DE3856187T2 - Entfernen von Teilchen von Festkörperoberflächen mittels Laserbestrahlung - Google Patents

Entfernen von Teilchen von Festkörperoberflächen mittels Laserbestrahlung

Info

Publication number
DE3856187T2
DE3856187T2 DE3856187T DE3856187T DE3856187T2 DE 3856187 T2 DE3856187 T2 DE 3856187T2 DE 3856187 T DE3856187 T DE 3856187T DE 3856187 T DE3856187 T DE 3856187T DE 3856187 T2 DE3856187 T2 DE 3856187T2
Authority
DE
Germany
Prior art keywords
particles
removal
laser radiation
solid surfaces
solid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE3856187T
Other languages
English (en)
Other versions
DE3856187D1 (de
Inventor
Karl Asch
Joachim Keyser
Klaus Meissner
Werner Zapka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
IBM Deutschland GmbH
Original Assignee
IBM Deutschland GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by IBM Deutschland GmbH filed Critical IBM Deutschland GmbH
Priority to DE3856187T priority Critical patent/DE3856187T2/de
Publication of DE3856187D1 publication Critical patent/DE3856187D1/de
Application granted granted Critical
Publication of DE3856187T2 publication Critical patent/DE3856187T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
    • B08B7/0042—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like by laser
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/82—Auxiliary processes, e.g. cleaning or inspecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26—Bombardment with radiation
    • H01L21/263—Bombardment with radiation with high-energy radiation
    • H01L21/268—Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/20—Masks or mask blanks for imaging by charged particle beam [CPB] radiation, e.g. by electron beam; Preparation thereof

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Toxicology (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Laser Beam Processing (AREA)
  • Electron Beam Exposure (AREA)
DE3856187T 1987-07-02 1988-06-28 Entfernen von Teilchen von Festkörperoberflächen mittels Laserbestrahlung Expired - Fee Related DE3856187T2 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE3856187T DE3856187T2 (de) 1987-07-02 1988-06-28 Entfernen von Teilchen von Festkörperoberflächen mittels Laserbestrahlung

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19873721940 DE3721940A1 (de) 1987-07-02 1987-07-02 Entfernen von partikeln von oberflaechen fester koerper durch laserbeschuss
DE3856187T DE3856187T2 (de) 1987-07-02 1988-06-28 Entfernen von Teilchen von Festkörperoberflächen mittels Laserbestrahlung

Publications (2)

Publication Number Publication Date
DE3856187D1 DE3856187D1 (de) 1998-06-25
DE3856187T2 true DE3856187T2 (de) 1999-02-04

Family

ID=6330792

Family Applications (2)

Application Number Title Priority Date Filing Date
DE19873721940 Granted DE3721940A1 (de) 1987-07-02 1987-07-02 Entfernen von partikeln von oberflaechen fester koerper durch laserbeschuss
DE3856187T Expired - Fee Related DE3856187T2 (de) 1987-07-02 1988-06-28 Entfernen von Teilchen von Festkörperoberflächen mittels Laserbestrahlung

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE19873721940 Granted DE3721940A1 (de) 1987-07-02 1987-07-02 Entfernen von partikeln von oberflaechen fester koerper durch laserbeschuss

Country Status (4)

Country Link
US (1) US4980536A (de)
EP (1) EP0297506B1 (de)
JP (1) JPH0695510B2 (de)
DE (2) DE3721940A1 (de)

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US5643472A (en) * 1988-07-08 1997-07-01 Cauldron Limited Partnership Selective removal of material by irradiation
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DE4241575A1 (de) * 1992-12-10 1994-06-16 Baldwin Gegenheimer Gmbh Verfahren und Vorrichtung zum kontaktfreien Entfernen von Schmutz von Gegenständen, insbesondere von Druckmaschinen-Zylindern
DE4301410A1 (de) * 1993-01-20 1994-07-21 Baldwin Gegenheimer Gmbh Druckmaschinen-Reinigungsvorrichtung
DE4332866C2 (de) * 1993-09-27 1997-12-18 Fraunhofer Ges Forschung Direkte Oberflächenbehandlung mit Barrierenentladung
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JP3728829B2 (ja) * 1996-10-11 2005-12-21 株式会社ニコン 荷電粒子線投影装置
US5742065A (en) * 1997-01-22 1998-04-21 International Business Machines Corporation Heater for membrane mask in an electron-beam lithography system
JPH10223512A (ja) * 1997-02-10 1998-08-21 Nikon Corp 電子ビーム投影露光装置
SG78282A1 (en) * 1997-12-18 2001-02-20 Advanced Systems Automation A method for removing surface contaminants on moulds used in semiconductor packaging tools
SG77617A1 (en) * 1997-12-18 2001-01-16 Advanced Systems Automation A system for removing surface contaminants on moulds used in semiconductor packaging tools
JP3518723B2 (ja) * 1998-05-25 2004-04-12 トヨタ自動車株式会社 肉盛方法
WO1999065061A2 (en) * 1998-06-08 1999-12-16 Advanced Systems Automation Limited A portable laser cleaning device for semiconductor packaging machines
DE19830438A1 (de) 1998-07-08 2000-01-13 Zeiss Carl Fa Verfahren zur Dekontamination von Mikrolithographie-Projektionsbelichtungsanlagen
US6385290B1 (en) 1998-09-14 2002-05-07 Nikon Corporation X-ray apparatus
US6407385B1 (en) 1998-12-18 2002-06-18 Nikon Corporation Methods and apparatus for removing particulate foreign matter from the surface of a sample
IL127720A0 (en) 1998-12-24 1999-10-28 Oramir Semiconductor Ltd Local particle cleaning
DE19941399A1 (de) * 1999-08-31 2001-04-19 Infineon Technologies Ag Reinigung von Stencilmasken mit Hilfe einer durch Maskenöffnungen hindurchtretenden Gasströmung
US6881687B1 (en) 1999-10-29 2005-04-19 Paul P. Castrucci Method for laser cleaning of a substrate surface using a solid sacrificial film
US6627846B1 (en) 1999-12-16 2003-09-30 Oramir Semiconductor Equipment Ltd. Laser-driven cleaning using reactive gases
US6582857B1 (en) 2000-03-16 2003-06-24 International Business Machines Corporation Repair of masks to promote adhesion of patches
AU2003244399A1 (en) * 2002-02-01 2003-09-02 Samuel W. Bross Method and apparatus for cleaning with electromagnetic radiation
DE10208718A1 (de) * 2002-02-28 2003-10-02 Wacker Siltronic Halbleitermat Verfahren zur Entfernung von Partikeln von Oberflächen
JP2003302745A (ja) * 2002-04-12 2003-10-24 Dainippon Printing Co Ltd 異物の無害化方法
US6908567B2 (en) * 2002-07-30 2005-06-21 Applied Materials Israel, Ltd. Contaminant removal by laser-accelerated fluid
SG114560A1 (en) * 2002-07-31 2005-09-28 Inst Data Storage A method and apparatus for cleaning surfaces
US6829035B2 (en) * 2002-11-12 2004-12-07 Applied Materials Israel, Ltd. Advanced mask cleaning and handling
US6864458B2 (en) * 2003-01-21 2005-03-08 Applied Materials, Inc. Iced film substrate cleaning
US20040224508A1 (en) * 2003-05-06 2004-11-11 Applied Materials Israel Ltd Apparatus and method for cleaning a substrate using a homogenized and non-polarized radiation beam
US20050279453A1 (en) 2004-06-17 2005-12-22 Uvtech Systems, Inc. System and methods for surface cleaning
DE102004047798A1 (de) * 2004-09-29 2006-04-06 Robert Bosch Gmbh Verfahren zur Reinigung eines Resonators
JP2006114650A (ja) * 2004-10-14 2006-04-27 Canon Inc 露光装置、走査露光装置、デバイス製造方法、原版のクリーニング方法、および原版
JP2007027419A (ja) * 2005-07-15 2007-02-01 Canon Inc 露光装置
JP2008147314A (ja) * 2006-12-07 2008-06-26 Canon Inc 洗浄装置及び方法、洗浄装置を有する露光装置
US11311917B2 (en) 2007-08-09 2022-04-26 Bruker Nano, Inc. Apparatus and method for contamination identification
US7993464B2 (en) * 2007-08-09 2011-08-09 Rave, Llc Apparatus and method for indirect surface cleaning
US9221148B2 (en) 2009-04-30 2015-12-29 Rdc Holdings, Llc Method and apparatus for processing sliders for disk drives, and to various processing media for the same
US8801497B2 (en) 2009-04-30 2014-08-12 Rdc Holdings, Llc Array of abrasive members with resilient support
US20100330890A1 (en) 2009-06-30 2010-12-30 Zine-Eddine Boutaghou Polishing pad with array of fluidized gimballed abrasive members
WO2012164546A2 (en) 2011-06-03 2012-12-06 Ecole Polytechnique Federale De Lausanne (Epfl) Microheater-based in situ self-cleaning dynamic stencil lithography
AT513222B1 (de) * 2012-08-03 2016-11-15 Haas Food Equipment Gmbh Verfahren und Vorrichtung zur Reinigung von Backoberflächen
WO2019158511A1 (de) * 2018-02-14 2019-08-22 Basf Se Verfahren zur reinigung von lochplatten
KR20230029584A (ko) * 2020-02-28 2023-03-03 뉴테크 엘엘씨 땜납 페이스트 스텐실의 표면 수정
CN113376956A (zh) * 2021-05-07 2021-09-10 深圳市路维光电股份有限公司 光罩内部清洁方法及清洁装置
DE102021123943A1 (de) * 2021-09-16 2023-03-16 Miele & Cie. Kg Aufnahmevorrichtung zum Aufnehmen mindestens eines Schlauchs für ein Reinigungsgerät und Reinigungsgerät

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Also Published As

Publication number Publication date
JPS6412526A (en) 1989-01-17
EP0297506A2 (de) 1989-01-04
DE3856187D1 (de) 1998-06-25
DE3721940A1 (de) 1989-01-12
DE3721940C2 (de) 1989-04-06
EP0297506A3 (de) 1991-11-27
US4980536A (en) 1990-12-25
EP0297506B1 (de) 1998-05-20
JPH0695510B2 (ja) 1994-11-24

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee