JPS6477143A - Formation of copper thin film wiring - Google Patents

Formation of copper thin film wiring

Info

Publication number
JPS6477143A
JPS6477143A JP23459487A JP23459487A JPS6477143A JP S6477143 A JPS6477143 A JP S6477143A JP 23459487 A JP23459487 A JP 23459487A JP 23459487 A JP23459487 A JP 23459487A JP S6477143 A JPS6477143 A JP S6477143A
Authority
JP
Japan
Prior art keywords
film
copper thin
thin film
resist
grooves
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP23459487A
Other languages
English (en)
Inventor
Takashi Yoda
Katsuya Okumura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP23459487A priority Critical patent/JPS6477143A/ja
Publication of JPS6477143A publication Critical patent/JPS6477143A/ja
Pending legal-status Critical Current

Links

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP23459487A 1987-09-18 1987-09-18 Formation of copper thin film wiring Pending JPS6477143A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23459487A JPS6477143A (en) 1987-09-18 1987-09-18 Formation of copper thin film wiring

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23459487A JPS6477143A (en) 1987-09-18 1987-09-18 Formation of copper thin film wiring

Publications (1)

Publication Number Publication Date
JPS6477143A true JPS6477143A (en) 1989-03-23

Family

ID=16973475

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23459487A Pending JPS6477143A (en) 1987-09-18 1987-09-18 Formation of copper thin film wiring

Country Status (1)

Country Link
JP (1) JPS6477143A (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05102318A (ja) * 1991-04-05 1993-04-23 Internatl Business Mach Corp <Ibm> 銅合金導電プラグ形成方法及び装置
JPH088302B2 (ja) * 1990-04-26 1996-01-29 インターナシヨナル・ビジネス・マシーンズ・コーポレーシヨン 多層配線における相互接続部およびその形成方法
KR100371691B1 (ko) * 2000-08-16 2003-02-06 정동근 저유전 플라스마 중합체 박막 및 이를 이용한 반도체 소자의 제조 방법
JP2007520079A (ja) * 2004-01-30 2007-07-19 ラム　リサーチ　コーポレーション 動的な液体メニスカスを用いたストレスフリーのエッチング処理

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63117446A (ja) * 1986-11-06 1988-05-21 Fujitsu Ltd 半導体装置の製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63117446A (ja) * 1986-11-06 1988-05-21 Fujitsu Ltd 半導体装置の製造方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH088302B2 (ja) * 1990-04-26 1996-01-29 インターナシヨナル・ビジネス・マシーンズ・コーポレーシヨン 多層配線における相互接続部およびその形成方法
JPH05102318A (ja) * 1991-04-05 1993-04-23 Internatl Business Mach Corp <Ibm> 銅合金導電プラグ形成方法及び装置
KR100371691B1 (ko) * 2000-08-16 2003-02-06 정동근 저유전 플라스마 중합체 박막 및 이를 이용한 반도체 소자의 제조 방법
JP2007520079A (ja) * 2004-01-30 2007-07-19 ラム　リサーチ　コーポレーション 動的な液体メニスカスを用いたストレスフリーのエッチング処理

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