JPS6370550A - 半導体集積回路装置 - Google Patents

半導体集積回路装置

Info

Publication number
JPS6370550A
JPS6370550A JP61216485A JP21648586A JPS6370550A JP S6370550 A JPS6370550 A JP S6370550A JP 61216485 A JP61216485 A JP 61216485A JP 21648586 A JP21648586 A JP 21648586A JP S6370550 A JPS6370550 A JP S6370550A
Authority
JP
Japan
Prior art keywords
power
gate
power lines
power supply
capacitor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61216485A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0565059B2 (enExample
Inventor
Hiroshi Shiba
宏 柴
Keimei Mikoshiba
御子柴　啓明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP61216485A priority Critical patent/JPS6370550A/ja
Publication of JPS6370550A publication Critical patent/JPS6370550A/ja
Priority to US07/383,292 priority patent/US4937649A/en
Publication of JPH0565059B2 publication Critical patent/JPH0565059B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
    • H10D89/211—Design considerations for internal polarisation
    • H10D89/213—Design considerations for internal polarisation in field-effect devices
    • H10W20/40—
    • H10W20/495—
    • H10W20/496—

Landscapes

  • Semiconductor Integrated Circuits (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Logic Circuits (AREA)
JP61216485A 1986-09-12 1986-09-12 半導体集積回路装置 Granted JPS6370550A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP61216485A JPS6370550A (ja) 1986-09-12 1986-09-12 半導体集積回路装置
US07/383,292 US4937649A (en) 1986-09-12 1989-07-17 Semiconductor integrated circuit having a capacitor for stabilizing a voltage at a power supplying wiring

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61216485A JPS6370550A (ja) 1986-09-12 1986-09-12 半導体集積回路装置

Publications (2)

Publication Number Publication Date
JPS6370550A true JPS6370550A (ja) 1988-03-30
JPH0565059B2 JPH0565059B2 (enExample) 1993-09-16

Family

ID=16689167

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61216485A Granted JPS6370550A (ja) 1986-09-12 1986-09-12 半導体集積回路装置

Country Status (2)

Country Link
US (1) US4937649A (enExample)
JP (1) JPS6370550A (enExample)

