JPH0233257U - - Google Patents

Info

Publication number
JPH0233257U
JPH0233257U JP11265188U JP11265188U JPH0233257U JP H0233257 U JPH0233257 U JP H0233257U JP 11265188 U JP11265188 U JP 11265188U JP 11265188 U JP11265188 U JP 11265188U JP H0233257 U JPH0233257 U JP H0233257U
Authority
JP
Japan
Prior art keywords
film thickness
correction plate
substrate holder
sputtering
substrates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11265188U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11265188U priority Critical patent/JPH0233257U/ja
Publication of JPH0233257U publication Critical patent/JPH0233257U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Physical Vapour Deposition (AREA)

Description

【図面の簡単な説明】
第１図は本考案の実施例の補正板付き基板ホル
ダーの概略図、第２図は本考案の実施例による基
板内の膜厚分布のグラフ、第３図はスパツタ装置
の概略図、第４図は従来の基板ホルダーの概略図
、第５図は従来の基板内の膜厚分布のグラフであ
る。 １０……補正板、１１……真空チヤンバー、１
２……シヤツター、１３……基板ホルダー、１４
……基板、１５……ターゲツト。

Claims (1)

    【実用新案登録請求の範囲】
  1. 基板ホルダーが回転して複数の基板にスパツタ
    リングを行うスパツタ装置において、回転方向の
    膜厚を一定にする補正板を設けたことを特徴とす
    るスパツタリング装置。
JP11265188U 1988-08-26 1988-08-26 Pending JPH0233257U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11265188U JPH0233257U (ja) 1988-08-26 1988-08-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11265188U JPH0233257U (ja) 1988-08-26 1988-08-26

Publications (1)

Publication Number Publication Date
JPH0233257U true JPH0233257U (ja) 1990-03-01

Family

ID=31351783

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11265188U Pending JPH0233257U (ja) 1988-08-26 1988-08-26

Country Status (1)

Country Link
JP (1) JPH0233257U (ja)

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