JPS6358394B2 - - Google Patents
Info
- Publication number
- JPS6358394B2 JPS6358394B2 JP1463980A JP1463980A JPS6358394B2 JP S6358394 B2 JPS6358394 B2 JP S6358394B2 JP 1463980 A JP1463980 A JP 1463980A JP 1463980 A JP1463980 A JP 1463980A JP S6358394 B2 JPS6358394 B2 JP S6358394B2
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- protective layer
- copper foil
- uneven
- molding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004033 plastic Substances 0.000 claims description 10
- 239000011241 protective layer Substances 0.000 claims description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
- 239000011889 copper foil Substances 0.000 claims description 7
- 238000000465 moulding Methods 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 230000007797 corrosion Effects 0.000 claims description 4
- 238000005260 corrosion Methods 0.000 claims description 4
- 238000005530 etching Methods 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 2
- 229920001169 thermoplastic Polymers 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- -1 polypropylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1463980A JPS56111287A (en) | 1980-02-07 | 1980-02-07 | Printed circuit board and method of manufacturing same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1463980A JPS56111287A (en) | 1980-02-07 | 1980-02-07 | Printed circuit board and method of manufacturing same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS56111287A JPS56111287A (en) | 1981-09-02 |
| JPS6358394B2 true JPS6358394B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1988-11-15 |
Family
ID=11866762
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1463980A Granted JPS56111287A (en) | 1980-02-07 | 1980-02-07 | Printed circuit board and method of manufacturing same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS56111287A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0345285U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1989-09-11 | 1991-04-25 |
-
1980
- 1980-02-07 JP JP1463980A patent/JPS56111287A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0345285U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1989-09-11 | 1991-04-25 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS56111287A (en) | 1981-09-02 |