JPS60120544A - 半導体装置用リ−ドフレ−ム - Google Patents
半導体装置用リ−ドフレ−ムInfo
- Publication number
- JPS60120544A JPS60120544A JP22889483A JP22889483A JPS60120544A JP S60120544 A JPS60120544 A JP S60120544A JP 22889483 A JP22889483 A JP 22889483A JP 22889483 A JP22889483 A JP 22889483A JP S60120544 A JPS60120544 A JP S60120544A
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- alloy foil
- alloy
- foil
- bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims description 6
- 239000011888 foil Substances 0.000 claims description 38
- 229910001199 N alloy Inorganic materials 0.000 claims description 29
- 238000000034 method Methods 0.000 claims description 25
- 239000002131 composite material Substances 0.000 claims description 19
- 229910045601 alloy Inorganic materials 0.000 claims description 17
- 239000000956 alloy Substances 0.000 claims description 17
- 239000000758 substrate Substances 0.000 claims description 16
- 238000005253 cladding Methods 0.000 claims description 13
- 239000011248 coating agent Substances 0.000 claims description 10
- 238000000576 coating method Methods 0.000 claims description 10
- 238000010438 heat treatment Methods 0.000 claims description 8
- 238000004881 precipitation hardening Methods 0.000 claims description 4
- 239000006104 solid solution Substances 0.000 claims description 4
- 238000005096 rolling process Methods 0.000 claims description 3
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 claims description 2
- 229910000990 Ni alloy Inorganic materials 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910002555 FeNi Inorganic materials 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 229910001299 Cm alloy Inorganic materials 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 229910002058 ternary alloy Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22889483A JPS60120544A (ja) | 1983-12-02 | 1983-12-02 | 半導体装置用リ−ドフレ−ム |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22889483A JPS60120544A (ja) | 1983-12-02 | 1983-12-02 | 半導体装置用リ−ドフレ−ム |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60120544A true JPS60120544A (ja) | 1985-06-28 |
| JPS643062B2 JPS643062B2 (enrdf_load_stackoverflow) | 1989-01-19 |
Family
ID=16883518
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22889483A Granted JPS60120544A (ja) | 1983-12-02 | 1983-12-02 | 半導体装置用リ−ドフレ−ム |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60120544A (enrdf_load_stackoverflow) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57121265A (en) * | 1981-01-20 | 1982-07-28 | Daido Steel Co Ltd | Pressure welding method of strip for lead frame |
| JPS57136355A (en) * | 1982-01-14 | 1982-08-23 | Toshiba Corp | Lead frame for semiconductor device |
| JPS5946053A (ja) * | 1982-09-08 | 1984-03-15 | Hitachi Cable Ltd | アルミニウム被覆リ−ドフレ−ムの製造方法 |
-
1983
- 1983-12-02 JP JP22889483A patent/JPS60120544A/ja active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57121265A (en) * | 1981-01-20 | 1982-07-28 | Daido Steel Co Ltd | Pressure welding method of strip for lead frame |
| JPS57136355A (en) * | 1982-01-14 | 1982-08-23 | Toshiba Corp | Lead frame for semiconductor device |
| JPS5946053A (ja) * | 1982-09-08 | 1984-03-15 | Hitachi Cable Ltd | アルミニウム被覆リ−ドフレ−ムの製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS643062B2 (enrdf_load_stackoverflow) | 1989-01-19 |
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