JPS648467B2 - - Google Patents

Info

Publication number
JPS648467B2
JPS648467B2 JP58185744A JP18574483A JPS648467B2 JP S648467 B2 JPS648467 B2 JP S648467B2 JP 58185744 A JP58185744 A JP 58185744A JP 18574483 A JP18574483 A JP 18574483A JP S648467 B2 JPS648467 B2 JP S648467B2
Authority
JP
Japan
Prior art keywords
circuit board
adhesive
semiconductor device
films
fluorine
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58185744A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6076146A (ja
Inventor
Kazuo Iko
Akiko Ono
Hideto Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Priority to JP58185744A priority Critical patent/JPS6076146A/ja
Publication of JPS6076146A publication Critical patent/JPS6076146A/ja
Publication of JPS648467B2 publication Critical patent/JPS648467B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5388—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates for flat cards, e.g. credit cards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Credit Cards Or The Like (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP58185744A 1983-10-03 1983-10-03 薄型半導体装置 Granted JPS6076146A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58185744A JPS6076146A (ja) 1983-10-03 1983-10-03 薄型半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58185744A JPS6076146A (ja) 1983-10-03 1983-10-03 薄型半導体装置

Publications (2)

Publication Number Publication Date
JPS6076146A JPS6076146A (ja) 1985-04-30
JPS648467B2 true JPS648467B2 (enExample) 1989-02-14

Family

ID=16176095

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58185744A Granted JPS6076146A (ja) 1983-10-03 1983-10-03 薄型半導体装置

Country Status (1)

Country Link
JP (1) JPS6076146A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01141153A (ja) * 1987-11-26 1989-06-02 Kato Seisakusho:Kk Ｘ型アウトリガ装置

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0832492B2 (ja) * 1988-10-18 1996-03-29 セイコーエプソン株式会社 Ｉｃカードの製造方法
US6207004B1 (en) 1996-06-17 2001-03-27 Mitsubishi Denki Kabushiki Kaisha Method for producing thin IC cards and construction thereof
CN1079053C (zh) * 1996-06-17 2002-02-13 三菱电机株式会社 制造薄ic卡的方法及其结构

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5379379A (en) * 1976-12-24 1978-07-13 Hitachi Ltd Production of semiconductor and divice for the same
JPS5543871A (en) * 1978-09-22 1980-03-27 Casio Comput Co Ltd Packaging of semiconductor device
US4293706A (en) * 1980-06-19 1981-10-06 Ppg Industries, Inc. Preparation of N-benzyloxycarbonyl aspartic acid

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01141153A (ja) * 1987-11-26 1989-06-02 Kato Seisakusho:Kk Ｘ型アウトリガ装置

Also Published As

Publication number Publication date
JPS6076146A (ja) 1985-04-30

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