JPS6395639A - テ−プキヤリア - Google Patents

テ−プキヤリア

Info

Publication number
JPS6395639A
JPS6395639A JP61241669A JP24166986A JPS6395639A JP S6395639 A JPS6395639 A JP S6395639A JP 61241669 A JP61241669 A JP 61241669A JP 24166986 A JP24166986 A JP 24166986A JP S6395639 A JPS6395639 A JP S6395639A
Authority
JP
Japan
Prior art keywords
center device
lead
leads
semiconductor element
tape carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61241669A
Other languages
English (en)
Japanese (ja)
Other versions
JPH055376B2 (enrdf_load_stackoverflow
Inventor
Tetsuya Ueda
哲也 上田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP61241669A priority Critical patent/JPS6395639A/ja
Publication of JPS6395639A publication Critical patent/JPS6395639A/ja
Publication of JPH055376B2 publication Critical patent/JPH055376B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Wire Bonding (AREA)
JP61241669A 1986-10-09 1986-10-09 テ−プキヤリア Granted JPS6395639A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61241669A JPS6395639A (ja) 1986-10-09 1986-10-09 テ−プキヤリア

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61241669A JPS6395639A (ja) 1986-10-09 1986-10-09 テ−プキヤリア

Publications (2)

Publication Number Publication Date
JPS6395639A true JPS6395639A (ja) 1988-04-26
JPH055376B2 JPH055376B2 (enrdf_load_stackoverflow) 1993-01-22

Family

ID=17077754

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61241669A Granted JPS6395639A (ja) 1986-10-09 1986-10-09 テ−プキヤリア

Country Status (1)

Country Link
JP (1) JPS6395639A (enrdf_load_stackoverflow)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6481330A (en) * 1987-09-24 1989-03-27 Nec Corp Film carrier semiconductor device
US5198883A (en) * 1988-08-06 1993-03-30 Kabushiki Kaisha Toshiba Semiconductor device having an improved lead arrangement and method for manufacturing the same
WO1994024698A1 (en) * 1993-04-08 1994-10-27 Seiko Epson Corporation Semiconductor device
US6084291A (en) * 1997-05-26 2000-07-04 Seiko Epson Corporation Tape carrier for TAB, integrated circuit device, a method of making the same, and an electronic device
US6124547A (en) * 1997-02-17 2000-09-26 Seiko Epson Corporation Tape carrier package

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS502669U (enrdf_load_stackoverflow) * 1973-05-08 1975-01-11
JPS572669U (enrdf_load_stackoverflow) * 1980-06-05 1982-01-08
JPS5817630A (ja) * 1981-07-13 1983-02-01 フエアチアイルド・カメラ・アンド・インストルメント・コ−ポレ−シヨン 集回路用のテ−プ自動ボンデイング
JPS59132641A (ja) * 1983-01-20 1984-07-30 Seiko Epson Corp Ｉｃ実装構造
JPS6016102A (ja) * 1983-07-08 1985-01-26 Nissan Motor Co Ltd 電気自動車の走行制御装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS502669U (enrdf_load_stackoverflow) * 1973-05-08 1975-01-11
JPS572669U (enrdf_load_stackoverflow) * 1980-06-05 1982-01-08
JPS5817630A (ja) * 1981-07-13 1983-02-01 フエアチアイルド・カメラ・アンド・インストルメント・コ−ポレ−シヨン 集回路用のテ−プ自動ボンデイング
JPS59132641A (ja) * 1983-01-20 1984-07-30 Seiko Epson Corp Ｉｃ実装構造
JPS6016102A (ja) * 1983-07-08 1985-01-26 Nissan Motor Co Ltd 電気自動車の走行制御装置

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6481330A (en) * 1987-09-24 1989-03-27 Nec Corp Film carrier semiconductor device
US5198883A (en) * 1988-08-06 1993-03-30 Kabushiki Kaisha Toshiba Semiconductor device having an improved lead arrangement and method for manufacturing the same
WO1994024698A1 (en) * 1993-04-08 1994-10-27 Seiko Epson Corporation Semiconductor device
US5563445A (en) * 1993-04-08 1996-10-08 Seiko Epson Corporation Semiconductor device
US6124547A (en) * 1997-02-17 2000-09-26 Seiko Epson Corporation Tape carrier package
US6084291A (en) * 1997-05-26 2000-07-04 Seiko Epson Corporation Tape carrier for TAB, integrated circuit device, a method of making the same, and an electronic device
US6342727B1 (en) 1997-05-26 2002-01-29 Seiko Epson Corporation Tape carrier device for a tab

Also Published As

Publication number Publication date
JPH055376B2 (enrdf_load_stackoverflow) 1993-01-22

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