JPS643062B2 - - Google Patents
Info
- Publication number
- JPS643062B2 JPS643062B2 JP22889483A JP22889483A JPS643062B2 JP S643062 B2 JPS643062 B2 JP S643062B2 JP 22889483 A JP22889483 A JP 22889483A JP 22889483 A JP22889483 A JP 22889483A JP S643062 B2 JPS643062 B2 JP S643062B2
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- alloy
- alloy foil
- foil
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22889483A JPS60120544A (ja) | 1983-12-02 | 1983-12-02 | 半導体装置用リ−ドフレ−ム |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22889483A JPS60120544A (ja) | 1983-12-02 | 1983-12-02 | 半導体装置用リ−ドフレ−ム |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60120544A JPS60120544A (ja) | 1985-06-28 |
| JPS643062B2 true JPS643062B2 (enrdf_load_stackoverflow) | 1989-01-19 |
Family
ID=16883518
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22889483A Granted JPS60120544A (ja) | 1983-12-02 | 1983-12-02 | 半導体装置用リ−ドフレ−ム |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60120544A (enrdf_load_stackoverflow) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57121265A (en) * | 1981-01-20 | 1982-07-28 | Daido Steel Co Ltd | Pressure welding method of strip for lead frame |
| JPS57136355A (en) * | 1982-01-14 | 1982-08-23 | Toshiba Corp | Lead frame for semiconductor device |
| JPS5946053A (ja) * | 1982-09-08 | 1984-03-15 | Hitachi Cable Ltd | アルミニウム被覆リ−ドフレ−ムの製造方法 |
-
1983
- 1983-12-02 JP JP22889483A patent/JPS60120544A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60120544A (ja) | 1985-06-28 |
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