JPS6427245A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS6427245A
JPS6427245A JP18320587A JP18320587A JPS6427245A JP S6427245 A JPS6427245 A JP S6427245A JP 18320587 A JP18320587 A JP 18320587A JP 18320587 A JP18320587 A JP 18320587A JP S6427245 A JPS6427245 A JP S6427245A
Authority
JP
Japan
Prior art keywords
gate electrodes
gap
normal
insulating film
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP18320587A
Other languages
Japanese (ja)
Other versions
JP2550590B2 (en
Inventor
Yutaka Okamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP62183205A priority Critical patent/JP2550590B2/en
Publication of JPS6427245A publication Critical patent/JPS6427245A/en
Application granted granted Critical
Publication of JP2550590B2 publication Critical patent/JP2550590B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Electrodes Of Semiconductors (AREA)

Abstract

PURPOSE:To improve connection by enhancing withstand voltage etc., by forming a thin insulating layer on gap between two gate electrodes using the normal- pressure chemical vapor growth method to open the gap between gate electrodes conformably. CONSTITUTION:An insulating film 9 is formed thinly on a gap between gate electrodes 8 rather than on a gate electrodes 3A and 3B by the normal-pressure chemical vapor growth method (Normal-pressure CVD method). In this manner, if aeolotropy etching is performed by film thickness difference between the surface of gate electrodes 3A and 3B of the insulating film 9 and the gap between electrodes 8. it becomes possible to allow the insulating film 9 to remain on the gate electrodes 3A and 3B. This will allow the part with poor film quality between a side wall part 6 and an oxidation film 4 to be coated and the problem of withstand voltage between a contact electrode 12 and the gate electrode 3A etc., to be solved. Also, since leakage etc., can be effectively prevented, the process margin etc., can be reduced advantageously for improved microstructure.
JP62183205A 1987-07-22 1987-07-22 Method for manufacturing semiconductor device Expired - Fee Related JP2550590B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62183205A JP2550590B2 (en) 1987-07-22 1987-07-22 Method for manufacturing semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62183205A JP2550590B2 (en) 1987-07-22 1987-07-22 Method for manufacturing semiconductor device

Publications (2)

Publication Number Publication Date
JPS6427245A true JPS6427245A (en) 1989-01-30
JP2550590B2 JP2550590B2 (en) 1996-11-06

Family

ID=16131615

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62183205A Expired - Fee Related JP2550590B2 (en) 1987-07-22 1987-07-22 Method for manufacturing semiconductor device

Country Status (1)

Country Link
JP (1) JP2550590B2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH033324A (en) * 1989-05-13 1991-01-09 Hyundai Electron Ind Co Ltd Manufacture of semiconductor connector
JPH0370125A (en) * 1989-08-10 1991-03-26 Toshiba Corp Manufacture of semiconductor device
US5397726A (en) * 1992-02-04 1995-03-14 National Semiconductor Corporation Segment-erasable flash EPROM
US5402372A (en) * 1992-06-01 1995-03-28 National Semiconductor Corporation High density EEPROM cell array with improved access time and method of manufacture

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH033324A (en) * 1989-05-13 1991-01-09 Hyundai Electron Ind Co Ltd Manufacture of semiconductor connector
JPH0370125A (en) * 1989-08-10 1991-03-26 Toshiba Corp Manufacture of semiconductor device
US5397726A (en) * 1992-02-04 1995-03-14 National Semiconductor Corporation Segment-erasable flash EPROM
US5402372A (en) * 1992-06-01 1995-03-28 National Semiconductor Corporation High density EEPROM cell array with improved access time and method of manufacture

Also Published As

Publication number Publication date
JP2550590B2 (en) 1996-11-06

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees