JPS6412526A - Method of removing fine particles from solid surface - Google Patents
Method of removing fine particles from solid surfaceInfo
- Publication number
- JPS6412526A JPS6412526A JP63131797A JP13179788A JPS6412526A JP S6412526 A JPS6412526 A JP S6412526A JP 63131797 A JP63131797 A JP 63131797A JP 13179788 A JP13179788 A JP 13179788A JP S6412526 A JPS6412526 A JP S6412526A
- Authority
- JP
- Japan
- Prior art keywords
- mask
- fine particles
- solid surface
- removing fine
- deflectors
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010419 fine particle Substances 0.000 title abstract 2
- 239000007787 solid Substances 0.000 title 1
- 238000004140 cleaning Methods 0.000 abstract 1
- 238000010894 electron beam technology Methods 0.000 abstract 1
- 230000003116 impacting effect Effects 0.000 abstract 1
- 238000001459 lithography Methods 0.000 abstract 1
- 239000002245 particle Substances 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
- B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
- B08B7/0042—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like by laser
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
- G03F1/82—Auxiliary processes, e.g. cleaning or inspecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/268—Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/20—Masks or mask blanks for imaging by charged particle beam [CPB] radiation, e.g. by electron beam; Preparation thereof
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19873721940 DE3721940A1 (de) | 1987-07-02 | 1987-07-02 | Entfernen von partikeln von oberflaechen fester koerper durch laserbeschuss |
DE3721940.5 | 1987-07-02 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6412526A true JPS6412526A (en) | 1989-01-17 |
JPH0695510B2 JPH0695510B2 (ja) | 1994-11-24 |
Family
ID=6330792
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP63131797A Expired - Lifetime JPH0695510B2 (ja) | 1987-07-02 | 1988-05-31 | 微小粒子の除去処理装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US4980536A (ja) |
EP (1) | EP0297506B1 (ja) |
JP (1) | JPH0695510B2 (ja) |
DE (2) | DE3721940A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010536066A (ja) * | 2007-08-09 | 2010-11-25 | レイヴ リミテッド ライアビリティ カンパニー | 間接表面清浄化のための装置及び方法 |
Families Citing this family (50)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5821175A (en) * | 1988-07-08 | 1998-10-13 | Cauldron Limited Partnership | Removal of surface contaminants by irradiation using various methods to achieve desired inert gas flow over treated surface |
US5531857A (en) * | 1988-07-08 | 1996-07-02 | Cauldron Limited Partnership | Removal of surface contaminants by irradiation from a high energy source |
US5643472A (en) * | 1988-07-08 | 1997-07-01 | Cauldron Limited Partnership | Selective removal of material by irradiation |
FR2649702B1 (fr) * | 1989-07-13 | 1991-11-22 | Rhone Poulenc Sante | Derives d'alkylimino-2 benzothiazoline, leurs procedes de preparation et les medicaments les contenant |
US5151135A (en) * | 1989-09-15 | 1992-09-29 | Amoco Corporation | Method for cleaning surfaces using UV lasers |
WO1993019888A1 (en) * | 1992-03-31 | 1993-10-14 | Cauldron Limited Partnership | Removal of surface contaminants by irradiation |
US5332879A (en) * | 1992-12-02 | 1994-07-26 | The Aerospace Corporation | Method for removing trace metal contaminants from organic dielectrics |
DE4241575A1 (de) * | 1992-12-10 | 1994-06-16 | Baldwin Gegenheimer Gmbh | Verfahren und Vorrichtung zum kontaktfreien Entfernen von Schmutz von Gegenständen, insbesondere von Druckmaschinen-Zylindern |
DE4301410A1 (de) * | 1993-01-20 | 1994-07-21 | Baldwin Gegenheimer Gmbh | Druckmaschinen-Reinigungsvorrichtung |
DE4332866C2 (de) * | 1993-09-27 | 1997-12-18 | Fraunhofer Ges Forschung | Direkte Oberflächenbehandlung mit Barrierenentladung |
TW285721B (ja) * | 1994-12-27 | 1996-09-11 | Siemens Ag | |
TW284907B (en) * | 1995-06-07 | 1996-09-01 | Cauldron Lp | Removal of material by polarized irradiation and back side application for radiation |
AT408287B (de) * | 1996-10-01 | 2001-10-25 | Sez Semiconduct Equip Zubehoer | Verfahren und vorrichtung zum trocknen von scheibenförmigen substraten der halbleitertechnik |
JP3728829B2 (ja) * | 1996-10-11 | 2005-12-21 | 株式会社ニコン | 荷電粒子線投影装置 |
US5742065A (en) * | 1997-01-22 | 1998-04-21 | International Business Machines Corporation | Heater for membrane mask in an electron-beam lithography system |
JPH10223512A (ja) * | 1997-02-10 | 1998-08-21 | Nikon Corp | 電子ビーム投影露光装置 |
SG77617A1 (en) * | 1997-12-18 | 2001-01-16 | Advanced Systems Automation | A system for removing surface contaminants on moulds used in semiconductor packaging tools |
SG78282A1 (en) * | 1997-12-18 | 2001-02-20 | Advanced Systems Automation | A method for removing surface contaminants on moulds used in semiconductor packaging tools |
JP3518723B2 (ja) * | 1998-05-25 | 2004-04-12 | トヨタ自動車株式会社 | 肉盛方法 |
WO1999065061A2 (en) * | 1998-06-08 | 1999-12-16 | Advanced Systems Automation Limited | A portable laser cleaning device for semiconductor packaging machines |
DE19830438A1 (de) | 1998-07-08 | 2000-01-13 | Zeiss Carl Fa | Verfahren zur Dekontamination von Mikrolithographie-Projektionsbelichtungsanlagen |
US6385290B1 (en) | 1998-09-14 | 2002-05-07 | Nikon Corporation | X-ray apparatus |
US6407385B1 (en) | 1998-12-18 | 2002-06-18 | Nikon Corporation | Methods and apparatus for removing particulate foreign matter from the surface of a sample |
IL127720A0 (en) | 1998-12-24 | 1999-10-28 | Oramir Semiconductor Ltd | Local particle cleaning |
DE19941399A1 (de) * | 1999-08-31 | 2001-04-19 | Infineon Technologies Ag | Reinigung von Stencilmasken mit Hilfe einer durch Maskenöffnungen hindurchtretenden Gasströmung |
US6881687B1 (en) | 1999-10-29 | 2005-04-19 | Paul P. Castrucci | Method for laser cleaning of a substrate surface using a solid sacrificial film |
US6627846B1 (en) | 1999-12-16 | 2003-09-30 | Oramir Semiconductor Equipment Ltd. | Laser-driven cleaning using reactive gases |
US6582857B1 (en) | 2000-03-16 | 2003-06-24 | International Business Machines Corporation | Repair of masks to promote adhesion of patches |
AU2003244399A1 (en) * | 2002-02-01 | 2003-09-02 | Samuel W. Bross | Method and apparatus for cleaning with electromagnetic radiation |
DE10208718A1 (de) * | 2002-02-28 | 2003-10-02 | Wacker Siltronic Halbleitermat | Verfahren zur Entfernung von Partikeln von Oberflächen |
JP2003302745A (ja) * | 2002-04-12 | 2003-10-24 | Dainippon Printing Co Ltd | 異物の無害化方法 |
US6908567B2 (en) * | 2002-07-30 | 2005-06-21 | Applied Materials Israel, Ltd. | Contaminant removal by laser-accelerated fluid |
SG114560A1 (en) * | 2002-07-31 | 2005-09-28 | Inst Data Storage | A method and apparatus for cleaning surfaces |
US6829035B2 (en) * | 2002-11-12 | 2004-12-07 | Applied Materials Israel, Ltd. | Advanced mask cleaning and handling |
US6864458B2 (en) * | 2003-01-21 | 2005-03-08 | Applied Materials, Inc. | Iced film substrate cleaning |
US20040224508A1 (en) * | 2003-05-06 | 2004-11-11 | Applied Materials Israel Ltd | Apparatus and method for cleaning a substrate using a homogenized and non-polarized radiation beam |
US20050279453A1 (en) | 2004-06-17 | 2005-12-22 | Uvtech Systems, Inc. | System and methods for surface cleaning |
DE102004047798A1 (de) * | 2004-09-29 | 2006-04-06 | Robert Bosch Gmbh | Verfahren zur Reinigung eines Resonators |
