JPWO2006035674A1 - 焼成用敷板及びこれを用いたハニカム成形体の焼成方法 - Google Patents
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Abstract
Description
(1)被焼成体の直径±10%の大きさで、且つその厚さが5〜50mmであること。
(2)被焼成体との接触面の外周角部を、3〜30mmの範囲で面取りしたものであること。
(3)被焼成体の形状が、直径140〜400mm、高さ150〜400mmであること。
(1)表面粗さRa
テーラーホブソン社製のFTS−S4C型表面粗さ測定機で、先端2μmRの触針を先端角度90°で敷板の製品接触面に沿って2.5mmの長さで接触させ、得られた焼成用敷板の接触面のプロファイルから表面粗さRaを得た。本発明における表面粗さRaの値は、上記測定方法による10箇所の測定の平均値から算出した。
光学顕微鏡にて20箇所にてリブ厚とセルピッチを測定し、それぞれ平均値を算出。これらの値から計算した1セルあたりの開口面積から、開口率を計算した。
マイクロメリティックス社製の水銀圧入式ポロシメーターで測定して得られた全細孔容積の値と、コージェライトの真比重2.52g/ccから、気孔率を計算した。
平均粒径のタルク(平均粒径:25μm)、カオリン(平均粒径:5μm)、アルミナ(平均粒径:5μm)、水酸化アルミニウム(平均粒径:5μm)及び溶融シリカ(平均粒径:30μm)を、タルク40質量%、カオリン20質量%、アルミナ15質量%、水酸化アルミニウム15質量%、溶融シリカ10質量%の割合で混合してコージェライト化原料を調製した(表1参照)。
表2の結果から、実施例1〜4及び実施例6では、焼成用敷板(トチ)との接触面におけるハニカム構造体(製品)の表面状態(製品端面状態)は良好であり、問題も発生しなかった。
シリコンカーバイド粉末に有機バインダー(メチルセルロース、ヒドロキシプロピルメチルセルロース)を添加し、更に界面活性剤及び水を添加し、可塑性の坏土を作製した。この坏土を押出し成形することによりハニカム構造の成形体をそれぞれ得た。
表3の結果から、実施例14では、焼成用敷板(トチ)との接触面におけるハニカム構造体(製品)の表面状態(製品端面状態)は許容するが、敷板の開口率が小さく、製品と接触している面積が大きくなり、敷板と製品のくっつきが多少発生していた。
α−アルミナ(平均粒径:5.0μm、BET比表面積:0.8m2/g)、ベーマイト(平均粒径:0.1μm、BET比表面積:163m2/g)、酸化チタン(平均粒径:0.2μm)、高純度カオリン(平均粒径:3μm)を調合・混合することにより、アルミニウムチタネート化原料(AT化原料)を調製した。調製したAT化原料の100質量部に対して、有機バインダー(メチルセルロース、ヒドロキシプロピルメチルセルロース)を1.5質量部添加して、更に混合・真空脱気した。得られた真空脱気した混合物を石膏型で鋳込み成形して、成形体をそれぞれ得た。
表4の結果から、実施例23では、焼成用敷板(トチ)との接触面におけるハニカム構造体(製品)の表面状態(製品端面状態)は許容するが、敷板の開口率が小さく、製品と接触している面積が大きくなり、敷板と製品のくっつきが多少発生していた。
Claims (8)
- 焼成後の結晶相の主成分が被焼成体と同じである焼成用敷板であって、被焼成体との接触面の表面粗さRaが8〜50μmである焼成用敷板。
- 開口率が、50〜90%のハニカム構造体であるセラミックス成形体から構成された請求項1に記載の焼成用敷板。
- 前記被焼成体と同時に焼成したときにおける焼成後の結晶相の主な組成が、(1)コージェライト85〜100質量%、(2)シリコンカーバイド50〜100質量%、(3)アルミニウムチタネート50〜100質量%、のいずれか1つである請求項1又は2に記載の焼成用敷板。
- 前記被焼成体と同時に焼成したときにおける焼成後の気孔率が、20〜70%である請求項1〜3のいずれか1項に記載の焼成用敷板。
- 請求項1〜4のいずれか1項に記載の焼成用敷板が、被焼成体の直径±10%の大きさで、且つその厚さが5〜50mmである焼成用敷板。
- 前記被焼成体との接触面の外周角部を、3〜30mmの範囲で面取りした請求項5に記載の焼成用敷板。
- 前記被焼成体の形状が、直径140〜400mm、高さ150〜400mmである請求項5又は6に記載の焼成用敷板。
- 請求項1〜7のいずれか1項に記載の焼成用敷板を使用したハニカム成形体の焼成方法。
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JP2008182136A (ja) * | 2007-01-26 | 2008-08-07 | Tdk Corp | 多層セラミック基板の製造方法 |
DE202007008520U1 (de) * | 2007-02-21 | 2008-07-03 | Dekema Dental-Keramiköfen GmbH | Brenngutträger |
JP4836006B2 (ja) * | 2007-09-28 | 2011-12-14 | 日立金属株式会社 | セラミックスハニカム構造体の焼成方法 |
CN101960245A (zh) * | 2008-03-05 | 2011-01-26 | 日本碍子株式会社 | 陶瓷烧成用窑工具板 |
FR2936512B1 (fr) * | 2008-09-30 | 2010-09-17 | Saint Gobain Ct Recherches | Procede de fabrication d'un materiau poreux en sic. |
JP5294057B2 (ja) * | 2008-10-02 | 2013-09-18 | 日立金属株式会社 | チタン酸アルミニウム質セラミックハニカム構造体の製造方法 |
US8133422B2 (en) * | 2008-10-30 | 2012-03-13 | Corning Incorporated | Alkylcellulose salt binder for green body manufacture |
US9091482B2 (en) | 2009-03-24 | 2015-07-28 | Saint-Gobain Centre De Recherches Et D'etudes Europeen | Method and substrate for curing a honeycomb structure |
JP2011068517A (ja) * | 2009-09-25 | 2011-04-07 | Sumitomo Chemical Co Ltd | セラミックス焼成体の製造方法 |
