JPWO2010004741A1 - 板波素子と、これを用いた電子機器 - Google Patents
板波素子と、これを用いた電子機器 Download PDFInfo
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- 235000019687 Lamb Nutrition 0.000 claims abstract description 15
- 244000126211 Hericium coralloides Species 0.000 claims abstract description 11
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- GQYHUHYESMUTHG-UHFFFAOYSA-N lithium niobate Chemical compound [Li+].[O-][Nb](=O)=O GQYHUHYESMUTHG-UHFFFAOYSA-N 0.000 claims description 11
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 8
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 8
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- 238000009826 distribution Methods 0.000 description 11
- 230000000694 effects Effects 0.000 description 8
- 238000012795 verification Methods 0.000 description 7
- 238000010897 surface acoustic wave method Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 239000000956 alloy Substances 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
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- WSMQKESQZFQMFW-UHFFFAOYSA-N 5-methyl-pyrazole-3-carboxylic acid Chemical compound CC1=CC(C(O)=O)=NN1 WSMQKESQZFQMFW-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- UKDIAJWKFXFVFG-UHFFFAOYSA-N potassium;oxido(dioxo)niobium Chemical compound [K+].[O-][Nb](=O)=O UKDIAJWKFXFVFG-UHFFFAOYSA-N 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
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- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
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- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
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- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02535—Details of surface acoustic wave devices
- H03H9/02543—Characteristics of substrate, e.g. cutting angles
- H03H9/02559—Characteristics of substrate, e.g. cutting angles of lithium niobate or lithium-tantalate substrates
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02228—Guided bulk acoustic wave devices or Lamb wave devices having interdigital transducers situated in parallel planes on either side of a piezoelectric layer
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02535—Details of surface acoustic wave devices
- H03H9/02543—Characteristics of substrate, e.g. cutting angles
- H03H9/02574—Characteristics of substrate, e.g. cutting angles of combined substrates, multilayered substrates, piezoelectrical layers on not-piezoelectrical substrate
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02535—Details of surface acoustic wave devices
- H03H9/02818—Means for compensation or elimination of undesirable effects
- H03H9/02834—Means for compensation or elimination of undesirable effects of temperature influence
Abstract
Description
図1は実施の形態1における板波素子105の断面模式図である。板波素子105は、圧電体106と、圧電体106の上面106Aに設けられた櫛歯電極107と、圧電体106の上面106Aと櫛歯電極107の上面107Aに櫛歯電極107を覆うように設けられた媒質層108と、圧電体106の下面106Bに設けられた媒質層109とを備える。櫛歯電極107は圧電体106の上面106Aの励振領域106Cに設けられている。媒質層109は励振領域106Cの真下方に位置する。櫛歯電極107は圧電体106の励振領域106Cを励振して板波を圧電体106に発生させて伝播させる。板波素子105では伝播する板波の主要な成分はラム波である。圧電体106や櫛歯電極107、媒質層108、109は圧電体106の上面106Aと下面106Bに直角の法線方向N101に積層されている。圧電体106は法線方向N101の厚みH1を有し、媒質層108、109は法線方向N101の厚みH2を有する。媒質層109は圧電体106を介して櫛歯電極107に対向している。
図7は、実施の形態2における板波素子205の断面模式図である。板波素子205は、圧電体206と、圧電体206の上面206Aに設けられた櫛歯電極207と、圧電体206の上面206Aと櫛歯電極207の上面207Aに櫛歯電極207を覆うように設けられた媒質層208と、圧電体206の下面206Bに設けられた媒質層209とを備える。櫛歯電極207は圧電体206の上面206Aの励振領域206Cに設けられている。媒質層209は励振領域206Cの真下方に位置する。圧電体206や櫛歯電極207、媒質層208、209は圧電体206の上面206Aと下面206Bに直角の法線方向N201に積層されている。圧電体206は法線方向N201の厚みH21を有し、媒質層208、209は法線方向N201の厚みH22を有する。なお、媒質層208、209の法線方向N201の厚みは同一の厚みH22であるとして説明するが、異なる厚みであってもよい。媒質層209は圧電体206を介して櫛歯電極207に対向している。櫛歯電極207は法線方向N201の厚みT11を有する。媒質層208は、櫛歯電極207によって励振される板波の速度よりも速い速度で横波が伝搬する。媒質層209は、圧電体206を伝搬する板波の速度よりも速い速度で横波が伝搬する。
107 櫛歯電極
108 媒質層(第1の媒質層)
109 媒質層(第2の媒質層)
206 圧電体
207 櫛歯電極
208 媒質層(第1の媒質層、第3の媒質層)
209 媒質層(第2の媒質層、第4の媒質層)
210 吸音層(第1の吸音層)
260 吸音層(第2の吸音層)
211 媒質層(第1の媒質層)
261 媒質層(第2の媒質層)
Claims (25)
- 圧電体と、
前記圧電体の上面に配置されてラム波を主要波として励振させる櫛歯電極と、
前記圧電体の前記上面に前記櫛歯電極を覆うように配置されて前記圧電体とは逆の周波数温度特性を有する第1の媒質層と、
を備えた板波素子。 - 前記圧電体の下面に設けられて前記圧電体とは逆の周波数温度特性を有する第2の媒質層をさらに備えた、請求項1に記載の板波素子。
- 前記第1の媒質層は酸化ケイ素よりなる、請求項1に記載の板波素子。
- 前記圧電体はニオブ酸リチウムよりなり、
前記圧電体の厚みH1の前記ラム波の波長λに対する比H1/λが
0.075〜0.125の場合には前記第1の媒質層の厚みH2の波長λに対する比H2/λが0.048〜0.080であり、
比H1/λが0.125〜0.175の場合には比H2/λは0.067〜0.108であり、
比H1/λが0.175〜0.225の場合には比H2/λは0.084〜0.136であり、
比H1/λが0.225〜0.275の場合には比H2/λは0.103〜0.175である、請求項3に記載の板波素子。 - 前記圧電体はニオブ酸リチウムよりなり、
前記圧電体の厚みH1の前記ラム波の波長λに対する比H1/λが
0.075〜0.125の場合には前記第1の媒質層の厚みH2の波長λに対する比H2/λが0より大きくかつ0.032より小さく、
比H1/λが0.125〜0.175の場合には比H2/λは0より大きくかつ0.046より小さく、
比H1/λが0.175〜0.225の場合には比H2/λは0より大きくかつ0.061より小さく、
比H1/λが0.225〜0.275の場合には比H2/λは0より大きくかつ0.084より小さく、
比H1/λが0.275〜0.325の場合には比H2/λは0より大きくかつ0.110より小さい、請求項3に記載の板波素子。 - 前記圧電体は、結晶のc軸を法線とする平面でカットされた圧電単結晶基板よりなる、請求項1に記載の板波素子。
- 前記圧電体の結晶構造は、c軸として前記圧電体の前記上面の法線を中心とした回転双晶である、請求項6に記載の板波素子。
- 前記圧電体は、前記圧電体の前記上面の法線をc軸として配向された圧電薄膜よりなる、請求項1に記載の板波素子。
- 請求項1に記載の板波素子と、
前記板波素子に接続された信号線と、
を備えた電子機器。 - 圧電体と、
前記圧電体の上面に配置されて板波を励振させる櫛歯電極と、
前記櫛歯電極を覆うように前記圧電体の前記上面に配置されて、前記板波の速度よりも大きい速度で横波が伝搬する第1の媒質層と、
前記圧電体の下面に配置されて、前記板波の速度よりも大きい速度で横波が伝搬する第2の媒質層と、
を備えた板波素子。 - 前記第1の媒質層の厚み及び前記第2の媒質層の厚みが前記板波の波長より大きい、請求項10に記載の板波素子。
- 前記板波の速度が、前記第1の媒質層を伝搬する横波の速度及び前記第2媒質層を伝搬する横波の速度よりも遅くなるように、前記圧電体の厚み及び前記櫛歯電極の厚みが決定されている、請求項10に記載の板波素子。
- 前記第1媒質の上面に配置された第1の吸音層と、
前記第2媒質の下面に配置された第2の吸音層と、
をさらに備えた、請求項10に記載の板波素子。 - 前記櫛歯電極はラム波を主要波として励振させる、請求項10に記載の板波素子。
- 前記第1の媒質層の厚みと前記第2の媒質の厚みは略同一である、請求項10に記載の板波素子。
- 前記第1の媒質層と前記第2の媒質層は同一の媒質よりなる、請求項10に記載の板波素子。
- 前記圧電体の結晶構造は、c軸として前記圧電体の前記上面の法線を中心とした回転双晶である、請求項10に記載の板波素子。
- 請求項10に記載の板波素子と、
前記板波素子に接続された信号線と、
を備えた電子機器。 - 圧電体と、
前記圧電体の上面に配置されて板波を励振させる櫛歯電極と、
前記櫛歯電極を覆うように前記圧電体の前記上面に配置された第1の媒質層と、
前記圧電体の下面に配置された第2の媒質層と、
前記第1の媒質層の上面に配置されて、前記板波の速度よりも大きい速度で横波が伝搬する第3の媒質層と、
前記第2の媒質層の下面に配置されて、前記板波の速度よりも大きい速度で横波が伝搬する第4の媒質層と、
前記第1の媒質層には、前記第1媒質層を伝搬する横波の速度よりも小さい速度で横波が伝搬し、
前記第2の媒質層には、前記第4の媒質層を伝搬する横波の速度よりも小さい速度で横波が伝搬する、板波素子。 - 前記第1の媒質層と前記第2の媒質層は酸化ケイ素よりなる、請求項19に記載の板波素子。
- 前記櫛歯電極はラム波を主要波として励振させる、請求項19に記載の板波素子。
- 前記第3の媒質層の厚みと前記第4の媒質の厚みは略同一である、請求項19に記載の板波素子。
- 前記第3の媒質層と前記第4の媒質層は同一の媒質よりなる、請求項19に記載の板波素子。
- 前記圧電体の結晶構造は、c軸として前記圧電体の前記上面の法線を中心とした回転双晶である、請求項19に記載の板波素子。
- 請求項19に記載の板波素子と、
前記板波素子に接続された信号線と、
を備えた電子機器。
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Families Citing this family (103)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8482184B2 (en) | 2008-07-11 | 2013-07-09 | Panasonic Corporation | Plate wave element and electronic equipment using same |
JP5367612B2 (ja) * | 2009-02-17 | 2013-12-11 | 日本碍子株式会社 | ラム波装置 |
JP2012253497A (ja) | 2011-06-01 | 2012-12-20 | Taiyo Yuden Co Ltd | 電子回路及び電子モジュール |
EP2744107B1 (en) * | 2011-08-08 | 2020-01-15 | Murata Manufacturing Co., Ltd. | Elastic wave device |
JP6092535B2 (ja) * | 2012-07-04 | 2017-03-08 | 太陽誘電株式会社 | ラム波デバイスおよびその製造方法 |
JP5828032B2 (ja) * | 2012-07-30 | 2015-12-02 | スカイワークス・パナソニック フィルターソリューションズ ジャパン株式会社 | 弾性波素子とこれを用いたアンテナ共用器 |
SG11201508862UA (en) * | 2013-05-13 | 2015-11-27 | Murata Manufacturing Co | Vibrating device |
US10404232B2 (en) * | 2013-10-17 | 2019-09-03 | Royal Melbourne Institute Of Technology | Piezoelectric actuation platform |
JP6497018B2 (ja) * | 2014-09-30 | 2019-04-10 | 株式会社村田製作所 | デュプレクサ及びその製造方法 |
WO2016100626A1 (en) | 2014-12-17 | 2016-06-23 | Rf Micro Devices, Inc. | Multi-frequency guided wave devices and fabrication methods |
US10381998B2 (en) | 2015-07-28 | 2019-08-13 | Qorvo Us, Inc. | Methods for fabrication of bonded wafers and surface acoustic wave devices using same |
US10326426B2 (en) | 2016-01-22 | 2019-06-18 | Qorvo Us, Inc. | Guided wave devices with selectively loaded piezoelectric layers |
US10128814B2 (en) | 2016-01-28 | 2018-11-13 | Qorvo Us, Inc. | Guided surface acoustic wave device providing spurious mode rejection |
US10938367B2 (en) | 2016-03-31 | 2021-03-02 | Qorvo Us, Inc. | Solidly mounted layer thin film device with grounding layer |
JP6642499B2 (ja) * | 2016-06-24 | 2020-02-05 | 株式会社村田製作所 | 弾性波装置 |
US10715105B2 (en) | 2016-06-24 | 2020-07-14 | Murata Manufacturing Co., Ltd. | Acoustic wave device |
SG11201903365SA (en) | 2016-10-20 | 2019-05-30 | Skyworks Solutions Inc | Elastic wave device with sub-wavelength thick piezoelectric layer |
US20180152169A1 (en) * | 2016-11-30 | 2018-05-31 | Skyworks Solutions, Inc. | Saw filters with stepped-profile piezoelectric substrate |
US11206007B2 (en) | 2017-10-23 | 2021-12-21 | Qorvo Us, Inc. | Quartz orientation for guided SAW devices |
US10790802B2 (en) | 2018-06-15 | 2020-09-29 | Resonant Inc. | Transversely excited film bulk acoustic resonator using rotated Y-X cut lithium niobate |
US11323096B2 (en) | 2018-06-15 | 2022-05-03 | Resonant Inc. | Transversely-excited film bulk acoustic resonator with periodic etched holes |
