JPS6381187A - 熱硬化性接着シ−ト - Google Patents

熱硬化性接着シ−ト

Info

Publication number
JPS6381187A
JPS6381187A JP61227208A JP22720886A JPS6381187A JP S6381187 A JPS6381187 A JP S6381187A JP 61227208 A JP61227208 A JP 61227208A JP 22720886 A JP22720886 A JP 22720886A JP S6381187 A JPS6381187 A JP S6381187A
Authority
JP
Japan
Prior art keywords
adhesive sheet
epoxy resin
curing agent
curing
thermosetting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61227208A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0542989B2 (enrdf_load_stackoverflow
Inventor
Mitsuhiro Kondo
近藤　光広
Tsukasa Yamamoto
山元　司
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ibiden Co Ltd
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Priority to JP61227208A priority Critical patent/JPS6381187A/ja
Publication of JPS6381187A publication Critical patent/JPS6381187A/ja
Publication of JPH0542989B2 publication Critical patent/JPH0542989B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Adhesives Or Adhesive Processes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesive Tapes (AREA)
  • Epoxy Resins (AREA)
JP61227208A 1986-09-25 1986-09-25 熱硬化性接着シ−ト Granted JPS6381187A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61227208A JPS6381187A (ja) 1986-09-25 1986-09-25 熱硬化性接着シ−ト

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61227208A JPS6381187A (ja) 1986-09-25 1986-09-25 熱硬化性接着シ−ト

Publications (2)

Publication Number Publication Date
JPS6381187A true JPS6381187A (ja) 1988-04-12
JPH0542989B2 JPH0542989B2 (enrdf_load_stackoverflow) 1993-06-30

Family

ID=16857185

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61227208A Granted JPS6381187A (ja) 1986-09-25 1986-09-25 熱硬化性接着シ−ト

Country Status (1)

Country Link
JP (1) JPS6381187A (enrdf_load_stackoverflow)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04258926A (ja) * 1991-02-14 1992-09-14 Seiko Epson Corp 液晶パネル及び液晶パネルの製造方法
JPH05222343A (ja) * 1992-02-13 1993-08-31 Ibiden Co Ltd 接着剤シートとこの接着剤シートを用いたプリント配線板の製造方法およびプリント配線板
JPH08157793A (ja) * 1994-12-09 1996-06-18 Daihatsu Motor Co Ltd 熱硬化性両面接着テープ及びそれを用いた自動車の付属物取付け構造体
WO2000078887A1 (fr) * 1999-06-18 2000-12-28 Hitachi Chemical Company, Ltd. Adhesif, element adhesif, substrat de circuit pour montage de semi-conducteur presentant un element adhesif, et dispositif a semi-conducteur contenant ce dernier
JP2006235341A (ja) * 2005-02-25 2006-09-07 Fuji Photo Film Co Ltd セルロースエステルフィルム、偏光板および液晶表示装置
US7879956B2 (en) 1997-03-31 2011-02-01 Hitachi Chemical Company, Ltd. Circuit-connecting material and circuit terminal connected structure and connecting method
JP2011079904A (ja) * 2009-10-05 2011-04-21 Hitachi Chem Co Ltd エポキシ樹脂組成物、半導体封止充てん用樹脂組成物及び半導体装置
JPWO2010087526A1 (ja) * 2009-01-30 2012-08-09 味の素株式会社 樹脂組成物
EP1461829B2 (en) † 2001-12-14 2014-04-02 Henkel AG & Co. KGaA Dual cure b-stageable underfill for wafer level
JP2014096429A (ja) * 2012-11-08 2014-05-22 Kyocera Chemical Corp 積層コアの製造方法
KR20200036651A (ko) * 2018-09-28 2020-04-07 (주)엘지하우시스 외단열용 접착제 조성물 및 이를 이용한 외단열 시스템
US11193049B2 (en) 2016-11-25 2021-12-07 Lg Chem, Ltd. Curable composition

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04258926A (ja) * 1991-02-14 1992-09-14 Seiko Epson Corp 液晶パネル及び液晶パネルの製造方法
JPH05222343A (ja) * 1992-02-13 1993-08-31 Ibiden Co Ltd 接着剤シートとこの接着剤シートを用いたプリント配線板の製造方法およびプリント配線板
JPH08157793A (ja) * 1994-12-09 1996-06-18 Daihatsu Motor Co Ltd 熱硬化性両面接着テープ及びそれを用いた自動車の付属物取付け構造体
US8142605B2 (en) 1997-03-31 2012-03-27 Hitachi Chemical Company, Ltd. Circuit-connecting material and circuit terminal connected structure and connecting method
US7879956B2 (en) 1997-03-31 2011-02-01 Hitachi Chemical Company, Ltd. Circuit-connecting material and circuit terminal connected structure and connecting method
US7967943B2 (en) 1997-03-31 2011-06-28 Hitachi Chemical Company, Ltd. Circuit-connecting material and circuit terminal connected structure and connecting method
US7968196B2 (en) 1997-03-31 2011-06-28 Hitachi Chemical Company, Ltd. Circuit-connecting material and circuit terminal connected structure and connecting method
WO2000078887A1 (fr) * 1999-06-18 2000-12-28 Hitachi Chemical Company, Ltd. Adhesif, element adhesif, substrat de circuit pour montage de semi-conducteur presentant un element adhesif, et dispositif a semi-conducteur contenant ce dernier
EP1461829B2 (en) † 2001-12-14 2014-04-02 Henkel AG & Co. KGaA Dual cure b-stageable underfill for wafer level
JP2006235341A (ja) * 2005-02-25 2006-09-07 Fuji Photo Film Co Ltd セルロースエステルフィルム、偏光板および液晶表示装置
JPWO2010087526A1 (ja) * 2009-01-30 2012-08-09 味の素株式会社 樹脂組成物
JP2015145498A (ja) * 2009-01-30 2015-08-13 味の素株式会社 樹脂組成物
JP2011079904A (ja) * 2009-10-05 2011-04-21 Hitachi Chem Co Ltd エポキシ樹脂組成物、半導体封止充てん用樹脂組成物及び半導体装置
JP2014096429A (ja) * 2012-11-08 2014-05-22 Kyocera Chemical Corp 積層コアの製造方法
US11193049B2 (en) 2016-11-25 2021-12-07 Lg Chem, Ltd. Curable composition
KR20200036651A (ko) * 2018-09-28 2020-04-07 (주)엘지하우시스 외단열용 접착제 조성물 및 이를 이용한 외단열 시스템

Also Published As

Publication number Publication date
JPH0542989B2 (enrdf_load_stackoverflow) 1993-06-30

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