US8926891B2 (en) | 2010-05-17 | 2015-01-06 | Sumitomo Chemical Company, Limited | Method for manufacturing ceramic honeycomb fired body |
JP5773716B2 (ja) * | 2011-04-08 | 2015-09-02 | 京セラ株式会社 | ハニカム構造体の焼成方法 |
JP5978042B2 (ja) * | 2011-12-20 | 2016-08-24 | 住友化学株式会社 | ハニカム成形体の切断方法及び切断装置、並びにハニカム構造体の製造方法 |
MX2015002820A (es) * | 2012-09-05 | 2015-05-15 | Sumitomo Chemical Co | Metodo de produccion de estructura de panal. |
JP2014172784A (ja) * | 2013-03-08 | 2014-09-22 | Ngk Insulators Ltd | 焼成用シートおよび焼成シートを用いた被焼成体の焼成方法 |
JP5779794B2 (ja) * | 2013-03-19 | 2015-09-16 | 日本碍子株式会社 | ベースセッター |
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WO2016117207A1 (ja) * | 2015-01-19 | 2016-07-28 | 三井金属鉱業株式会社 | セラミックス格子体 |
JP6312617B2 (ja) * | 2015-02-24 | 2018-04-18 | 日本碍子株式会社 | ハニカム構造体の製造方法 |
JP6224637B2 (ja) | 2015-02-24 | 2017-11-01 | 日本碍子株式会社 | ハニカム構造体の製造方法、及びハニカム成形体 |
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WO2017145516A1 (ja) * | 2016-02-23 | 2017-08-31 | 日本碍子株式会社 | 焼成用トチ、及び焼成用トチを用いたハニカム構造体の製造方法 |
JP6397843B2 (ja) * | 2016-03-24 | 2018-09-26 | 日本碍子株式会社 | ハニカム構造体の製造方法 |
JPWO2017163497A1 (ja) * | 2016-03-24 | 2019-01-31 | 日本碍子株式会社 | 焼成用トチ、及び焼成用トチを用いたハニカム構造体の製造方法 |
JP6410758B1 (ja) * | 2016-05-24 | 2018-10-24 | 三井金属鉱業株式会社 | セラミックス格子体 |
CN109716049A (zh) * | 2016-09-12 | 2019-05-03 | 日本碍子株式会社 | 烧成用载置器 |
WO2019232152A1 (en) * | 2018-05-31 | 2019-12-05 | Corning Incorporated | Honeycomb body manufacturing methods |
WO2019232153A1 (en) * | 2018-05-31 | 2019-12-05 | Corning Incorporated | Honeycomb body manufacturing methods |
CN113382975B (zh) * | 2018-11-30 | 2023-05-02 | 康宁股份有限公司 | 蜂窝体制造方法 |
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- 2005-09-22 EP EP05785610A patent/EP1808423B1/en not_active Expired - Fee Related
- 2005-09-22 WO PCT/JP2005/017497 patent/WO2006035674A1/ja active Application Filing
- 2005-09-22 CN CN2011101630353A patent/CN102351544A/zh active Pending
- 2005-09-22 US US11/663,479 patent/US20080142149A1/en not_active Abandoned
- 2005-09-22 CN CNA2005800323774A patent/CN101027265A/zh active Pending
- 2005-09-22 JP JP2006537701A patent/JP4633734B2/ja not_active Expired - Fee Related
- 2005-09-22 ZA ZA200703380A patent/ZA200703380B/xx unknown
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JPH0154636B2 (ja) * | 1986-02-20 | 1989-11-20 | Ngk Insulators Ltd | |
WO1994017972A1 (en) * | 1993-02-02 | 1994-08-18 | Ngk Insulators, Ltd. | Planking for firing and method of firing ceramic products by using the same |
JPH07208873A (ja) * | 1994-01-14 | 1995-08-11 | Nippondenso Co Ltd | セラミック焼成台、及び焼成方法 |
Also Published As
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JP4633734B2 (ja) | 2011-02-16 |
EP1808423A4 (en) | 2009-11-11 |
CN101027265A (zh) | 2007-08-29 |
US20080142149A1 (en) | 2008-06-19 |
CN102351544A (zh) | 2012-02-15 |
EP1808423A1 (en) | 2007-07-18 |
WO2006035674A1 (ja) | 2006-04-06 |
ZA200703380B (en) | 2008-09-25 |
EP1808423B1 (en) | 2011-08-03 |
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