US10911023B2 (en) | 2018-06-15 | 2021-02-02 | Resonant Inc. | Transversely-excited film bulk acoustic resonator with etch-stop layer |
US10756697B2 (en) | 2018-06-15 | 2020-08-25 | Resonant Inc. | Transversely-excited film bulk acoustic resonator |
US11929731B2 (en) | 2018-02-18 | 2024-03-12 | Murata Manufacturing Co., Ltd. | Transversely-excited film bulk acoustic resonator with optimized electrode mark, and pitch |
US11323089B2 (en) | 2018-06-15 | 2022-05-03 | Resonant Inc. | Filter using piezoelectric film bonded to high resistivity silicon substrate with trap-rich layer |
US20220116015A1 (en) | 2018-06-15 | 2022-04-14 | Resonant Inc. | Transversely-excited film bulk acoustic resonator with optimized electrode thickness, mark, and pitch |
US11936358B2 (en) | 2020-11-11 | 2024-03-19 | Murata Manufacturing Co., Ltd. | Transversely-excited film bulk acoustic resonator with low thermal impedance |
US11323090B2 (en) | 2018-06-15 | 2022-05-03 | Resonant Inc. | Transversely-excited film bulk acoustic resonator using Y-X-cut lithium niobate for high power applications |
US20210328574A1 (en) | 2020-04-20 | 2021-10-21 | Resonant Inc. | Small transversely-excited film bulk acoustic resonators with enhanced q-factor |
US10637438B2 (en) | 2018-06-15 | 2020-04-28 | Resonant Inc. | Transversely-excited film bulk acoustic resonators for high power applications |
US10491192B1 (en) | 2018-06-15 | 2019-11-26 | Resonant Inc. | Transversely-excited film bulk acoustic resonator |
US11146232B2 (en) | 2018-06-15 | 2021-10-12 | Resonant Inc. | Transversely-excited film bulk acoustic resonator with reduced spurious modes |
US11509279B2 (en) | 2020-07-18 | 2022-11-22 | Resonant Inc. | Acoustic resonators and filters with reduced temperature coefficient of frequency |
US10601392B2 (en) | 2018-06-15 | 2020-03-24 | Resonant Inc. | Solidly-mounted transversely-excited film bulk acoustic resonator |
US11206009B2 (en) | 2019-08-28 | 2021-12-21 | Resonant Inc. | Transversely-excited film bulk acoustic resonator with interdigital transducer with varied mark and pitch |
FR3079101B1 (fr) * | 2018-03-16 | 2020-11-06 | Frecnsys | Structure de transducteur pour suppression de source dans les dispositifs de filtres a ondes acoustiques de surface |
JP7169083B2 (ja) * | 2018-04-04 | 2022-11-10 | 太陽誘電株式会社 | 弾性波デバイスおよびマルチプレクサ |
DE102019204755A1 (de) | 2018-04-18 | 2019-10-24 | Skyworks Solutions, Inc. | Akustikwellenvorrichtung mit mehrschichtigem piezoelektrischem substrat |
US10998877B2 (en) | 2018-06-15 | 2021-05-04 | Resonant Inc. | Film bulk acoustic resonator fabrication method with frequency trimming based on electric measurements prior to cavity etch |
US10868513B2 (en) | 2018-06-15 | 2020-12-15 | Resonant Inc. | Transversely-excited film bulk acoustic filters with symmetric layout |
US11374549B2 (en) | 2018-06-15 | 2022-06-28 | Resonant Inc. | Filter using transversely-excited film bulk acoustic resonators with divided frequency-setting dielectric layers |
US11329628B2 (en) | 2020-06-17 | 2022-05-10 | Resonant Inc. | Filter using lithium niobate and lithium tantalate transversely-excited film bulk acoustic resonators |
US11146238B2 (en) | 2018-06-15 | 2021-10-12 | Resonant Inc. | Film bulk acoustic resonator fabrication method |
US11323095B2 (en) | 2018-06-15 | 2022-05-03 | Resonant Inc. | Rotation in XY plane to suppress spurious modes in XBAR devices |
US11171629B2 (en) | 2018-06-15 | 2021-11-09 | Resonant Inc. | Transversely-excited film bulk acoustic resonator using pre-formed cavities |
US11349450B2 (en) | 2018-06-15 | 2022-05-31 | Resonant Inc. | Symmetric transversely-excited film bulk acoustic resonators with reduced spurious modes |
US11901878B2 (en) | 2018-06-15 | 2024-02-13 | Murata Manufacturing Co., Ltd. | Transversely-excited film bulk acoustic resonators with two-layer electrodes with a wider top layer |
US11870423B2 (en) | 2018-06-15 | 2024-01-09 | Murata Manufacturing Co., Ltd. | Wide bandwidth temperature-compensated transversely-excited film bulk acoustic resonator |
US11264966B2 (en) | 2018-06-15 | 2022-03-01 | Resonant Inc. | Solidly-mounted transversely-excited film bulk acoustic resonator with diamond layers in Bragg reflector stack |
US11728785B2 (en) | 2018-06-15 | 2023-08-15 | Murata Manufacturing Co., Ltd. | Transversely-excited film bulk acoustic resonator using pre-formed cavities |
US10985728B2 (en) | 2018-06-15 | 2021-04-20 | Resonant Inc. | Transversely-excited film bulk acoustic resonator and filter with a uniform-thickness dielectric overlayer |
US11888463B2 (en) | 2018-06-15 | 2024-01-30 | Murata Manufacturing Co., Ltd. | Multi-port filter using transversely-excited film bulk acoustic resonators |
US11201601B2 (en) | 2018-06-15 | 2021-12-14 | Resonant Inc. | Transversely-excited film bulk acoustic resonator with multiple diaphragm thicknesses and fabrication method |
US11349452B2 (en) | 2018-06-15 | 2022-05-31 | Resonant Inc. | Transversely-excited film bulk acoustic filters with symmetric layout |
US11228296B2 (en) | 2018-06-15 | 2022-01-18 | Resonant Inc. | Transversely-excited film bulk acoustic resonator with a cavity having a curved perimeter |
US10998882B2 (en) | 2018-06-15 | 2021-05-04 | Resonant Inc. | XBAR resonators with non-rectangular diaphragms |
US11967945B2 (en) | 2018-06-15 | 2024-04-23 | Murata Manufacturing Co., Ltd. | Transversly-excited film bulk acoustic resonators and filters |
US10826462B2 (en) | 2018-06-15 | 2020-11-03 | Resonant Inc. | Transversely-excited film bulk acoustic resonators with molybdenum conductors |
US11916539B2 (en) | 2020-02-28 | 2024-02-27 | Murata Manufacturing Co., Ltd. | Split-ladder band N77 filter using transversely-excited film bulk acoustic resonators |
US11876498B2 (en) | 2018-06-15 | 2024-01-16 | Murata Manufacturing Co., Ltd. | Transversely-excited film bulk acoustic resonator with multiple diaphragm thicknesses and fabrication method |
US11909381B2 (en) | 2018-06-15 | 2024-02-20 | Murata Manufacturing Co., Ltd. | Transversely-excited film bulk acoustic resonators with two-layer electrodes having a narrower top layer |
US11323091B2 (en) | 2018-06-15 | 2022-05-03 | Resonant Inc. | Transversely-excited film bulk acoustic resonator with diaphragm support pedestals |
US10992283B2 (en) | 2018-06-15 | 2021-04-27 | Resonant Inc. | High power transversely-excited film bulk acoustic resonators on rotated Z-cut lithium niobate |
US10992284B2 (en) | 2018-06-15 | 2021-04-27 | Resonant Inc. | Filter using transversely-excited film bulk acoustic resonators with multiple frequency setting layers |
US10917072B2 (en) | 2019-06-24 | 2021-02-09 | Resonant Inc. | Split ladder acoustic wave filters |
US10797675B2 (en) | 2018-06-15 | 2020-10-06 | Resonant Inc. | Transversely excited film bulk acoustic resonator using rotated z-cut lithium niobate |
US11949402B2 (en) | 2020-08-31 | 2024-04-02 | Murata Manufacturing Co., Ltd. | Resonators with different membrane thicknesses on the same die |
DE102018124157B4 (de) * | 2018-10-01 | 2023-11-09 | Rf360 Singapore Pte. Ltd. | Für hohe Frequenzen ausgelegte SAW-Vorrichtung |
WO2020100949A1 (ja) * | 2018-11-14 | 2020-05-22 | 京セラ株式会社 | 弾性波装置、分波器および通信装置 |
WO2020130128A1 (ja) * | 2018-12-21 | 2020-06-25 | 京セラ株式会社 | 弾性波装置、分波器および通信装置 |
WO2020186261A1 (en) | 2019-03-14 | 2020-09-17 | Resonant Inc. | Transversely-excited film bulk acoustic resonator with half-lambda dielectric layer |
US11901873B2 (en) | 2019-03-14 | 2024-02-13 | Murata Manufacturing Co., Ltd. | Transversely-excited film bulk acoustic resonator with partial BRAGG reflectors |
DE112020001765T5 (de) | 2019-04-05 | 2021-12-23 | Resonant Inc. | Packung eines transversal angeregten akustischen Filmvolumenresonators und Verfahren |
US10911021B2 (en) | 2019-06-27 | 2021-02-02 | Resonant Inc. | Transversely-excited film bulk acoustic resonator with lateral etch stop |
US10862454B1 (en) | 2019-07-18 | 2020-12-08 | Resonant Inc. | Film bulk acoustic resonators in thin LN-LT layers |
US11329625B2 (en) | 2019-07-18 | 2022-05-10 | Resonant Inc. | Film bulk acoustic sensors using thin LN-LT layer |
US20210273629A1 (en) | 2020-02-28 | 2021-09-02 | Resonant Inc. | Transversely-excited film bulk acoustic resonator with multi-pitch interdigital transducer |
WO2021187397A1 (ja) * | 2020-03-16 | 2021-09-23 | 株式会社村田製作所 | 弾性波装置 |
US11811391B2 (en) | 2020-05-04 | 2023-11-07 | Murata Manufacturing Co., Ltd. | Transversely-excited film bulk acoustic resonator with etched conductor patterns |
US11469733B2 (en) | 2020-05-06 | 2022-10-11 | Resonant Inc. | Transversely-excited film bulk acoustic resonators with interdigital transducer configured to reduce diaphragm stress |
US10992282B1 (en) | 2020-06-18 | 2021-04-27 | Resonant Inc. | Transversely-excited film bulk acoustic resonators with electrodes having a second layer of variable width |
US11742828B2 (en) | 2020-06-30 | 2023-08-29 | Murata Manufacturing Co., Ltd. | Transversely-excited film bulk acoustic resonator with symmetric diaphragm |
CN111817678B (zh) * | 2020-07-03 | 2021-12-28 | 中国科学院上海微系统与信息技术研究所 | 单片式混合集成声波谐振器阵列及其制备方法 |
US11482981B2 (en) | 2020-07-09 | 2022-10-25 | Resonanat Inc. | Transversely-excited film bulk acoustic resonators with piezoelectric diaphragm supported by piezoelectric substrate |
US11264969B1 (en) | 2020-08-06 | 2022-03-01 | Resonant Inc. | Transversely-excited film bulk acoustic resonator comprising small cells |
US11671070B2 (en) | 2020-08-19 | 2023-06-06 | Murata Manufacturing Co., Ltd. | Transversely-excited film bulk acoustic resonators using multiple dielectric layer thicknesses to suppress spurious modes |
US11271539B1 (en) | 2020-08-19 | 2022-03-08 | Resonant Inc. | Transversely-excited film bulk acoustic resonator with tether-supported diaphragm |
US11894835B2 (en) | 2020-09-21 | 2024-02-06 | Murata Manufacturing Co., Ltd. | Sandwiched XBAR for third harmonic operation |
US11621695B2 (en) * | 2020-10-02 | 2023-04-04 | RF360 Europe GmbH | Cascaded surface acoustic wave devices with apodized interdigital transducers |
US11405017B2 (en) | 2020-10-05 | 2022-08-02 | Resonant Inc. | Acoustic matrix filters and radios using acoustic matrix filters |
US11658639B2 (en) | 2020-10-05 | 2023-05-23 | Murata Manufacturing Co., Ltd. | Transversely-excited film bulk acoustic resonator matrix filters with noncontiguous passband |
US11728784B2 (en) | 2020-10-05 | 2023-08-15 | Murata Manufacturing Co., Ltd. | Transversely-excited film bulk acoustic resonator matrix filters with split die sub-filters |
US11405019B2 (en) | 2020-10-05 | 2022-08-02 | Resonant Inc. | Transversely-excited film bulk acoustic resonator matrix filters |
US11476834B2 (en) | 2020-10-05 | 2022-10-18 | Resonant Inc. | Transversely-excited film bulk acoustic resonator matrix filters with switches in parallel with sub-filter shunt capacitors |
US11929733B2 (en) | 2020-10-05 | 2024-03-12 | Murata Manufacturing Co., Ltd. | Transversely-excited film bulk acoustic resonator matrix filters with input and output impedances matched to radio frequency front end elements |
US11463066B2 (en) | 2020-10-14 | 2022-10-04 | Resonant Inc. | Transversely-excited film bulk acoustic resonators with piezoelectric diaphragm supported by piezoelectric substrate |
US11496113B2 (en) | 2020-11-13 | 2022-11-08 | Resonant Inc. | XBAR devices with excess piezoelectric material removed |
US11405020B2 (en) | 2020-11-26 | 2022-08-02 | Resonant Inc. | Transversely-excited film bulk acoustic resonators with structures to reduce acoustic energy leakage |
