6017542B2 (ja) | 2016-11-02 |
US20150028338A1 (en) | 2015-01-29 |
KR101655004B1 (ko) | 2016-09-06 |
KR20150005593A (ko) | 2015-01-14 |
TWI493215B (zh) | 2015-07-21 |
WO2013157231A1 (ja) | 2013-10-24 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6017542B2 (ja) | X線平面検出器の製造方法、x線平面検出器用tftアレイ基板、およびx線平面検出器 | |
JP5043373B2 (ja) | 変換装置、放射線検出装置、及び放射線検出システム | |
JP5043374B2 (ja) | 変換装置、放射線検出装置、及び放射線検出システム | |
JP5043380B2 (ja) | 放射線検出装置および放射線検出システム | |
US8067743B2 (en) | Imaging apparatus and radiation imaging apparatus | |
JP4100739B2 (ja) | 光電変換装置 | |
JP4498283B2 (ja) | 撮像装置、放射線撮像装置及びこれらの製造方法 | |
EP1420453B1 (en) | Image pickup apparatus, radiation image pickup apparatus and radiation image pickup system | |
JP4908947B2 (ja) | 変換装置、放射線検出装置、及び放射線検出システム | |
JP5709810B2 (ja) | 検出装置の製造方法、その検出装置及び検出システム | |
JP6132283B2 (ja) | 増幅回路および増幅回路を用いたイメージセンサ | |
JP2016220116A (ja) | 放射線撮像装置及び放射線撮像システム | |
JP5013754B2 (ja) | 電磁波検出装置、放射線検出装置、放射線検出システム及びレーザ加工方法 | |
JP2013235934A (ja) | 検出装置、検出システム、及び、検出装置の製造方法 | |
US8916833B2 (en) | Imaging device and imaging display system | |
JP5700973B2 (ja) | 検出装置及び放射線検出システム | |
JP2004179645A (ja) | 撮像装置、放射線撮像装置及び放射線撮像システム | |
JP6530600B2 (ja) | 放射線検出装置及び放射線検出システム | |
JP6470508B2 (ja) | 放射線撮像装置および放射線撮像システム | |
JP2018117248A (ja) | 放射線撮像装置及び放射線撮像システム | |
JP2014225527A (ja) | 検出装置、及び、検出システム | |
US9093347B2 (en) | Detecting apparatus and detecting system | |
KR20170080199A (ko) | 엑스레이 검출기용 어레이기판 및 이를 포함하는 엑스레이 검출기 | |
JP4314255B2 (ja) | 変換装置およびx線検出システム | |
CN100502021C (zh) | 电磁辐射检测设备、辐射检测设备和系统及激光处理方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AA64 | Notification of invalidation of claim of internal priority (with term) |
Free format text: JAPANESE INTERMEDIATE CODE: A241764 Effective date: 20141219 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20150109 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A821 Effective date: 20150113 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20150407 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20150407 |
|
A711 | Notification of change in applicant |
Free format text: JAPANESE INTERMEDIATE CODE: A711 Effective date: 20160317 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A821 Effective date: 20160323 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20160531 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20160725 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20160830 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20160928 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6017542 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
S533 | Written request for registration of change of name |
Free format text: JAPANESE INTERMEDIATE CODE: R313533 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |