JPS6364349A - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法

Info

Publication number
JPS6364349A
JPS6364349A JP61208940A JP20894086A JPS6364349A JP S6364349 A JPS6364349 A JP S6364349A JP 61208940 A JP61208940 A JP 61208940A JP 20894086 A JP20894086 A JP 20894086A JP S6364349 A JPS6364349 A JP S6364349A
Authority
JP
Japan
Prior art keywords
circuit board
hoop
lead frame
insulated circuit
individual
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61208940A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0365022B2 (enExample
Inventor
Hajime Deguchi
出口　肇
Hiroyuki Yamamoto
弘之 山本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP61208940A priority Critical patent/JPS6364349A/ja
Publication of JPS6364349A publication Critical patent/JPS6364349A/ja
Publication of JPH0365022B2 publication Critical patent/JPH0365022B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3405—Edge mounted components, e.g. terminals

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP61208940A 1986-09-04 1986-09-04 半導体装置の製造方法 Granted JPS6364349A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61208940A JPS6364349A (ja) 1986-09-04 1986-09-04 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61208940A JPS6364349A (ja) 1986-09-04 1986-09-04 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS6364349A true JPS6364349A (ja) 1988-03-22
JPH0365022B2 JPH0365022B2 (enExample) 1991-10-09

Family

ID=16564650

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61208940A Granted JPS6364349A (ja) 1986-09-04 1986-09-04 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS6364349A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009094323A (ja) * 2007-10-10 2009-04-30 Nichia Corp 発光装置用パッケージの集合構造体およびその製造方法、ならびに発光装置の製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5518034A (en) * 1978-07-25 1980-02-07 Sony Corp Method of fabricating hybrid integrated circuit
JPS56129355A (en) * 1980-03-13 1981-10-09 Nec Corp Preparation of electronic parts
JPS5984449A (ja) * 1982-11-05 1984-05-16 Hitachi Ltd 厚膜混成集積回路の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5518034A (en) * 1978-07-25 1980-02-07 Sony Corp Method of fabricating hybrid integrated circuit
JPS56129355A (en) * 1980-03-13 1981-10-09 Nec Corp Preparation of electronic parts
JPS5984449A (ja) * 1982-11-05 1984-05-16 Hitachi Ltd 厚膜混成集積回路の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009094323A (ja) * 2007-10-10 2009-04-30 Nichia Corp 発光装置用パッケージの集合構造体およびその製造方法、ならびに発光装置の製造方法

Also Published As

Publication number Publication date
JPH0365022B2 (enExample) 1991-10-09

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees