JPS6387831U - - Google Patents
Info
- Publication number
- JPS6387831U JPS6387831U JP1986181596U JP18159686U JPS6387831U JP S6387831 U JPS6387831 U JP S6387831U JP 1986181596 U JP1986181596 U JP 1986181596U JP 18159686 U JP18159686 U JP 18159686U JP S6387831 U JPS6387831 U JP S6387831U
- Authority
- JP
- Japan
- Prior art keywords
- handling
- suction port
- utility
- gripped
- vacuum tweezers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 235000012431 wafers Nutrition 0.000 claims 7
- 239000004065 semiconductor Substances 0.000 claims 5
- 239000000463 material Substances 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53191—Means to apply vacuum directly to position or hold work part
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manipulator (AREA)
- Gripping Jigs, Holding Jigs, And Positioning Jigs (AREA)
Description
【図面の簡単な説明】
第1図1並びにbは、本考案に従う真空ピンセ
ツトの一実施例の構成を概略的に示すものであり
、第1図aは平面図、第1図bは側面図であり、
第2図は、第1図に示した真空ピンセツトの斜視
図である。 (主な参照番号)、1……ハンドリング部、1
1……吸着口、12……シール部材、12a……
内側シール部材、12b……外側シール部材、2
……把手、21……把手の開口部、22……耐圧
チユーブ、3……半導体ウエハ、31……半導体
ウエハ表面加工領域、32……半導体ウエハ表面
の非加工領域。
ツトの一実施例の構成を概略的に示すものであり
、第1図aは平面図、第1図bは側面図であり、
第2図は、第1図に示した真空ピンセツトの斜視
図である。 (主な参照番号)、1……ハンドリング部、1
1……吸着口、12……シール部材、12a……
内側シール部材、12b……外側シール部材、2
……把手、21……把手の開口部、22……耐圧
チユーブ、3……半導体ウエハ、31……半導体
ウエハ表面加工領域、32……半導体ウエハ表面
の非加工領域。
補正 昭62.2.23
図面の簡単な説明を次のように補正する。
明細書第14頁第9行に「第1図1」とあるの
を「第1図a」と訂正する。
を「第1図a」と訂正する。
Claims (1)
- 【実用新案登録請求の範囲】 (1) 半導体ウエハを取り扱う器具であつて、 把持すべき半導体ウエハよりも狭い領域で同一
平面上に開口する少なくとも1つの吸引口を備え
たハンドリング部と、前記吸引口と結合された減
圧手段と、該減圧手段による負圧を解放する手段
と、前記ハンドリング部と一体に構成された把手
と、を備えることを特徴とする真空ピンセツト。 (2) 前記ハンドリング部の吸引口が、把持すべ
き半導体ウエハの非加工領域に対応するように配
置されていることを特徴とする実用新案登録請求
の範囲第1項に記載の真空ピンセツト。 (3) 前記ハンドリング部の前記吸引口が開口す
る面上に、該面と把持すべきウエハの表面との間
に気密に介在し、前記減圧手段による負圧を保持
する弾性部材を備えることを特徴とする実用新案
登録請求の範囲第1項または第2項に記載の真空
ピンセツト。 (4) 前記ハンドリング部の吸引口が開口する面
上に、把持すべきウエハの表面を損傷しない柔軟
な材料が被覆されていることを特徴とする実用新
案登録請求の範囲第1項または第3項に記載の真
空ピンセツト。 (5) 前記減圧手段が、前記吸引口と充分に長い
接続管を介して結合された真空ポンプであること
を特徴とする実用新案登録請求の範囲第1項乃至
第4項に記載の真空ピンセツト。 (6) 前記負圧解放手段が、前記吸引口と前記減
圧手段との間の減圧系に連通し、指で閉塞可能な
寸法を有する前記把手上の開口であることを特徴
とする実用新案登録請求の範囲第1項乃至第5項
に記載の真空ピンセツト。 (7) 上記ハンドリング部の形状が、把持すべき
半導体ウエハの少なくとも非加工領域を覆うに足
る寸法を有する環状の一部を切り欠いた部分環形
状であることを特徴とする実用新案登録請求の範
囲第1項乃至第6項のいずれか1項に記載の真空
ピンセツト。 (8) 前記把手が、前記ハンドリング部に対して
、前記半導体ウエハの吸引面を含む面から遠ざか
る方向に延在していることを特徴とする実用新案
登録請求の範囲第1項乃至第7項に記載のピンセ
ツト。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986181596U JPS6387831U (ja) | 1986-11-26 | 1986-11-26 | |
EP87117420A EP0269097B1 (en) | 1986-11-26 | 1987-11-25 | Vacuum tweezers |
DE87117420T DE3787873T2 (de) | 1986-11-26 | 1987-11-25 | Vakuumpinzette. |
KR1019870013323A KR910009451B1 (ko) | 1986-11-26 | 1987-11-26 | 진공핀셋 |
US07/293,614 US4904012A (en) | 1986-11-26 | 1989-01-05 | Suction device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986181596U JPS6387831U (ja) | 1986-11-26 | 1986-11-26 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6387831U true JPS6387831U (ja) | 1988-06-08 |
Family
ID=16103575
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1986181596U Pending JPS6387831U (ja) | 1986-11-26 | 1986-11-26 |
Country Status (5)
Country | Link |
---|---|
US (1) | US4904012A (ja) |
EP (1) | EP0269097B1 (ja) |
JP (1) | JPS6387831U (ja) |
KR (1) | KR910009451B1 (ja) |
DE (1) | DE3787873T2 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH049271U (ja) * | 1990-05-14 | 1992-01-27 | ||