US11239816B1 (en) | 2021-01-15 | 2022-02-01 | Resonant Inc. | Decoupled transversely-excited film bulk acoustic resonators |
JP7245860B2 (ja) * | 2021-03-09 | 2023-03-24 | 公益財団法人電磁材料研究所 | 振動発電素子 |
WO2023169653A1 (en) * | 2022-03-08 | 2023-09-14 | Huawei Technologies Co., Ltd. | An acoustic resonator solidly mounted on a high acoustic velocity substrate |
WO2023204206A1 (ja) * | 2022-04-22 | 2023-10-26 | 京セラ株式会社 | 弾性波装置および通信装置 |
CN117639707A (zh) * | 2022-08-27 | 2024-03-01 | 华为技术有限公司 | 兰姆波谐振器及制备方法、滤波器、射频模组、电子设备 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002152007A (ja) * | 2000-11-15 | 2002-05-24 | Hitachi Ltd | ラム波型弾性波共振器 |
WO2005069486A1 (ja) * | 2004-01-19 | 2005-07-28 | Murata Manufacturing Co., Ltd. | 弾性境界波装置 |
WO2006114930A1 (ja) * | 2005-04-25 | 2006-11-02 | Murata Manufacturing Co., Ltd. | 弾性境界波装置 |
WO2007046236A1 (ja) * | 2005-10-19 | 2007-04-26 | Murata Manufacturing Co., Ltd. | ラム波デバイス |
JP2007202087A (ja) * | 2005-05-11 | 2007-08-09 | Seiko Epson Corp | ラム波型高周波デバイス |
JP2007312164A (ja) * | 2006-05-19 | 2007-11-29 | Hitachi Ltd | 圧電薄膜共振器並びにそれを用いた高周波フィルタ及び高周波モジュール |
JP2008098974A (ja) * | 2006-10-12 | 2008-04-24 | Seiko Epson Corp | ラム波型高周波デバイス |
WO2008078481A1 (ja) * | 2006-12-25 | 2008-07-03 | Murata Manufacturing Co., Ltd. | 弾性境界波装置 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE60134840D1 (de) * | 2000-03-24 | 2008-08-28 | Seiko Epson Corp | Akustische oberflächenwellenanordnung |
JP4535067B2 (ja) * | 2004-03-29 | 2010-09-01 | 株式会社村田製作所 | 弾性境界波装置の製造方法及び弾性境界波装置 |
JP4315174B2 (ja) * | 2006-02-16 | 2009-08-19 | セイコーエプソン株式会社 | ラム波型高周波デバイスの製造方法 |
US8482184B2 (en) | 2008-07-11 | 2013-07-09 | Panasonic Corporation | Plate wave element and electronic equipment using same |
-
2009
- 2009-07-08 US US12/999,369 patent/US8482184B2/en active Active
- 2009-07-08 JP JP2010519643A patent/JP5392258B2/ja active Active
- 2009-07-08 CN CN2009801280469A patent/CN102089970A/zh active Pending
- 2009-07-08 WO PCT/JP2009/003178 patent/WO2010004741A1/ja active Application Filing
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002152007A (ja) * | 2000-11-15 | 2002-05-24 | Hitachi Ltd | ラム波型弾性波共振器 |
WO2005069486A1 (ja) * | 2004-01-19 | 2005-07-28 | Murata Manufacturing Co., Ltd. | 弾性境界波装置 |
WO2006114930A1 (ja) * | 2005-04-25 | 2006-11-02 | Murata Manufacturing Co., Ltd. | 弾性境界波装置 |
JP2007202087A (ja) * | 2005-05-11 | 2007-08-09 | Seiko Epson Corp | ラム波型高周波デバイス |
WO2007046236A1 (ja) * | 2005-10-19 | 2007-04-26 | Murata Manufacturing Co., Ltd. | ラム波デバイス |
JP2007312164A (ja) * | 2006-05-19 | 2007-11-29 | Hitachi Ltd | 圧電薄膜共振器並びにそれを用いた高周波フィルタ及び高周波モジュール |
JP2008098974A (ja) * | 2006-10-12 | 2008-04-24 | Seiko Epson Corp | ラム波型高周波デバイス |
WO2008078481A1 (ja) * | 2006-12-25 | 2008-07-03 | Murata Manufacturing Co., Ltd. | 弾性境界波装置 |
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US20110109196A1 (en) | 2011-05-12 |
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