JPS6445760U - - Google Patents

Info

Publication number
JPS6445760U
JPS6445760U JP14077987U JP14077987U JPS6445760U JP S6445760 U JPS6445760 U JP S6445760U JP 14077987 U JP14077987 U JP 14077987U JP 14077987 U JP14077987 U JP 14077987U JP S6445760 U JPS6445760 U JP S6445760U
Authority
JP
Japan
Prior art keywords
vacuum deposition
deposition device
sputtering
substrate support
detached
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14077987U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP14077987U priority Critical patent/JPS6445760U/ja
Publication of JPS6445760U publication Critical patent/JPS6445760U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Physical Vapour Deposition (AREA)
  • Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)

Description

【図面の簡単な説明】
第1図は本考案の実施例1のスパツタリング装
置の内部構造体の断面図、第2図は本考案の実施
例2の断面図である。 1……被着基板、2……被着基板支持体、3,
6……ステンレス薄板部材、4……スパツタリン
グ用Alターゲツト、5……シールド板、7……
スパツタリング用SiOターゲツト。

Claims (1)

    【実用新案登録請求の範囲】
  1. スパツタリング装置、プラズマCVD装置等の
    真空被着装置において、装置内部に設けたシール
    ド板或いは被着基板支持体に、容易に脱着可能な
    20〜50μの金属薄板を複数枚重ねた部材を設
    置したことを特徴とする真空被着装置。
JP14077987U 1987-09-14 1987-09-14 Pending JPS6445760U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14077987U JPS6445760U (ja) 1987-09-14 1987-09-14

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14077987U JPS6445760U (ja) 1987-09-14 1987-09-14

Publications (1)

Publication Number Publication Date
JPS6445760U true JPS6445760U (ja) 1989-03-20

Family

ID=31405263

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14077987U Pending JPS6445760U (ja) 1987-09-14 1987-09-14

Country Status (1)

Country Link
JP (1) JPS6445760U (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02141575A (ja) * 1988-11-21 1990-05-30 Anelva Corp 薄膜堆積装置
WO2004090928A1 (ja) * 2003-04-04 2004-10-21 Matsushita Electric Industrial Co. Ltd. プラズマディスプレイパネルの製造方法
JP2004319474A (ja) * 2003-04-04 2004-11-11 Matsushita Electric Ind Co Ltd プラズマディスプレイパネルの製造方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02141575A (ja) * 1988-11-21 1990-05-30 Anelva Corp 薄膜堆積装置
WO2004090928A1 (ja) * 2003-04-04 2004-10-21 Matsushita Electric Industrial Co. Ltd. プラズマディスプレイパネルの製造方法
JP2004319474A (ja) * 2003-04-04 2004-11-11 Matsushita Electric Ind Co Ltd プラズマディスプレイパネルの製造方法
US7942971B2 (en) 2003-04-04 2011-05-17 Panasonic Corporation Method of manufacturing plasma display panels

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