JP2007258206A (ja) * | 2006-03-20 | 2007-10-04 | Disco Abrasive Syst Ltd | ウエーハの保持パッド |
JP2014204089A (ja) * | 2013-04-09 | 2014-10-27 | 株式会社ディスコ | ウェーハ搬送機構及びウェーハの加工方法 |
Families Citing this family (52)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2624778B1 (fr) * | 1987-12-22 | 1994-09-23 | Recif Sa | Embout pour pipette a vide |
US5374090A (en) * | 1993-03-10 | 1994-12-20 | Advanced Micro Devices, Inc. | Cordless vacuum wand |
US5549340A (en) * | 1993-10-14 | 1996-08-27 | Smc Kabushiki Kaisha | Suction pad |
DE4342901A1 (de) * | 1993-12-16 | 1995-06-22 | Itt Ind Gmbh Deutsche | Saugpinzettenkopf |
JPH08148709A (ja) * | 1994-11-15 | 1996-06-07 | Mitsubishi Electric Corp | 薄型太陽電池の製造方法及び薄型太陽電池の製造装置 |
US5904697A (en) | 1995-02-24 | 1999-05-18 | Heartport, Inc. | Devices and methods for performing a vascular anastomosis |
US5888247A (en) * | 1995-04-10 | 1999-03-30 | Cardiothoracic Systems, Inc | Method for coronary artery bypass |
DE29512381U1 (de) * | 1995-08-01 | 1995-10-12 | Leybold Ag, 63450 Hanau | Vorrichtung zum Halten, für den Transport und für die Bearbeitung eines flachen, kreisscheibenförmigen Substrats |
US5836311A (en) * | 1995-09-20 | 1998-11-17 | Medtronic, Inc. | Method and apparatus for temporarily immobilizing a local area of tissue |
US7445594B1 (en) | 1995-09-20 | 2008-11-04 | Medtronic, Inc. | Method and apparatus for temporarily immobilizing a local area of tissue |
US6852075B1 (en) * | 1996-02-20 | 2005-02-08 | Cardiothoracic Systems, Inc. | Surgical devices for imposing a negative pressure to stabilize cardiac tissue during surgery |
US5915915A (en) * | 1996-03-07 | 1999-06-29 | Komag, Incorporated | End effector and method for loading and unloading disks at a processing station |
JP3771320B2 (ja) * | 1996-03-29 | 2006-04-26 | コマツ電子金属株式会社 | 半導体ウェハの貼付方法及び貼付装置 |
US5765890A (en) * | 1996-10-03 | 1998-06-16 | Memc Electronic Materials, Inc. | Device for transferring a semiconductor wafer |
US6390976B1 (en) * | 1997-09-17 | 2002-05-21 | Origin Medsystems, Inc. | System to permit offpump beating heart coronary bypass surgery |
US6019722A (en) * | 1997-09-17 | 2000-02-01 | Guidant Corporation | Device to permit offpump beating heart coronary bypass surgery |
US6969349B1 (en) * | 1997-09-17 | 2005-11-29 | Origin Medsystem, Inc. | Device to permit offpump beating heart coronary bypass surgery |
US6338712B2 (en) * | 1997-09-17 | 2002-01-15 | Origin Medsystems, Inc. | Device to permit offpump beating heart coronary bypass surgery |
US6072898A (en) | 1998-01-16 | 2000-06-06 | Beaty; Elwin M. | Method and apparatus for three dimensional inspection of electronic components |
JP4153167B2 (ja) | 1998-09-15 | 2008-09-17 | メドトロニック・インコーポレーテッド | 組織の局部的領域を一時的に固定するための方法及び装置 |
US6254155B1 (en) * | 1999-01-11 | 2001-07-03 | Strasbaugh, Inc. | Apparatus and method for reliably releasing wet, thin wafers |
IT1308606B1 (it) * | 1999-02-12 | 2002-01-08 | Lpe Spa | Dispositivo per maneggiare substrati mediante un istema autolivellante a depressione in reattori epistassiali ad induzione con suscettore |
US6511416B1 (en) * | 1999-08-03 | 2003-01-28 | Cardiothoracic Systems, Inc. | Tissue stabilizer and methods of use |
US6506149B2 (en) | 1999-09-07 | 2003-01-14 | Origin Medsystems, Inc. | Organ manipulator having suction member supported with freedom to move relative to its support |
US7338434B1 (en) | 2002-08-21 | 2008-03-04 | Medtronic, Inc. | Method and system for organ positioning and stabilization |
EP1220596A1 (en) * | 2000-12-29 | 2002-07-03 | Icos Vision Systems N.V. | A method and an apparatus for measuring positions of contact elements of an electronic component |
US6612590B2 (en) * | 2001-01-12 | 2003-09-02 | Tokyo Electron Limited | Apparatus and methods for manipulating semiconductor wafers |
US6676597B2 (en) | 2001-01-13 | 2004-01-13 | Medtronic, Inc. | Method and device for organ positioning |
US6758808B2 (en) * | 2001-01-24 | 2004-07-06 | Cardiothoracic System, Inc. | Surgical instruments for stabilizing a localized portion of a beating heart |
US6680774B1 (en) * | 2001-10-09 | 2004-01-20 | Ultratech Stepper, Inc. | Method and apparatus for mechanically masking a workpiece |
US7104578B2 (en) * | 2002-03-15 | 2006-09-12 | Asm International N.V. | Two level end effector |
US7494460B2 (en) * | 2002-08-21 | 2009-02-24 | Medtronic, Inc. | Methods and apparatus providing suction-assisted tissue engagement through a minimally invasive incision |
US6808216B2 (en) | 2002-08-30 | 2004-10-26 | Cardinal Ig Company | Methods and apparatus for handling workpieces |
US7931590B2 (en) * | 2002-10-29 | 2011-04-26 | Maquet Cardiovascular Llc | Tissue stabilizer and methods of using the same |
DE10259836A1 (de) * | 2002-12-19 | 2004-07-15 | Siemens Ag | Greifer und Betriebsverfahren |
US7105056B2 (en) * | 2002-12-30 | 2006-09-12 | Cardinal Cg Company | Pneumatic handling and recoating apparatus and method of use |
US20040212205A1 (en) * | 2003-01-30 | 2004-10-28 | Linker Frank V. | Method and apparatus for handling semiconductor wafers and interleafs |
US7479104B2 (en) | 2003-07-08 | 2009-01-20 | Maquet Cardiovascular, Llc | Organ manipulator apparatus |
US7181132B2 (en) | 2003-08-20 | 2007-02-20 | Asm International N.V. | Method and system for loading substrate supports into a substrate holder |
US7179224B2 (en) * | 2003-12-30 | 2007-02-20 | Cardiothoracic Systems, Inc. | Organ manipulator and positioner and methods of using the same |
US7399272B2 (en) | 2004-03-24 | 2008-07-15 | Medtronic, Inc. | Methods and apparatus providing suction-assisted tissue engagement |
DE102004018250A1 (de) * | 2004-04-15 | 2005-11-03 | Infineon Technologies Ag | Wafer-Stabilisierungsvorrichtung und Verfahren zu dessen Herstellung |
US8083664B2 (en) | 2005-05-25 | 2011-12-27 | Maquet Cardiovascular Llc | Surgical stabilizers and methods for use in reduced-access surgical sites |
US20070088203A1 (en) * | 2005-05-25 | 2007-04-19 | Liming Lau | Surgical assemblies and methods for visualizing and performing surgical procedures in reduced-access surgical sites |
US7794387B2 (en) | 2006-04-26 | 2010-09-14 | Medtronic, Inc. | Methods and devices for stabilizing tissue |
US7936447B2 (en) * | 2006-05-08 | 2011-05-03 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
GB2470035B (en) * | 2009-05-06 | 2013-12-18 | Belron Hungary Kft Zug Branch | Suction lifting device for glazing panels with cantilever handle |
BR112012032039B1 (pt) | 2010-06-14 | 2020-12-15 | Maquet Cardiovascular Llc | Instrumentos cirúrgicos |
US8714611B2 (en) * | 2010-07-23 | 2014-05-06 | Ev Group Gmbh | Handling device for handling of a wafer |
EP2729962B1 (de) * | 2011-08-12 | 2019-11-13 | Ev Group E. Thallner GmbH | Aufnahmeeinrichtung zur aufnahme eines strukturierten wafers |
US20130105089A1 (en) * | 2011-10-28 | 2013-05-02 | Industrial Technology Research Institute | Method for separating substrate assembly |
JP6380160B2 (ja) | 2015-02-25 | 2018-08-29 | 三菱電機株式会社 | 真空ピンセット及び半導体装置の製造方法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62287639A (ja) * | 1986-06-05 | 1987-12-14 | Nitto Electric Ind Co Ltd | 薄板回路基板における感圧性粘着テ−プの貼着方法 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US1302028A (en) * | 1914-07-13 | 1919-04-29 | Westinghouse Electric & Mfg Co | Sheet-handling implement. |
US2916059A (en) * | 1958-02-18 | 1959-12-08 | Lan J Wong | Evacuation valve cup |
US3224106A (en) * | 1961-05-31 | 1965-12-21 | David G Way | Method and apparatus for use in assembling ring sections about a shaft with their end faces co-planar |
US3466079A (en) * | 1965-09-08 | 1969-09-09 | Western Electric Co | Pressurized fluid pickup device |
US3523706A (en) * | 1967-10-27 | 1970-08-11 | Ibm | Apparatus for supporting articles without structural contact and for positioning the supported articles |
US3517958A (en) * | 1968-06-17 | 1970-06-30 | Ibm | Vacuum pick-up with air shield |
US3608946A (en) * | 1968-11-19 | 1971-09-28 | Dow Chemical Co | Device for handling of a filter membrane |
US4050729A (en) * | 1976-04-20 | 1977-09-27 | Hutson Clifford L | Apparatus for handling delicate articles such as silicon wafers |
DE2628488A1 (de) * | 1976-06-25 | 1978-01-05 | Siemens Ag | Werkzeug-sortiment fuer eine vakuumgreifpinzette |
DE2631502A1 (de) * | 1976-07-13 | 1978-01-19 | Siemens Ag | Greifwerkzeug fuer eine saugpinzette |
JPS5433678A (en) * | 1977-08-22 | 1979-03-12 | Hitachi Ltd | Vacuum pincette |
EP0201240B1 (en) * | 1985-05-04 | 1992-09-23 | Kabushiki Kaisha Seibu Giken | Apparatus for supporting and/or conveying a plate with fluid without physical contact |
US4618178A (en) * | 1985-06-07 | 1986-10-21 | Clifford L. Hutson | Hand held vacuum actuated pickup instrument |
-
1986
- 1986-11-26 JP JP1986181596U patent/JPS6387831U/ja active Pending
-
1987
- 1987-11-25 DE DE87117420T patent/DE3787873T2/de not_active Expired - Fee Related
- 1987-11-25 EP EP87117420A patent/EP0269097B1/en not_active Expired - Lifetime
- 1987-11-26 KR KR1019870013323A patent/KR910009451B1/ko not_active IP Right Cessation
-
1989
- 1989-01-05 US US07/293,614 patent/US4904012A/en not_active Expired - Lifetime
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62287639A (ja) * | 1986-06-05 | 1987-12-14 | Nitto Electric Ind Co Ltd | 薄板回路基板における感圧性粘着テ−プの貼着方法 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH049271U (ja) * | 1990-05-14 | 1992-01-27 | ||
JP2007258206A (ja) * | 2006-03-20 | 2007-10-04 | Disco Abrasive Syst Ltd | ウエーハの保持パッド |
JP4634949B2 (ja) * | 2006-03-20 | 2011-02-16 | 株式会社ディスコ | ウエーハの保持パッド |
JP2014204089A (ja) * | 2013-04-09 | 2014-10-27 | 株式会社ディスコ | ウェーハ搬送機構及びウェーハの加工方法 |
Also Published As
Publication number | Publication date |
---|---|
DE3787873T2 (de) | 1994-02-10 |
DE3787873D1 (de) | 1993-11-25 |
US4904012A (en) | 1990-02-27 |
EP0269097A3 (en) | 1989-09-13 |
EP0269097A2 (en) | 1988-06-01 |
KR910009451B1 (ko) | 1991-11-16 |
KR880006768A (ko) | 1988-07-25 |
EP0269097B1 (en) | 1993-10-20 |
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