JPS6359531B2 - - Google Patents
Info
- Publication number
- JPS6359531B2 JPS6359531B2 JP55176673A JP17667380A JPS6359531B2 JP S6359531 B2 JPS6359531 B2 JP S6359531B2 JP 55176673 A JP55176673 A JP 55176673A JP 17667380 A JP17667380 A JP 17667380A JP S6359531 B2 JPS6359531 B2 JP S6359531B2
- Authority
- JP
- Japan
- Prior art keywords
- region
- film
- substrate
- etching
- depth
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10P50/00—
Landscapes
- Weting (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP55176673A JPS57100733A (en) | 1980-12-15 | 1980-12-15 | Etching method for semiconductor substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP55176673A JPS57100733A (en) | 1980-12-15 | 1980-12-15 | Etching method for semiconductor substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57100733A JPS57100733A (en) | 1982-06-23 |
| JPS6359531B2 true JPS6359531B2 (show.php) | 1988-11-21 |
Family
ID=16017713
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP55176673A Granted JPS57100733A (en) | 1980-12-15 | 1980-12-15 | Etching method for semiconductor substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57100733A (show.php) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6328067A (ja) * | 1986-07-22 | 1988-02-05 | Sony Corp | 半導体装置の製造方法 |
| JP3205103B2 (ja) * | 1993-01-07 | 2001-09-04 | 松下電器産業株式会社 | 半導体装置の製造方法 |
| DE10104324A1 (de) * | 2001-01-24 | 2002-08-01 | Siemens Ag | Verfahren zum Ätz-Strukturieren der Oberfläche eines Bauteils |
| DE10104323A1 (de) * | 2001-01-24 | 2002-08-01 | Siemens Ag | Verfahren zum Herstellen einer Rille mit einer Engstelle in der Oberfläche eines Bauteils und Bauteil |
-
1980
- 1980-12-15 JP JP55176673A patent/JPS57100733A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57100733A (en) | 1982-06-23 |
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