JP2006114650A (ja) * | 2004-10-14 | 2006-04-27 | Canon Inc | 露光装置、走査露光装置、デバイス製造方法、原版のクリーニング方法、および原版 |
JP2007027419A (ja) * | 2005-07-15 | 2007-02-01 | Canon Inc | 露光装置 |
JP2008147314A (ja) * | 2006-12-07 | 2008-06-26 | Canon Inc | 洗浄装置及び方法、洗浄装置を有する露光装置 |
US11311917B2 (en) | 2007-08-09 | 2022-04-26 | Bruker Nano, Inc. | Apparatus and method for contamination identification |
US9221148B2 (en) | 2009-04-30 | 2015-12-29 | Rdc Holdings, Llc | Method and apparatus for processing sliders for disk drives, and to various processing media for the same |
US8801497B2 (en) | 2009-04-30 | 2014-08-12 | Rdc Holdings, Llc | Array of abrasive members with resilient support |
US20100330890A1 (en) | 2009-06-30 | 2010-12-30 | Zine-Eddine Boutaghou | Polishing pad with array of fluidized gimballed abrasive members |
WO2012164546A2 (en) | 2011-06-03 | 2012-12-06 | Ecole Polytechnique Federale De Lausanne (Epfl) | Microheater-based in situ self-cleaning dynamic stencil lithography |
AT513222B1 (de) * | 2012-08-03 | 2016-11-15 | Haas Food Equipment Gmbh | Verfahren und Vorrichtung zur Reinigung von Backoberflächen |
WO2019158511A1 (de) * | 2018-02-14 | 2019-08-22 | Basf Se | Verfahren zur reinigung von lochplatten |
EP4111491A4 (en) * | 2020-02-28 | 2024-03-27 | Newtech Llc | SURFACE MODIFICATION OF SOLDER PASTE STENCILS |
CN113376956A (zh) * | 2021-05-07 | 2021-09-10 | 深圳市路维光电股份有限公司 | 光罩内部清洁方法及清洁装置 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6187338A (ja) * | 1984-10-05 | 1986-05-02 | Nec Corp | 多重ビ−ム照射Si表面ドライ洗浄法 |
JPS6263929U (ja) * | 1985-10-12 | 1987-04-21 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3990925A (en) * | 1975-03-31 | 1976-11-09 | Bell Telephone Laboratories, Incorporated | Removal of projections on epitaxial layers |
JPS5839374B2 (ja) * | 1978-12-26 | 1983-08-30 | 松下電器産業株式会社 | 半導体基板の処理方法 |
US4388517A (en) * | 1980-09-22 | 1983-06-14 | Texas Instruments Incorporated | Sublimation patterning process |
DE3505449A1 (de) * | 1984-02-17 | 1985-08-22 | Robert 6600 Saarbrücken Langen | Verfahren zum entfernen von verunreinigungen, insbesondere rost, von einer metalloberflaeche |
AU589353B2 (en) * | 1984-02-17 | 1989-10-12 | Robert Langen | Procedure for removal of impurities, in particular rust, from the surface of a metal |
GB2169496B (en) * | 1985-01-16 | 1987-12-23 | Stc Plc | Cleaning metal surfaces |
DD254086A1 (de) * | 1986-11-26 | 1988-02-10 | Univ Schiller Jena | Verfahren zur herstellung einer monokristallinen silizidschicht auf einem siliziumsubstrat |
-
1987
- 1987-07-02 DE DE19873721940 patent/DE3721940A1/de active Granted
-
1988
- 1988-05-31 JP JP63131797A patent/JPH0695510B2/ja not_active Expired - Lifetime
- 1988-06-28 DE DE3856187T patent/DE3856187T2/de not_active Expired - Fee Related
- 1988-06-28 EP EP88110296A patent/EP0297506B1/en not_active Expired - Lifetime
-
1990
- 1990-01-08 US US07/474,561 patent/US4980536A/en not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6187338A (ja) * | 1984-10-05 | 1986-05-02 | Nec Corp | 多重ビ−ム照射Si表面ドライ洗浄法 |
JPS6263929U (ja) * | 1985-10-12 | 1987-04-21 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010536066A (ja) * | 2007-08-09 | 2010-11-25 | レイヴ リミテッド ライアビリティ カンパニー | 間接表面清浄化のための装置及び方法 |
Also Published As
Publication number | Publication date |
---|---|
EP0297506A2 (en) | 1989-01-04 |
JPH0695510B2 (ja) | 1994-11-24 |
DE3721940A1 (de) | 1989-01-12 |
DE3721940C2 (ja) | 1989-04-06 |
DE3856187D1 (de) | 1998-06-25 |
US4980536A (en) | 1990-12-25 |
EP0297506B1 (en) | 1998-05-20 |
EP0297506A3 (en) | 1991-11-27 |
DE3856187T2 (de) | 1999-02-04 |
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