JPWO2010064677A1 - 静電容量センサ - Google Patents
静電容量センサ Download PDFInfo
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- JPWO2010064677A1 JPWO2010064677A1 JP2010541345A JP2010541345A JPWO2010064677A1 JP WO2010064677 A1 JPWO2010064677 A1 JP WO2010064677A1 JP 2010541345 A JP2010541345 A JP 2010541345A JP 2010541345 A JP2010541345 A JP 2010541345A JP WO2010064677 A1 JPWO2010064677 A1 JP WO2010064677A1
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
- H03K17/94—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the way in which the control signals are generated
- H03K17/945—Proximity switches
- H03K17/955—Proximity switches using a capacitive detector
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01V—GEOPHYSICS; GRAVITATIONAL MEASUREMENTS; DETECTING MASSES OR OBJECTS; TAGS
- G01V3/00—Electric or magnetic prospecting or detecting; Measuring magnetic field characteristics of the earth, e.g. declination, deviation
- G01V3/08—Electric or magnetic prospecting or detecting; Measuring magnetic field characteristics of the earth, e.g. declination, deviation operating with magnetic or electric fields produced or modified by objects or geological structures or by detecting devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H36/00—Switches actuated by change of magnetic field or of electric field, e.g. by change of relative position of magnet and switch, by shielding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/66—Structural association with built-in electrical component
- H01R13/665—Structural association with built-in electrical component with built-in electronic circuit
- H01R13/6683—Structural association with built-in electrical component with built-in electronic circuit with built-in sensor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
- H01R12/65—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures characterised by the terminal
- H01R12/69—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures characterised by the terminal deformable terminals, e.g. crimping terminals
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
- H03K17/94—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the way in which the control signals are generated
- H03K17/96—Touch switches
- H03K2017/9602—Touch switches characterised by the type or shape of the sensing electrodes
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K2217/00—Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00
- H03K2217/94—Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00 characterised by the way in which the control signal is generated
- H03K2217/94084—Transmission of parameters among sensors or between sensor and remote station
- H03K2217/94094—Wired transmission, e.g. via bus connection or similar
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K2217/00—Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00
- H03K2217/94—Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00 characterised by the way in which the control signal is generated
- H03K2217/96—Touch switches
- H03K2217/9607—Capacitive touch switches
- H03K2217/960705—Safety of capacitive touch and proximity switches, e.g. increasing reliability, fail-safe
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/09318—Core having one signal plane and one power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/09354—Ground conductor along edge of main surface
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10189—Non-printed connector
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Remote Sensing (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Environmental & Geological Engineering (AREA)
- Geology (AREA)
- General Life Sciences & Earth Sciences (AREA)
- Geophysics (AREA)
- Seats For Vehicles (AREA)
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
100 静電容量センサ
110 センサ回路
10 電極部、基板、回路基板
11 端部
20 接続部
21 第1端子接続部、第1回路
23 第2端子接続部、第2回路
22,22a〜22e 第3端子接続部、第3回路
24 ダミー端子接続部、ダミー回路
25 第1ガード電極
27 第2ガード電極
26 26a〜26e センサ電極
28 28a〜28e 接続線
31,32 両面接続端子
41,42 電線
50 ホットメルトモールド
200 コネクタ
3 貫通穴
5 端子金具
5A 上板
5B 下板
6 バレル
9 コネクタハウジング
電極部10の一方主面側(表面側)には、ヘッドレストHの高さ方向に沿って並設された5つのセンサ電極26が形成されている。各センサ電極26は、それぞれが独立に静電容量を検知し、検知した各静電容量を検知回路110に出力する。
検知回路110は、取得した静電容量に基づく検知信号をECU60に出力する。なお、本例では5つのセンサ電極26を備える静電容量センサ100を例示するが、センサ電極26の数は限定されない。
基板10の一方主面側に設けられた第1端子接続部21及び第3端子接続部22a〜22eと、基板の他方主面側に設けられた第2端子接続部23及びダミー端子接続部24a〜24eとは、接続部20を構成する。
各端子接続部対P1〜P6が、一対の挟持板5A,5Bの間にそれぞれ配置されるように各端子金具5をセットし、一方の挟持板5Bから立設されたバレル6の先端を基板10に設けられた貫通穴3を通し、各端子金具5の一対の挟持板5A,5Bで各端子接続部対P1〜P6をそれぞれ挟み込んだ後、各端子金具5のバレル6を加締めることにより、各端子接続部対P1〜P6を挟持する一対の挟持板5A,5Bを、バレル6で基板両主面側から押圧して固定する。その結果、第1端子接続部21と第2端子接続部23との端子接続部対P6、及び第3端子接続部22とダミー端子接続部24との端子接続部対P1〜P5を含む接続部20は、一対の挟持板5A及び5Bで挟み込まれた状態で、各端子金具5に固定される。
以下、第2実施形態に係る回路導通構造について説明する。
図9(A)は、本実施の形態に係る回路基板の表面側を示した図であり、図9(B)は、本実施の形態に係る回路基板の裏面側を示した図である。
また、回路基板の裏面において、第2ガード電極27にその一端が接続された第2回路23の他端は、回路基板の端部11に延びている。
図10は、本実施の形態に係る回路基板のA矢視から見た拡大断面図である。
これは、一度に圧着接続する回路端対の数が多くなればなるほど接続作業工程数が減少する効果を発揮する。
図12は、多チャンネルの静電容量センサにおける回路基板を示す図である。
また、回路基板の裏面において、第2ガード電極にその一端が接続された3つの第2回路23a〜23cの他端は、回路基板の端部211に延びている。
図13は、多チャンネルの静電容量センサにおける回路基板のB矢視から見た拡大断面図である。
Claims (6)
- 基板と、
前記基板の一方主面に形成され、物体との間の静電容量を検知するセンサ電極と、
前記基板の一方主面の、前記センサ電極の近傍に形成された第1ガード電極と、
前記基板の他方主面に形成された第2ガード電極と、を備え、
前記第1ガード電極の第1端子接続部と前記第2ガード電極の第2端子接続部とが、対向する位置に設けられていることを特徴とする静電容量センサ。 - 請求項1に記載の静電容量センサにおいて、
前記基板の一方主面に形成された前記センサ電極の第3端子接続部と、
前記基板の他方主面の、前記第3接続端子と対向する位置に形成されたダミー端子接続部と、をさらに有し、
前記ダミー端子接続部が前記第2端子接続部と略同じ高さであることを特徴とする静電容量センサ。 - 請求項2に記載の静電容量センサにおいて、
前記第1端子接続部と前記第2端子接続部との対、及び前記第3端子接続部と前記ダミー端子接続部との対に、前記基板を両主面側から挟持する一対の挟持板を備える端子金具をそれぞれ取付けることを特徴とする静電容量センサ。 - 請求項2に記載の静電容量センサにおいて、
前記ダミー端子接続部は、前記第2端子接続部と同じ導電材料で形成されていることを特徴とする静電容量センサ。 - 請求項2に記載の静電容量センサにおいて、
対向する前記第3端子接続部と前記ダミー端子接続部の対を複数備え、前記各対が並列に配列されていることを特徴とする静電容量センサ。 - メンブレンからなる電極部を備えた静電容量センサであることを特徴とする請求項1に記載の静電容量センサ。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010541345A JP5161320B2 (ja) | 2008-12-04 | 2009-12-03 | 静電容量センサ |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008309408 | 2008-12-04 | ||
JP2008309408 | 2008-12-04 | ||
JP2010541345A JP5161320B2 (ja) | 2008-12-04 | 2009-12-03 | 静電容量センサ |
PCT/JP2009/070297 WO2010064677A1 (ja) | 2008-12-04 | 2009-12-03 | 静電容量センサ |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2010064677A1 true JPWO2010064677A1 (ja) | 2012-05-10 |
JP5161320B2 JP5161320B2 (ja) | 2013-03-13 |
Family
ID=42233324
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010541345A Active JP5161320B2 (ja) | 2008-12-04 | 2009-12-03 | 静電容量センサ |
Country Status (6)
Country | Link |
---|---|
US (1) | US8487638B2 (ja) |
EP (1) | EP2354814B1 (ja) |
JP (1) | JP5161320B2 (ja) |
KR (1) | KR101248127B1 (ja) |
CN (1) | CN102124305B (ja) |
WO (1) | WO2010064677A1 (ja) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103189752A (zh) * | 2010-09-06 | 2013-07-03 | 康明斯有限公司 | 转速传感器 |
JP5353991B2 (ja) * | 2010-11-30 | 2013-11-27 | 株式会社日本自動車部品総合研究所 | 静電容量式乗員検知装置 |
DE102011078077A1 (de) | 2011-06-24 | 2012-12-27 | Ident Technology Ag | Leiterplatte mit Elektrodenkonfiguration eines kapazitiven Sensors |
JP5838408B2 (ja) * | 2011-10-27 | 2016-01-06 | 株式会社生方製作所 | 静電容量式液面センサー |
US8981602B2 (en) * | 2012-05-29 | 2015-03-17 | Ford Global Technologies, Llc | Proximity switch assembly having non-switch contact and method |
JP6028479B2 (ja) * | 2012-09-14 | 2016-11-16 | オムロン株式会社 | 静電容量型センサ、音響センサ及びマイクロフォン |
JP6020745B2 (ja) * | 2014-04-07 | 2016-11-02 | 株式会社村田製作所 | タッチセンサ |
WO2016063783A1 (ja) * | 2014-10-22 | 2016-04-28 | バンドー化学株式会社 | 静電容量型センサ |
DE102015205560A1 (de) * | 2015-03-26 | 2016-09-29 | Conti Temic Microelectronic Gmbh | Vorrichtung zur Erkennung der Anwesenheit und/oder Bewegungsrichtung von Objekten im Nahbereich mittels eines elektrischen Felds |
DE102015212166A1 (de) * | 2015-06-30 | 2017-01-05 | Robert Bosch Gmbh | Ortungsvorrichtung |
CN210155345U (zh) | 2016-06-24 | 2020-03-17 | 史丹利百得有限公司 | 用于沿着墙壁结构的表面移动以定位立柱的立柱探测设备 |
DE102016218179A1 (de) * | 2016-09-21 | 2018-03-22 | Brose Fahrzeugteile Gmbh & Co. Kommanditgesellschaft, Bamberg | Kapazitiver Näherungssensor |
JP6574213B2 (ja) * | 2017-03-08 | 2019-09-11 | アイシン精機株式会社 | 着座センサ |
US20190324073A1 (en) * | 2018-04-19 | 2019-10-24 | Simplex Quantum Inc. | Capacitive sensor and capacitive sensor head |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4766368A (en) * | 1986-09-30 | 1988-08-23 | Cox Harold A | Capacitive sensor |
US5844486A (en) * | 1997-01-02 | 1998-12-01 | Advanced Safety Concepts, Inc. | Integral capacitive sensor array |
US6249130B1 (en) * | 1998-12-21 | 2001-06-19 | Agrichem, Inc. | Shielded flat-plate proximity/dielectric properties sensor |
JP4198306B2 (ja) * | 1999-07-22 | 2008-12-17 | 東京エレクトロン株式会社 | 静電容量型センサ、半導体製造装置および液晶表示素子製造装置 |
US6828806B1 (en) * | 1999-07-22 | 2004-12-07 | Sumitomo Metal Industries, Ltd. | Electrostatic capacitance sensor, electrostatic capacitance sensor component, object mounting body and object mounting apparatus |
JP2002062105A (ja) * | 2000-08-23 | 2002-02-28 | Sunx Ltd | ヘッド分離型センサ、静電容量式センサ及びウエハ検出装置 |
JP4531469B2 (ja) * | 2004-07-15 | 2010-08-25 | 株式会社フジクラ | 静電容量式近接センサ |
JP4229071B2 (ja) * | 2005-01-24 | 2009-02-25 | 株式会社デンソー | 静電容量式センサおよび乗員検知システム |
JP4306673B2 (ja) * | 2005-11-08 | 2009-08-05 | トヨタ自動車株式会社 | 乗員保護装置 |
JP4520932B2 (ja) * | 2005-11-17 | 2010-08-11 | アイシン精機株式会社 | 車両用シート |
JP2008309408A (ja) | 2007-06-15 | 2008-12-25 | Panasonic Corp | ダンパー装置 |
-
2009
- 2009-12-03 WO PCT/JP2009/070297 patent/WO2010064677A1/ja active Application Filing
- 2009-12-03 EP EP09830443.9A patent/EP2354814B1/en not_active Not-in-force
- 2009-12-03 KR KR1020117002803A patent/KR101248127B1/ko not_active IP Right Cessation
- 2009-12-03 JP JP2010541345A patent/JP5161320B2/ja active Active
- 2009-12-03 CN CN2009801322739A patent/CN102124305B/zh not_active Expired - Fee Related
-
2011
- 2011-02-08 US US13/023,012 patent/US8487638B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
WO2010064677A1 (ja) | 2010-06-10 |
KR101248127B1 (ko) | 2013-04-01 |
EP2354814A1 (en) | 2011-08-10 |
CN102124305B (zh) | 2013-01-30 |
EP2354814B1 (en) | 2014-10-08 |
US8487638B2 (en) | 2013-07-16 |
KR20110036824A (ko) | 2011-04-11 |
JP5161320B2 (ja) | 2013-03-13 |
US20110163763A1 (en) | 2011-07-07 |
CN102124305A (zh) | 2011-07-13 |
EP2354814A4 (en) | 2013-10-09 |
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