JPH0330258U - - Google Patents

Info

Publication number
JPH0330258U
JPH0330258U JP8782289U JP8782289U JPH0330258U JP H0330258 U JPH0330258 U JP H0330258U JP 8782289 U JP8782289 U JP 8782289U JP 8782289 U JP8782289 U JP 8782289U JP H0330258 U JPH0330258 U JP H0330258U
Authority
JP
Japan
Prior art keywords
substrate
insulator
forming apparatus
film forming
sputtering film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8782289U
Other languages
English (en)
Other versions
JPH0730682Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989087822U priority Critical patent/JPH0730682Y2/ja
Publication of JPH0330258U publication Critical patent/JPH0330258U/ja
Application granted granted Critical
Publication of JPH0730682Y2 publication Critical patent/JPH0730682Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Physical Vapour Deposition (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)

Description

【図面の簡単な説明】
第１図は本考案実施例による基板搬送トレイの
組立構造図、第２図は第１図の要部断面図である
。 図において、１……トレイ本体、２……ホルダ
、３，４……ホルダ保持板、５１，５２……絶縁
碍子、７１……保護キヤツプ、７２……保護カバ
ー。

Claims (1)

    【実用新案登録請求の範囲】
  1. 基板にバイアス電圧を加えながら基板表面にス
    パツタ膜を成膜させるスパツタリング成膜装置に
    用いる基板搬送トレイであり、トレイ本体が絶縁
    碍子を介して固定したホルダ保持板を備え、該保
    持板に基板を装荷したホルダを支持させるものに
    おいて、前記の絶縁碍子を包囲して碍子表面に直
    接スパツタ膜が成膜するのを防止する保護カバー
    を設けたことを特徴とするスパツタリング成膜装
    置用の基板搬送トレイ。
JP1989087822U 1989-07-26 1989-07-26 スパッタリング成膜装置用の基板搬送トレイ Expired - Fee Related JPH0730682Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989087822U JPH0730682Y2 (ja) 1989-07-26 1989-07-26 スパッタリング成膜装置用の基板搬送トレイ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989087822U JPH0730682Y2 (ja) 1989-07-26 1989-07-26 スパッタリング成膜装置用の基板搬送トレイ

Publications (2)

Publication Number Publication Date
JPH0330258U true JPH0330258U (ja) 1991-03-25
JPH0730682Y2 JPH0730682Y2 (ja) 1995-07-12

Family

ID=31637461

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989087822U Expired - Fee Related JPH0730682Y2 (ja) 1989-07-26 1989-07-26 スパッタリング成膜装置用の基板搬送トレイ

Country Status (1)

Country Link
JP (1) JPH0730682Y2 (ja)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS555587A (en) * 1978-06-29 1980-01-16 Mitsubishi Electric Corp Automatic ghost rejection circuit
JPS5675572A (en) * 1979-11-22 1981-06-22 Fujitsu Ltd Sputtering device
JPS58469U (ja) * 1981-06-24 1983-01-05 株式会社日立製作所 基板保持具

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS555587A (en) * 1978-06-29 1980-01-16 Mitsubishi Electric Corp Automatic ghost rejection circuit
JPS5675572A (en) * 1979-11-22 1981-06-22 Fujitsu Ltd Sputtering device
JPS58469U (ja) * 1981-06-24 1983-01-05 株式会社日立製作所 基板保持具

Also Published As

Publication number Publication date
JPH0730682Y2 (ja) 1995-07-12

Similar Documents

Publication Publication Date Title
JPH0330258U (ja)
JPS6368690U (ja)
JPH01168551U (ja)
JPS6238601U (ja)
JPS637161U (ja)
JPH02115562U (ja)
JPH01129256U (ja)
JPH0233257U (ja)
JPS63174445U (ja)
JPS6319565U (ja)
JPH024234U (ja)
JPH0217550U (ja)
JPS6270430U (ja)
JPH01110256U (ja)
JPH0444361U (ja)
JPH03120555U (ja)
JPH0378054U (ja)
JPS6422495U (ja)
JPS61180160U (ja)
JPS63110024U (ja)
JPH01165925U (ja)
JPS63103948U (ja)
JPS62134235U (ja)
JPH0190112U (ja)
JPS6364769U (ja)

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees