KR880006768A - 진공핀셋 - Google Patents

진공핀셋

Info

Publication number
KR880006768A
KR880006768A KR1019870013323A KR870013323A KR880006768A KR 880006768 A KR880006768 A KR 880006768A KR 1019870013323 A KR1019870013323 A KR 1019870013323A KR 870013323 A KR870013323 A KR 870013323A KR 880006768 A KR880006768 A KR 880006768A
Authority
KR
South Korea
Prior art keywords
vacuum tweezers
tweezers
vacuum
Prior art date
Application number
KR1019870013323A
Other languages
English (en)
Other versions
KR910009451B1 (ko
Inventor
가쯔노리 니시구찌
다께시 세끼구찌
Original Assignee
스미도모덴기고오교오 가부시기가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 스미도모덴기고오교오 가부시기가이샤 filed Critical 스미도모덴기고오교오 가부시기가이샤
Publication of KR880006768A publication Critical patent/KR880006768A/ko
Application granted granted Critical
Publication of KR910009451B1 publication Critical patent/KR910009451B1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53191—Means to apply vacuum directly to position or hold work part

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Gripping Jigs, Holding Jigs, And Positioning Jigs (AREA)
  • Manipulator (AREA)
KR1019870013323A 1986-11-26 1987-11-26 진공핀셋 KR910009451B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP1986181596U JPS6387831U (ko) 1986-11-26 1986-11-26
JP61-181596(U) 1986-11-26

Publications (2)

Publication Number Publication Date
KR880006768A true KR880006768A (ko) 1988-07-25
KR910009451B1 KR910009451B1 (ko) 1991-11-16

Family

ID=16103575

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019870013323A KR910009451B1 (ko) 1986-11-26 1987-11-26 진공핀셋

Country Status (5)

Country Link
US (1) US4904012A (ko)
EP (1) EP0269097B1 (ko)
JP (1) JPS6387831U (ko)
KR (1) KR910009451B1 (ko)
DE (1) DE3787873T2 (ko)

Families Citing this family (55)

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FR2624778B1 (fr) * 1987-12-22 1994-09-23 Recif Sa Embout pour pipette a vide
JP2509802Y2 (ja) * 1990-05-14 1996-09-04 高橋 清 真空ピンセットの吸着具
US5374090A (en) * 1993-03-10 1994-12-20 Advanced Micro Devices, Inc. Cordless vacuum wand
US5549340A (en) * 1993-10-14 1996-08-27 Smc Kabushiki Kaisha Suction pad
DE4342901A1 (de) * 1993-12-16 1995-06-22 Itt Ind Gmbh Deutsche Saugpinzettenkopf
JPH08148709A (ja) * 1994-11-15 1996-06-07 Mitsubishi Electric Corp 薄型太陽電池の製造方法及び薄型太陽電池の製造装置
US5904697A (en) 1995-02-24 1999-05-18 Heartport, Inc. Devices and methods for performing a vascular anastomosis
US5888247A (en) * 1995-04-10 1999-03-30 Cardiothoracic Systems, Inc Method for coronary artery bypass
DE29512381U1 (de) * 1995-08-01 1995-10-12 Leybold Ag, 63450 Hanau Vorrichtung zum Halten, für den Transport und für die Bearbeitung eines flachen, kreisscheibenförmigen Substrats
US7445594B1 (en) 1995-09-20 2008-11-04 Medtronic, Inc. Method and apparatus for temporarily immobilizing a local area of tissue
US5836311A (en) * 1995-09-20 1998-11-17 Medtronic, Inc. Method and apparatus for temporarily immobilizing a local area of tissue
US6852075B1 (en) * 1996-02-20 2005-02-08 Cardiothoracic Systems, Inc. Surgical devices for imposing a negative pressure to stabilize cardiac tissue during surgery
US5915915A (en) * 1996-03-07 1999-06-29 Komag, Incorporated End effector and method for loading and unloading disks at a processing station
JP3771320B2 (ja) * 1996-03-29 2006-04-26 コマツ電子金属株式会社 半導体ウェハの貼付方法及び貼付装置
US5765890A (en) * 1996-10-03 1998-06-16 Memc Electronic Materials, Inc. Device for transferring a semiconductor wafer
US6019722A (en) * 1997-09-17 2000-02-01 Guidant Corporation Device to permit offpump beating heart coronary bypass surgery
US6338712B2 (en) * 1997-09-17 2002-01-15 Origin Medsystems, Inc. Device to permit offpump beating heart coronary bypass surgery
US6969349B1 (en) * 1997-09-17 2005-11-29 Origin Medsystem, Inc. Device to permit offpump beating heart coronary bypass surgery
US6390976B1 (en) * 1997-09-17 2002-05-21 Origin Medsystems, Inc. System to permit offpump beating heart coronary bypass surgery
US6072898A (en) 1998-01-16 2000-06-06 Beaty; Elwin M. Method and apparatus for three dimensional inspection of electronic components
BR9913759A (pt) * 1998-09-15 2001-06-12 Medtronic Inc Sistema para imobilizar temporariamente uma área de tecido, e, sistema para estabilizar tecido
US6254155B1 (en) * 1999-01-11 2001-07-03 Strasbaugh, Inc. Apparatus and method for reliably releasing wet, thin wafers
IT1308606B1 (it) * 1999-02-12 2002-01-08 Lpe Spa Dispositivo per maneggiare substrati mediante un istema autolivellante a depressione in reattori epistassiali ad induzione con suscettore
US6511416B1 (en) * 1999-08-03 2003-01-28 Cardiothoracic Systems, Inc. Tissue stabilizer and methods of use
US6506149B2 (en) * 1999-09-07 2003-01-14 Origin Medsystems, Inc. Organ manipulator having suction member supported with freedom to move relative to its support
US7338434B1 (en) 2002-08-21 2008-03-04 Medtronic, Inc. Method and system for organ positioning and stabilization
EP1220596A1 (en) * 2000-12-29 2002-07-03 Icos Vision Systems N.V. A method and an apparatus for measuring positions of contact elements of an electronic component
US6612590B2 (en) * 2001-01-12 2003-09-02 Tokyo Electron Limited Apparatus and methods for manipulating semiconductor wafers
US6676597B2 (en) 2001-01-13 2004-01-13 Medtronic, Inc. Method and device for organ positioning
US6758808B2 (en) * 2001-01-24 2004-07-06 Cardiothoracic System, Inc. Surgical instruments for stabilizing a localized portion of a beating heart
US6680774B1 (en) * 2001-10-09 2004-01-20 Ultratech Stepper, Inc. Method and apparatus for mechanically masking a workpiece
US7104578B2 (en) * 2002-03-15 2006-09-12 Asm International N.V. Two level end effector
US7494460B2 (en) * 2002-08-21 2009-02-24 Medtronic, Inc. Methods and apparatus providing suction-assisted tissue engagement through a minimally invasive incision
US6808216B2 (en) 2002-08-30 2004-10-26 Cardinal Ig Company Methods and apparatus for handling workpieces
US7931590B2 (en) * 2002-10-29 2011-04-26 Maquet Cardiovascular Llc Tissue stabilizer and methods of using the same
