JPWO2013069729A1 - 半導体素子及びその製造方法 - Google Patents
半導体素子及びその製造方法 Download PDFInfo
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 37
- 239000004065 semiconductor Substances 0.000 title claims abstract description 37
- 229910005191 Ga 2 O 3 Inorganic materials 0.000 claims abstract description 141
- 239000013078 crystal Substances 0.000 claims abstract description 90
- 239000000758 substrate Substances 0.000 claims abstract description 84
- 238000001312 dry etching Methods 0.000 claims abstract description 21
- 239000007789 gas Substances 0.000 claims description 22
- 229910052751 metal Inorganic materials 0.000 claims description 21
- 239000002184 metal Substances 0.000 claims description 21
- 238000000034 method Methods 0.000 claims description 14
- 238000001020 plasma etching Methods 0.000 claims description 12
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 7
- 229910052760 oxygen Inorganic materials 0.000 claims description 7
- 239000001301 oxygen Substances 0.000 claims description 7
- 230000002950 deficient Effects 0.000 claims description 5
- 239000012535 impurity Substances 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 56
- 239000002019 doping agent Substances 0.000 description 7
- 229910052748 manganese Inorganic materials 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- 229910052719 titanium Inorganic materials 0.000 description 5
- 230000004075 alteration Effects 0.000 description 4
- 229910052787 antimony Inorganic materials 0.000 description 4
- 229910052785 arsenic Inorganic materials 0.000 description 4
- 229910052797 bismuth Inorganic materials 0.000 description 4
- 229910052799 carbon Inorganic materials 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 229910052735 hafnium Inorganic materials 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 229910052741 iridium Inorganic materials 0.000 description 4
- 229910052750 molybdenum Inorganic materials 0.000 description 4
- 229910052758 niobium Inorganic materials 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 229910052703 rhodium Inorganic materials 0.000 description 4
- 229910052707 ruthenium Inorganic materials 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 229910052715 tantalum Inorganic materials 0.000 description 4
- 229910052718 tin Inorganic materials 0.000 description 4
- 229910052721 tungsten Inorganic materials 0.000 description 4
- 229910052720 vanadium Inorganic materials 0.000 description 4
- 229910052726 zirconium Inorganic materials 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 125000004429 atom Chemical group 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 125000004430 oxygen atom Chemical group O* 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 206010021143 Hypoxia Diseases 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 229910052790 beryllium Inorganic materials 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- 229910052792 caesium Inorganic materials 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- AJNVQOSZGJRYEI-UHFFFAOYSA-N digallium;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Ga+3].[Ga+3] AJNVQOSZGJRYEI-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 229910052730 francium Inorganic materials 0.000 description 1
- 229910001195 gallium oxide Inorganic materials 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000012495 reaction gas Substances 0.000 description 1
- 229910052701 rubidium Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 229910052712 strontium Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
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- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
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Abstract
一実施の形態として、Ga2O3系基板11の表面にドライエッチングを施し、変質領域12を形成する工程と、変質領域12上に、変質領域12とオーミック接合するカソード電極14を形成する工程と、を含む半導体素子の製造方法を提供する。
Description
前記変質領域上に、前記変質領域とオーミック接合する金属電極を形成する工程と、
を含む半導体素子の製造方法。
第1の実施の形態では、半導体素子としてのショットキーバリアダイオード(SBD)について説明する。
図1は、第1の実施の形態に係るSBDの断面図である。SBD10は、Ga2O3系基板11と、Ga2O3系基板11の上面(図1の上側の面)に形成された変質領域12と、Ga2O3系基板11の下面(図1の下側の面)に形成されたGa2O3系単結晶層13と、Ga2O3系基板11の変質領域12上に形成されたカソード電極14と、Ga2O3系単結晶層13のGa2O3系基板11と反対側の面上に形成されたアノード電極15と、を含む。
以下に、本実施の形態のSBD10の製造方法の一例を示す。
第2の実施の形態は、変質領域がGa2O3系基板上のGa2O3系単結晶層に形成される点において、第1の実施の形態と異なる。なお、第1の実施の形態と同様の点については、説明を省略又は簡略化する。
図3は、第2の実施の形態に係るSBDの断面図である。SBD20は、Ga2O3系基板11と、Ga2O3系基板11の上面(図3の上側の面)に形成されたGa2O3系単結晶層26と、Ga2O3系単結晶層26の上面(図3の上側の面)に形成された変質領域22と、Ga2O3系基板11の下面(図1の下側の面)に形成されたGa2O3系単結晶層13と、Ga2O3系単結晶層26の変質領域22上に形成されたカソード電極14と、Ga2O3系単結晶層13のGa2O3系基板11と反対側の面上に形成されたアノード電極15と、を含む。
以下に、本実施の形態のSBD20の製造方法の一例を示す。
第3の実施の形態は、半導体素子としてのMESFET(Metal Semiconductor Field Effect Transistor)について説明する。なお、第1の実施の形態と同様の点については、説明を省略又は簡略化する。
図5は、第3の実施の形態に係るMESFETの断面図である。MESFET40は、Ga2O3系基板31と、Ga2O3系基板31の上面(図5の上側の面)に形成されたGa2O3系単結晶層46と、Ga2O3系単結晶層46の上面に形成された変質領域42a、42bと、変質領域42a、42bの上面にそれぞれ形成されたソース電極33a及びドレイン電極33bと、Ga2O3系単結晶層46の上面の変質領域42a、42bが形成されない領域上のソース電極33aとドレイン電極33bの間のゲート電極34と、を含む。
以下に、本実施の形態のMESFET40の製造方法の一例を示す。
本実施の形態によれば、Ga2O3系基板やGa2O3系基板上のGa2O3系単結晶層の表面にドライエッチングにより変質領域を形成することにより、金属電極を低抵抗でオーミック接合させることができる。それによって、動作性能に優れた半導体素子を形成することができる。
Claims (10)
- Ga2O3系単結晶の表面にドライエッチングを施し、変質領域を形成する工程と、
前記変質領域上に、前記変質領域とオーミック接合する金属電極を形成する工程と、
を含む半導体素子の製造方法。 - 前記ドライエッチングは反応性イオンエッチングである、
請求項1に記載の半導体素子の製造方法。 - 前記ドライエッチングはBCl3を含むガスを用いて実施される、
請求項2に記載の半導体素子の製造方法。 - 前記基板の前記表面の一部に前記ドライエッチングを施し、前記変質領域を形成する、
請求項1〜3のいずれか1項に記載の半導体素子の製造方法。 - Ga2O3系単結晶からなる基板と、
前記基板の第1の面、又は前記第1の面上のGa2O3系単結晶からなる第1の結晶層の前記基板と反対側の面にドライエッチングにより形成された変質領域と、
前記変質領域上に形成され、前記変質領域とオーミック接合する金属電極と、
を含む半導体素子。 - 前記変質領域は、酸素が欠損した領域である、
請求項5に記載の半導体素子。 - 前記基板の前記第1の面と反対側の第2の面、又は前記第2の面上のGa2O3系単結晶からなる第2の結晶層の前記基板と反対側の面上に形成されたアノード電極と、
を有し、
前記金属電極がカソード電極である、
請求項5又は6のいずれか一方に記載の半導体素子。 - 前記金属電極は、ソース電極、ドレイン電極、及び前記ソース電極と前記ドレイン電極の間のゲート電極である、
請求項5又は6のいずれか一方に記載の半導体素子。 - 前記変質領域は、前記基板又は前記第1の結晶層の一部に形成され、
前記変質領域の表面の高さは、前記基板又は前記第1の結晶層の前記変質領域の形成されていない領域の表面の高さよりも低い、
請求項5又は6のいずれか一方に記載の半導体素子。 - 前記第1の結晶層の前記変質領域が形成されない領域上のゲート電極を含み、
前記第1の結晶層は導電型不純物を含み、
前記金属電極は、前記ゲート電極の両側のソース電極及びドレイン電極である、
請求項9に記載の半導体素子。
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JP5907465B2 (ja) | 2014-08-29 | 2016-04-26 | 株式会社タムラ製作所 | 半導体素子及び結晶積層構造体 |
CN109478571B (zh) | 2016-07-26 | 2022-02-25 | 三菱电机株式会社 | 半导体装置及半导体装置的制造方法 |
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Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01307215A (ja) * | 1988-06-03 | 1989-12-12 | Sanyo Electric Co Ltd | 半導体の製造方法 |
JP2001110746A (ja) * | 1999-10-12 | 2001-04-20 | Matsushita Electric Ind Co Ltd | 炭化珪素への電極形成法および半導体素子 |
JP2009081468A (ja) * | 2009-01-19 | 2009-04-16 | Univ Waseda | Ga2O3系半導体素子及びGa2O3系半導体素子の製造方法 |
JP2009130013A (ja) * | 2007-11-21 | 2009-06-11 | Nippon Light Metal Co Ltd | 酸化ガリウム基板用電極の製造方法及びそれにより製造される酸化ガリウム基板用電極 |
JP2009260059A (ja) * | 2008-04-17 | 2009-11-05 | Nippon Light Metal Co Ltd | 紫外線センサの製造方法 |
JP2009302257A (ja) * | 2008-06-12 | 2009-12-24 | Nippon Light Metal Co Ltd | 酸化ガリウム単結晶基板用オーミック電極及びその製造方法 |
JP2010233406A (ja) * | 2009-03-27 | 2010-10-14 | Koha Co Ltd | スイッチング制御装置及びショットキーダイオード |
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Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01307215A (ja) * | 1988-06-03 | 1989-12-12 | Sanyo Electric Co Ltd | 半導体の製造方法 |
JP2001110746A (ja) * | 1999-10-12 | 2001-04-20 | Matsushita Electric Ind Co Ltd | 炭化珪素への電極形成法および半導体素子 |
JP2009130013A (ja) * | 2007-11-21 | 2009-06-11 | Nippon Light Metal Co Ltd | 酸化ガリウム基板用電極の製造方法及びそれにより製造される酸化ガリウム基板用電極 |
JP2009260059A (ja) * | 2008-04-17 | 2009-11-05 | Nippon Light Metal Co Ltd | 紫外線センサの製造方法 |
JP2009302257A (ja) * | 2008-06-12 | 2009-12-24 | Nippon Light Metal Co Ltd | 酸化ガリウム単結晶基板用オーミック電極及びその製造方法 |
JP2009081468A (ja) * | 2009-01-19 | 2009-04-16 | Univ Waseda | Ga2O3系半導体素子及びGa2O3系半導体素子の製造方法 |
JP2010233406A (ja) * | 2009-03-27 | 2010-10-14 | Koha Co Ltd | スイッチング制御装置及びショットキーダイオード |
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