SG78282A1 - A method for removing surface contaminants on moulds used in semiconductor packaging tools - Google Patents

A method for removing surface contaminants on moulds used in semiconductor packaging tools

Info

Publication number
SG78282A1
SG78282A1 SG1997004544A SG1997004544A SG78282A1 SG 78282 A1 SG78282 A1 SG 78282A1 SG 1997004544 A SG1997004544 A SG 1997004544A SG 1997004544 A SG1997004544 A SG 1997004544A SG 78282 A1 SG78282 A1 SG 78282A1
Authority
SG
Singapore
Prior art keywords
semiconductor packaging
removing surface
surface contaminants
moulds used
packaging tools
Prior art date
Application number
SG1997004544A
Inventor
Lu Yong Feng
Song Wen Song
Gow Cheng Pak
Chen Qiong
Tay Huck Wee
Hwa Teik Hing Thomas
Lim Lui Chin Dawn
Jason Ngin Yan Koon
Jason Sim Yak Hui
Original Assignee
Advanced Systems Automation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Systems Automation filed Critical Advanced Systems Automation
Priority to SG1997004544A priority Critical patent/SG78282A1/en
Priority to TW087106779A priority patent/TW480689B/en
Priority to MYPI98002099A priority patent/MY136708A/en
Priority to CNB988122863A priority patent/CN1210113C/en
Priority to PCT/SG1998/000058 priority patent/WO1999030845A1/en
Priority to EP98936795A priority patent/EP1039977A4/en
Priority to JP2000538813A priority patent/JP2002508249A/en
Publication of SG78282A1 publication Critical patent/SG78282A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
    • B08B7/0042—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like by laser

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Cleaning In General (AREA)
  • Laser Beam Processing (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
SG1997004544A 1997-12-18 1997-12-18 A method for removing surface contaminants on moulds used in semiconductor packaging tools SG78282A1 (en)

Priority Applications (7)

Application Number Priority Date Filing Date Title
SG1997004544A SG78282A1 (en) 1997-12-18 1997-12-18 A method for removing surface contaminants on moulds used in semiconductor packaging tools
TW087106779A TW480689B (en) 1997-12-18 1998-05-01 An efficient semiconductor packaging process suitable for high-volume production of semiconductor devices
MYPI98002099A MY136708A (en) 1997-12-18 1998-05-08 A method for removing surface contaminants on moulds used in semiconductor packaging tools
CNB988122863A CN1210113C (en) 1997-12-18 1998-07-06 Method for removing surface contaminants on moulds used in semiconductor packaging tools
PCT/SG1998/000058 WO1999030845A1 (en) 1997-12-18 1998-07-06 A method for removing surface contaminants on moulds used in semiconductor packaging tools
EP98936795A EP1039977A4 (en) 1997-12-18 1998-07-06 A method for removing surface contaminants on moulds used in semiconductor packaging tools
JP2000538813A JP2002508249A (en) 1997-12-18 1998-07-06 Method for removing surface contaminants of a mold used in a semiconductor package tool

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG1997004544A SG78282A1 (en) 1997-12-18 1997-12-18 A method for removing surface contaminants on moulds used in semiconductor packaging tools

Publications (1)

Publication Number Publication Date
SG78282A1 true SG78282A1 (en) 2001-02-20

Family

ID=20429813

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1997004544A SG78282A1 (en) 1997-12-18 1997-12-18 A method for removing surface contaminants on moulds used in semiconductor packaging tools

Country Status (7)

Country Link
EP (1) EP1039977A4 (en)
JP (1) JP2002508249A (en)
CN (1) CN1210113C (en)
MY (1) MY136708A (en)
SG (1) SG78282A1 (en)
TW (1) TW480689B (en)
WO (1) WO1999030845A1 (en)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4630442B2 (en) * 2000-10-19 2011-02-09 Ｔｏｗａ株式会社 Resin molding apparatus and resin molding method
JP3789349B2 (en) * 2001-11-16 2006-06-21 Ｔｏｗａ株式会社 Method and apparatus for cleaning mold for resin molding
TW552188B (en) * 2001-11-16 2003-09-11 Towa Corp Apparatus and method for evaluating degree of adhesion of adherents to mold surface, apparatus and method for surface treatment of mold surface and method and apparatus for cleaning mold used for molding resin
JP2004230750A (en) * 2003-01-31 2004-08-19 Sumitomo Heavy Ind Ltd Mold cleaning method and device
KR100626037B1 (en) 2004-11-18 2006-09-20 삼성에스디아이 주식회사 Method of descaling mask
JP2006317726A (en) * 2005-05-13 2006-11-24 Nec Lcd Technologies Ltd Method for correcting disconnection, method for manufacturing active matrix substrate, and display apparatus
JP5314876B2 (en) * 2006-11-22 2013-10-16 アピックヤマダ株式会社 Resin molding apparatus and resin molding method
CN104043617A (en) * 2014-05-19 2014-09-17 南京南车浦镇城轨车辆有限责任公司 Laser cleaning equipment for oil stain on metallic surface
BR112018075413A2 (en) 2016-09-26 2019-04-09 Saint-Gobain Glass France device and method for producing and method for producing a stamped functional coating for a glass layer
GB201701607D0 (en) * 2017-01-31 2017-03-15 Advanced Laser Tech Ltd Scanning and cleaning of moulds
CN107377532A (en) * 2017-08-25 2017-11-24 济南高能清扬激光清洗有限公司 A kind of compound cleaning method of rubber mould
CN108816960B (en) * 2018-06-14 2020-06-26 爱阔特(上海)清洗设备制造有限公司 Semiconductor photoetching plate cleaning device
CN108807129B (en) * 2018-06-21 2020-09-01 北京蜃景光电科技有限公司 Coating chamber cleaning device and coating chamber cleaning method
CN108787631A (en) * 2018-07-09 2018-11-13 江苏峰钛激光科技有限公司 A kind of laser cleaning method of heavy corrosion layer
JP2020006600A (en) * 2018-07-10 2020-01-16 Ｔｏｗａ株式会社 Mold cleaning device and method, resin molding apparatus, and manufacturing method of resin molded article
JP6930946B2 (en) * 2018-07-10 2021-09-01 Ｔｏｗａ株式会社 Mold cleaning equipment, mold cleaning method, resin molding equipment, and resin molded product manufacturing method
CN111375603A (en) * 2018-12-29 2020-07-07 膳魔师（江苏）家庭制品有限公司 Paint removing method and device for vacuum cup
CN110303009B (en) * 2019-06-26 2020-10-16 深圳市华星光电技术有限公司 Ultraviolet light cleaning device

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DD242760A1 (en) * 1985-11-19 1987-02-11 Akad Wissenschaften Ddr METHOD FOR TESTING THE PURITY OF SUBSTRATE SURFACES AND CLEANING THE SAME
ES2019931B3 (en) * 1986-02-14 1991-07-16 Amoco Corp ULTRAVIOLET LASER TREATMENT OF MOLDED SURFACES.
DE3721940A1 (en) * 1987-07-02 1989-01-12 Ibm Deutschland REMOVAL OF PARTICLES FROM SURFACES OF SOLID BODY BY LASER Bombardment
JPH01122417A (en) * 1987-11-06 1989-05-15 Rohm Co Ltd Cleaning method for mold for synthetic resin molding
US5023424A (en) * 1990-01-22 1991-06-11 Tencor Instruments Shock wave particle removal method and apparatus
US5373140A (en) * 1993-03-16 1994-12-13 Vernay Laboratories, Inc. System for cleaning molding equipment using a laser
IT1282722B1 (en) * 1996-03-01 1998-03-31 Pirelli METHOD AND APPARATUS FOR THE CLEANING OF VULCANIZATION MOLDS OF ELASTOMERIC MATERIAL ARTICLES

Also Published As

Publication number Publication date
JP2002508249A (en) 2002-03-19
WO1999030845A1 (en) 1999-06-24
MY136708A (en) 2008-11-28
CN1210113C (en) 2005-07-13
EP1039977A4 (en) 2003-08-13
EP1039977A1 (en) 2000-10-04
CN1282277A (en) 2001-01-31
TW480689B (en) 2002-03-21

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