DE10259836A1 (de) 2002-12-19 2004-07-15 Siemens Ag Greifer und Betriebsverfahren
US7105056B2 (en) * 2002-12-30 2006-09-12 Cardinal Cg Company Pneumatic handling and recoating apparatus and method of use
US20040212205A1 (en) * 2003-01-30 2004-10-28 Linker Frank V. Method and apparatus for handling semiconductor wafers and interleafs
US7479104B2 (en) 2003-07-08 2009-01-20 Maquet Cardiovascular, Llc Organ manipulator apparatus
US7181132B2 (en) 2003-08-20 2007-02-20 Asm International N.V. Method and system for loading substrate supports into a substrate holder
US7179224B2 (en) * 2003-12-30 2007-02-20 Cardiothoracic Systems, Inc. Organ manipulator and positioner and methods of using the same
US7399272B2 (en) 2004-03-24 2008-07-15 Medtronic, Inc. Methods and apparatus providing suction-assisted tissue engagement
DE102004018250A1 (de) * 2004-04-15 2005-11-03 Infineon Technologies Ag Wafer-Stabilisierungsvorrichtung und Verfahren zu dessen Herstellung
US8083664B2 (en) 2005-05-25 2011-12-27 Maquet Cardiovascular Llc Surgical stabilizers and methods for use in reduced-access surgical sites
US20070088203A1 (en) * 2005-05-25 2007-04-19 Liming Lau Surgical assemblies and methods for visualizing and performing surgical procedures in reduced-access surgical sites
JP4634949B2 (ja) * 2006-03-20 2011-02-16 株式会社ディスコ ウエーハの保持パッド
US7794387B2 (en) 2006-04-26 2010-09-14 Medtronic, Inc. Methods and devices for stabilizing tissue
US7936447B2 (en) * 2006-05-08 2011-05-03 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
GB2470035B (en) * 2009-05-06 2013-12-18 Belron Hungary Kft Zug Branch Suction lifting device for glazing panels with cantilever handle
US9655605B2 (en) 2010-06-14 2017-05-23 Maquet Cardiovascular Llc Surgical instruments, systems and methods of use
JP2013532899A (ja) * 2010-07-23 2013-08-19 エーファウ・グループ・ゲーエムベーハー ウエハーをハンドリングするためのハンドリング装置
US9378996B2 (en) * 2011-08-12 2016-06-28 EV Group W. Thallner GmbH Holding device for holding a patterned wafer
US20130105089A1 (en) * 2011-10-28 2013-05-02 Industrial Technology Research Institute Method for separating substrate assembly
JP2014204089A (ja) * 2013-04-09 2014-10-27 株式会社ディスコ ウェーハ搬送機構及びウェーハの加工方法
JP6380160B2 (ja) 2015-02-25 2018-08-29 三菱電機株式会社 真空ピンセット及び半導体装置の製造方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1302028A (en) * 1914-07-13 1919-04-29 Westinghouse Electric & Mfg Co Sheet-handling implement.
US2916059A (en) * 1958-02-18 1959-12-08 Lan J Wong Evacuation valve cup
US3224106A (en) * 1961-05-31 1965-12-21 David G Way Method and apparatus for use in assembling ring sections about a shaft with their end faces co-planar
US3466079A (en) * 1965-09-08 1969-09-09 Western Electric Co Pressurized fluid pickup device
US3523706A (en) * 1967-10-27 1970-08-11 Ibm Apparatus for supporting articles without structural contact and for positioning the supported articles
US3517958A (en) * 1968-06-17 1970-06-30 Ibm Vacuum pick-up with air shield
US3608946A (en) * 1968-11-19 1971-09-28 Dow Chemical Co Device for handling of a filter membrane
US4050729A (en) * 1976-04-20 1977-09-27 Hutson Clifford L Apparatus for handling delicate articles such as silicon wafers
DE2628488A1 (de) * 1976-06-25 1978-01-05 Siemens Ag Werkzeug-sortiment fuer eine vakuumgreifpinzette
DE2631502A1 (de) * 1976-07-13 1978-01-19 Siemens Ag Greifwerkzeug fuer eine saugpinzette
JPS5433678A (en) * 1977-08-22 1979-03-12 Hitachi Ltd Vacuum pincette
EP0201240B1 (en) * 1985-05-04 1992-09-23 Kabushiki Kaisha Seibu Giken Apparatus for supporting and/or conveying a plate with fluid without physical contact
US4618178A (en) * 1985-06-07 1986-10-21 Clifford L. Hutson Hand held vacuum actuated pickup instrument
JPS62287639A (ja) * 1986-06-05 1987-12-14 Nitto Electric Ind Co Ltd 薄板回路基板における感圧性粘着テ−プの貼着方法

Also Published As

Publication number Publication date
KR910009451B1 (ko) 1991-11-16
DE3787873T2 (de) 1994-02-10
JPS6387831U (ko) 1988-06-08
DE3787873D1 (de) 1993-11-25
EP0269097B1 (en) 1993-10-20
EP0269097A3 (en) 1989-09-13
EP0269097A2 (en) 1988-06-01
US4904012A (en) 1990-02-27

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Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
G160 Decision to publish patent application
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 19951109

Year of fee payment: 5

LAPS Lapse due to unpaid annual fee