JPS6432680A - Manufacture of field-effect transistor - Google Patents

Manufacture of field-effect transistor

Info

Publication number
JPS6432680A
JPS6432680A JP18753187A JP18753187A JPS6432680A JP S6432680 A JPS6432680 A JP S6432680A JP 18753187 A JP18753187 A JP 18753187A JP 18753187 A JP18753187 A JP 18753187A JP S6432680 A JPS6432680 A JP S6432680A
Authority
JP
Japan
Prior art keywords
gate electrode
mask pattern
oblique direction
gate
opening section
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18753187A
Other languages
Japanese (ja)
Inventor
Masayoshi Kobayashi
Masao Yamane
Yoshimitsu Sasaki
Susumu Takahashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP18753187A priority Critical patent/JPS6432680A/en
Publication of JPS6432680A publication Critical patent/JPS6432680A/en
Pending legal-status Critical Current

Links

Landscapes

  • Drying Of Semiconductors (AREA)
  • Junction Field-Effect Transistors (AREA)

Abstract

PURPOSE:To satisfy both a low parasitic resistor with a bilateral asymmetric bored opening section and high drain breakdown strength by forming a gate electrode into an opening region obtained by removing a high-concentration N-type GaAs layer through an isotropic dry etching method from the oblique direction to the surface. CONSTITUTION:A gate electrode metal is applied into an opening region acquired by removing a high-concentration N-type GaAs layer 6 through an isotropic dry etching method from the oblique direction to the surface, and a gate electrode 11 is shaped through a lift-off method. Consequently, since the layer 6 is dry-etched in an isotropic manner from the oblique direction, side etching to a mask pattern asymmetrically progresses, thus displacing the center point of the lower section of a recess to the center point of the mask pattern. Evaporating beams are projected vertically to the mask pattern and the gate electrode is formed, thus shortening the distance of a bored opening section between a source and a gate, then lengthening the distance of the bored opening section between the gate and a drain.
JP18753187A 1987-07-29 1987-07-29 Manufacture of field-effect transistor Pending JPS6432680A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18753187A JPS6432680A (en) 1987-07-29 1987-07-29 Manufacture of field-effect transistor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18753187A JPS6432680A (en) 1987-07-29 1987-07-29 Manufacture of field-effect transistor

Publications (1)

Publication Number Publication Date
JPS6432680A true JPS6432680A (en) 1989-02-02

Family

ID=16207714

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18753187A Pending JPS6432680A (en) 1987-07-29 1987-07-29 Manufacture of field-effect transistor

Country Status (1)

Country Link
JP (1) JPS6432680A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4980312A (en) * 1989-02-27 1990-12-25 U.S. Philips Corporation Method of manufacturing a semiconductor device having a mesa structure
EP0642174A1 (en) * 1993-08-03 1995-03-08 Sumitomo Electric Industries, Ltd. MESFET with low ohmic resistance
US7449069B2 (en) 2004-12-28 2008-11-11 Lg Display Co., Ltd. Slit coater having apparatus for supplying a coating solution
US7914843B2 (en) 2004-12-31 2011-03-29 Lg Display Co., Ltd. Slit coater having pre-applying unit and coating method using the same

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4980312A (en) * 1989-02-27 1990-12-25 U.S. Philips Corporation Method of manufacturing a semiconductor device having a mesa structure
EP0642174A1 (en) * 1993-08-03 1995-03-08 Sumitomo Electric Industries, Ltd. MESFET with low ohmic resistance
US7449069B2 (en) 2004-12-28 2008-11-11 Lg Display Co., Ltd. Slit coater having apparatus for supplying a coating solution
US7914843B2 (en) 2004-12-31 2011-03-29 Lg Display Co., Ltd. Slit coater having pre-applying unit and coating method using the same

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