JPS6228784Y2 - - Google Patents

Info

Publication number
JPS6228784Y2
JPS6228784Y2 JP10840081U JP10840081U JPS6228784Y2 JP S6228784 Y2 JPS6228784 Y2 JP S6228784Y2 JP 10840081 U JP10840081 U JP 10840081U JP 10840081 U JP10840081 U JP 10840081U JP S6228784 Y2 JPS6228784 Y2 JP S6228784Y2
Authority
JP
Japan
Prior art keywords
steel strip
thickness
lead frame
copper
coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP10840081U
Other languages
English (en)
Japanese (ja)
Other versions
JPS5812957U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10840081U priority Critical patent/JPS5812957U/ja
Publication of JPS5812957U publication Critical patent/JPS5812957U/ja
Application granted granted Critical
Publication of JPS6228784Y2 publication Critical patent/JPS6228784Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP10840081U 1981-07-20 1981-07-20 リ−ドフレ−ム用材料 Granted JPS5812957U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10840081U JPS5812957U (ja) 1981-07-20 1981-07-20 リ−ドフレ−ム用材料

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10840081U JPS5812957U (ja) 1981-07-20 1981-07-20 リ−ドフレ−ム用材料

Publications (2)

Publication Number Publication Date
JPS5812957U JPS5812957U (ja) 1983-01-27
JPS6228784Y2 true JPS6228784Y2 (enrdf_load_stackoverflow) 1987-07-23

Family

ID=29902807

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10840081U Granted JPS5812957U (ja) 1981-07-20 1981-07-20 リ−ドフレ−ム用材料

Country Status (1)

Country Link
JP (1) JPS5812957U (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61102687U (enrdf_load_stackoverflow) * 1984-12-12 1986-06-30
JPH0561219U (ja) * 1992-01-28 1993-08-13 功 尾形 側壁勾配違い水路

Also Published As

Publication number Publication date
JPS5812957U (ja) 1983-01-27

Similar Documents

Publication Publication Date Title
US5334346A (en) Copper alloys for electrical and electronic parts
US5436082A (en) Protective coating combination for lead frames
US5650661A (en) Protective coating combination for lead frames
JPS6297360A (ja) 半導体装置のボンデイングワイヤ用表面被覆高純度銅極細線
JP2002339097A (ja) 近表面をドープしたスズまたはスズ合金で被覆された金属製品
EP0950261B1 (de) Halbleiterkörper mit rückseitenmetallisierung
US5728285A (en) Protective coating combination for lead frames
US4612167A (en) Copper-base alloys for leadframes
JPH0372045A (ja) 酸化膜密着性に優れた高力高導電性銅合金
US4732733A (en) Copper-base alloys for leadframes
JPS6228784Y2 (enrdf_load_stackoverflow)
JPS61284946A (ja) 半導体装置用Cu合金リ−ド素材
JP2714560B2 (ja) ダイレクトボンディング性の良好な銅合金
JPS6260838A (ja) リ−ドフレ−ム用銅合金
JPS5841782B2 (ja) Ic用リ−ド材
JP2797846B2 (ja) 樹脂封止型半導体装置のCu合金製リードフレーム材
JP2714561B2 (ja) ダイレクトボンディング性の良好な銅合金
JPS57114265A (en) Ic lead frame and transistor comb and manufacture thereof
JPH02122035A (ja) 酸化膜密着性に優れた高力高導電銅合金
JPS60206053A (ja) リ−ドフレ−ム
JPS64449B2 (enrdf_load_stackoverflow)
JPS62189738A (ja) 半導体リ−ド用テ−プ
WO1988005254A1 (en) Process for producing formable and high strength leadframes in semiconductor packages
JPH0750377A (ja) 半導体用リードフレーム
JPH08269597A (ja) 高強度リードフレーム材