Families Citing this family (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6124625A (en) 1988-05-31 2000-09-26 Micron Technology, Inc. Chip decoupling capacitor
US5687109A (en) * 1988-05-31 1997-11-11 Micron Technology, Inc. Integrated circuit module having on-chip surge capacitors
JP2601022B2 (ja) * 1990-11-30 1997-04-16 日本電気株式会社 半導体装置の製造方法
US5170243A (en) * 1991-11-04 1992-12-08 International Business Machines Corporation Bit line configuration for semiconductor memory
US5196920A (en) * 1992-04-21 1993-03-23 Mitsubishi Denki Kabushiki Kaisha Semiconductor integrated circuit device for limiting capacitive coupling between adjacent circuit blocks
SE470415B (sv) * 1992-07-06 1994-02-14 Ericsson Telefon Ab L M Kondensator med hög kapacitans i ett integrerat funktionsblock eller en integrerad krets, förfarande för framställning av kondensatorn och användning av kondensatorn som en integrerad avkopplingskondensator
US5479316A (en) * 1993-08-24 1995-12-26 Analog Devices, Inc. Integrated circuit metal-oxide-metal capacitor and method of making same
US5670815A (en) * 1994-07-05 1997-09-23 Motorola, Inc. Layout for noise reduction on a reference voltage
US5482897A (en) * 1994-07-19 1996-01-09 Lsi Logic Corporation Integrated circuit with on-chip ground plane
US6147857A (en) * 1997-10-07 2000-11-14 E. R. W. Optional on chip power supply bypass capacitor
US7587044B2 (en) 1998-01-02 2009-09-08 Cryptography Research, Inc. Differential power analysis method and apparatus
DE69840782D1 (de) * 1998-01-02 2009-06-04 Cryptography Res Inc Leckresistentes kryptographisches Verfahren und Vorrichtung
US6114756A (en) 1998-04-01 2000-09-05 Micron Technology, Inc. Interdigitated capacitor design for integrated circuit leadframes
AU6381699A (en) * 1998-06-03 2000-01-10 Cryptography Research, Inc. Improved des and other cryptographic processes with leak minimization for smartcards and other cryptosystems
US6414391B1 (en) * 1998-06-30 2002-07-02 Micron Technology, Inc. Module assembly for stacked BGA packages with a common bus bar in the assembly
US6539092B1 (en) * 1998-07-02 2003-03-25 Cryptography Research, Inc. Leak-resistant cryptographic indexed key update
US6963510B1 (en) 1998-07-10 2005-11-08 Xilinx, Inc. Programmable capacitor and method of operating same
US6255675B1 (en) * 1998-07-10 2001-07-03 Xilinx, Inc. Programmable capacitor for an integrated circuit
DE19834234C2 (de) 1998-07-29 2000-11-30 Siemens Ag Integrierter Halbleiterchip mit Füllstrukturen
US6677637B2 (en) * 1999-06-11 2004-01-13 International Business Machines Corporation Intralevel decoupling capacitor, method of manufacture and testing circuit of the same
US6974744B1 (en) 2000-09-05 2005-12-13 Marvell International Ltd. Fringing capacitor structure
US6980414B1 (en) 2004-06-16 2005-12-27 Marvell International, Ltd. Capacitor structure in a semiconductor device
JP2003092355A (ja) * 2001-09-19 2003-03-28 Mitsubishi Electric Corp 半導体集積回路装置
JP3678212B2 (ja) * 2002-05-20 2005-08-03 ウシオ電機株式会社 超高圧水銀ランプ
AU2003243007A1 (en) * 2002-06-25 2004-01-06 Matsushita Electric Works, Ltd. Infrared sensor package
US6755700B2 (en) * 2002-11-12 2004-06-29 Modevation Enterprises Inc. Reset speed control for watercraft
KR100860732B1 (ko) * 2003-02-14 2008-09-29 닛본 덴끼 가부시끼가이샤 선로 소자 및 선로 소자를 사용한 반도체 회로
US7291897B2 (en) * 2003-10-30 2007-11-06 Texas Instruments Incorporated One mask high density capacitor for integrated circuits
JP2008507147A (ja) * 2004-07-19 2008-03-06 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 集積回路とキャパシタンス素子とを備える電子装置
US20080043406A1 (en) * 2006-08-16 2008-02-21 Secure Computing Corporation Portable computer security device that includes a clip
US7906424B2 (en) 2007-08-01 2011-03-15 Advanced Micro Devices, Inc. Conductor bump method and apparatus
US20090032941A1 (en) * 2007-08-01 2009-02-05 Mclellan Neil Under Bump Routing Layer Method and Apparatus
US8314474B2 (en) * 2008-07-25 2012-11-20 Ati Technologies Ulc Under bump metallization for on-die capacitor
US7994610B1 (en) 2008-11-21 2011-08-09 Xilinx, Inc. Integrated capacitor with tartan cross section
US8207592B2 (en) * 2008-11-21 2012-06-26 Xilinx, Inc. Integrated capacitor with array of crosses
US7944732B2 (en) * 2008-11-21 2011-05-17 Xilinx, Inc. Integrated capacitor with alternating layered segments
US8362589B2 (en) * 2008-11-21 2013-01-29 Xilinx, Inc. Integrated capacitor with cabled plates
US7994609B2 (en) * 2008-11-21 2011-08-09 Xilinx, Inc. Shielding for integrated capacitors
US7956438B2 (en) * 2008-11-21 2011-06-07 Xilinx, Inc. Integrated capacitor with interlinked lateral fins
US20100181847A1 (en) * 2009-01-22 2010-07-22 Shen-Yu Huang Method for reducing supply voltage drop in digital circuit block and related layout architecture
KR101047061B1 (ko) * 2010-02-03 2011-07-06 주식회사 하이닉스반도체 반도체 장치의 출력 회로
US8653844B2 (en) 2011-03-07 2014-02-18 Xilinx, Inc. Calibrating device performance within an integrated circuit
US8941974B2 (en) 2011-09-09 2015-01-27 Xilinx, Inc. Interdigitated capacitor having digits of varying width
US9270247B2 (en) 2013-11-27 2016-02-23 Xilinx, Inc. High quality factor inductive and capacitive circuit structure
US9524964B2 (en) 2014-08-14 2016-12-20 Xilinx, Inc. Capacitor structure in an integrated circuit

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5552237A (en) * 1978-10-11 1980-04-16 Nec Corp Semiconductor device
JPS5962926A (ja) * 1982-10-01 1984-04-10 Hitachi Ltd 定電流回路

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4249196A (en) * 1978-08-21 1981-02-03 Burroughs Corporation Integrated circuit module with integral capacitor
US4455568A (en) * 1981-08-27 1984-06-19 American Microsystems, Inc. Insulation process for integrated circuits
US4583111A (en) * 1983-09-09 1986-04-15 Fairchild Semiconductor Corporation Integrated circuit chip wiring arrangement providing reduced circuit inductance and controlled voltage gradients
US4675717A (en) * 1984-10-09 1987-06-23 American Telephone And Telegraph Company, At&T Bell Laboratories Water-scale-integrated assembly
US4737830A (en) * 1986-01-08 1988-04-12 Advanced Micro Devices, Inc. Integrated circuit structure having compensating means for self-inductance effects

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5552237A (en) * 1978-10-11 1980-04-16 Nec Corp Semiconductor device
JPS5962926A (ja) * 1982-10-01 1984-04-10 Hitachi Ltd 定電流回路

Also Published As

Publication number Publication date
JPH0565059B2 (enExample) 1993-09-16
US4937649A (en) 1990-06-26

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