JPS6355213B2 - - Google Patents

Info

Publication number
JPS6355213B2
JPS6355213B2 JP55105911A JP10591180A JPS6355213B2 JP S6355213 B2 JPS6355213 B2 JP S6355213B2 JP 55105911 A JP55105911 A JP 55105911A JP 10591180 A JP10591180 A JP 10591180A JP S6355213 B2 JPS6355213 B2 JP S6355213B2
Authority
JP
Japan
Prior art keywords
chip
semiconductor
package
layer
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP55105911A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5731166A (en
Inventor
Junji Sakurai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP10591180A priority Critical patent/JPS5731166A/ja
Publication of JPS5731166A publication Critical patent/JPS5731166A/ja
Publication of JPS6355213B2 publication Critical patent/JPS6355213B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W90/00—
    • H10W70/682—
    • H10W70/685—
    • H10W72/07554—
    • H10W72/50—
    • H10W72/5366—
    • H10W72/547—
    • H10W72/5473—
    • H10W72/877—
    • H10W72/884—
    • H10W90/24—
    • H10W90/28—
    • H10W90/724—
    • H10W90/732—
    • H10W90/734—
    • H10W90/752—
    • H10W90/754—

Landscapes

  • Die Bonding (AREA)
  • Wire Bonding (AREA)
JP10591180A 1980-07-31 1980-07-31 Semiconductor device Granted JPS5731166A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10591180A JPS5731166A (en) 1980-07-31 1980-07-31 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10591180A JPS5731166A (en) 1980-07-31 1980-07-31 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS5731166A JPS5731166A (en) 1982-02-19
JPS6355213B2 true JPS6355213B2 (enExample) 1988-11-01

Family

ID=14420041

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10591180A Granted JPS5731166A (en) 1980-07-31 1980-07-31 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5731166A (enExample)

Families Citing this family (61)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62283634A (ja) * 1986-05-31 1987-12-09 Mitsubishi Electric Corp 半導体装置
JPH01125512A (ja) * 1987-11-09 1989-05-18 Shin Caterpillar Mitsubishi Ltd ディーゼルエンジンの排出微粒子処理装置
JPH0287635A (ja) * 1988-09-26 1990-03-28 Nec Corp セラミック・パッケージ型半導体装置
US4956695A (en) * 1989-05-12 1990-09-11 Rockwell International Corporation Three-dimensional packaging of focal plane assemblies using ceramic spacers
US5475920A (en) * 1990-08-01 1995-12-19 Burns; Carmen D. Method of assembling ultra high density integrated circuit packages
US5377077A (en) * 1990-08-01 1994-12-27 Staktek Corporation Ultra high density integrated circuit packages method and apparatus
US5446620A (en) * 1990-08-01 1995-08-29 Staktek Corporation Ultra high density integrated circuit packages
WO1992003035A1 (en) * 1990-08-01 1992-02-20 Staktek Corporation Ultra high density integrated circuit packages, method and apparatus
US5367766A (en) * 1990-08-01 1994-11-29 Staktek Corporation Ultra high density integrated circuit packages method
US5448450A (en) * 1991-08-15 1995-09-05 Staktek Corporation Lead-on-chip integrated circuit apparatus
US5239447A (en) * 1991-09-13 1993-08-24 International Business Machines Corporation Stepped electronic device package
WO1993023982A1 (en) * 1992-05-11 1993-11-25 Nchip, Inc. Stacked devices for multichip modules
US5804870A (en) * 1992-06-26 1998-09-08 Staktek Corporation Hermetically sealed integrated circuit lead-on package configuration
US5702985A (en) * 1992-06-26 1997-12-30 Staktek Corporation Hermetically sealed ceramic integrated circuit heat dissipating package fabrication method
US5484959A (en) * 1992-12-11 1996-01-16 Staktek Corporation High density lead-on-package fabrication method and apparatus
US6205654B1 (en) 1992-12-11 2001-03-27 Staktek Group L.P. Method of manufacturing a surface mount package
US5644161A (en) * 1993-03-29 1997-07-01 Staktek Corporation Ultra-high density warp-resistant memory module
US5801437A (en) * 1993-03-29 1998-09-01 Staktek Corporation Three-dimensional warp-resistant integrated circuit module method and apparatus
US5369056A (en) * 1993-03-29 1994-11-29 Staktek Corporation Warp-resistent ultra-thin integrated circuit package fabrication method
US5600183A (en) * 1994-11-15 1997-02-04 Hughes Electronics Multi-layer film adhesive for electrically isolating and grounding an integrated circuit chip to a printed circuit substrate
US5588205A (en) * 1995-01-24 1996-12-31 Staktek Corporation Method of manufacturing a high density integrated circuit module having complex electrical interconnect rails
US5615475A (en) * 1995-01-30 1997-04-01 Staktek Corporation Method of manufacturing an integrated package having a pair of die on a common lead frame
US5886412A (en) 1995-08-16 1999-03-23 Micron Technology, Inc. Angularly offset and recessed stacked die multichip device
US5874781A (en) * 1995-08-16 1999-02-23 Micron Technology, Inc. Angularly offset stacked die multichip device and method of manufacture
US6884657B1 (en) 1995-08-16 2005-04-26 Micron Technology, Inc. Angularly offset stacked die multichip device and method of manufacture
US6025642A (en) * 1995-08-17 2000-02-15 Staktek Corporation Ultra high density integrated circuit packages
DE19635582C1 (de) * 1996-09-02 1998-02-19 Siemens Ag Leistungs-Halbleiterbauelement für Brückenschaltungen mit High- bzw. Low-Side-Schaltern
US5945732A (en) 1997-03-12 1999-08-31 Staktek Corporation Apparatus and method of manufacturing a warp resistant thermally conductive integrated circuit package
US6096576A (en) 1997-09-02 2000-08-01 Silicon Light Machines Method of producing an electrical interface to an integrated circuit device having high density I/O count
KR19990061323A (ko) * 1997-12-31 1999-07-26 윤종용 반도체 패키지
JP3662461B2 (ja) 1999-02-17 2005-06-22 シャープ株式会社 半導体装置、およびその製造方法
JP3565319B2 (ja) * 1999-04-14 2004-09-15 シャープ株式会社 半導体装置及びその製造方法
JP3526788B2 (ja) 1999-07-01 2004-05-17 沖電気工業株式会社 半導体装置の製造方法
US6572387B2 (en) 1999-09-24 2003-06-03 Staktek Group, L.P. Flexible circuit connector for stacked chip module
KR100379539B1 (ko) * 1999-12-30 2003-04-10 주식회사 하이닉스반도체 반도체 패키지 및 그의 제조방법
JP3768761B2 (ja) 2000-01-31 2006-04-19 株式会社日立製作所 半導体装置およびその製造方法
JP3917344B2 (ja) * 2000-03-27 2007-05-23 株式会社東芝 半導体装置及び半導体装置の実装方法
JP2002033441A (ja) * 2000-07-14 2002-01-31 Mitsubishi Electric Corp 半導体装置
JP2002076314A (ja) * 2000-08-30 2002-03-15 Texas Instr Japan Ltd 超小型撮像装置
US6885106B1 (en) 2001-01-11 2005-04-26 Tessera, Inc. Stacked microelectronic assemblies and methods of making same
JP4536291B2 (ja) * 2001-06-13 2010-09-01 パナソニック株式会社 半導体チップの実装構造体及びその製造方法
US6785001B2 (en) 2001-08-21 2004-08-31 Silicon Light Machines, Inc. Method and apparatus for measuring wavelength jitter of light signal
WO2003032370A2 (en) 2001-10-09 2003-04-17 Tessera, Inc. Stacked packages
US6576992B1 (en) 2001-10-26 2003-06-10 Staktek Group L.P. Chip scale stacking system and method
US6940729B2 (en) 2001-10-26 2005-09-06 Staktek Group L.P. Integrated circuit stacking system and method
US7485951B2 (en) 2001-10-26 2009-02-03 Entorian Technologies, Lp Modularized die stacking system and method
US6914324B2 (en) 2001-10-26 2005-07-05 Staktek Group L.P. Memory expansion and chip scale stacking system and method
US6867500B2 (en) 2002-04-08 2005-03-15 Micron Technology, Inc. Multi-chip module and methods
US6839479B2 (en) 2002-05-29 2005-01-04 Silicon Light Machines Corporation Optical switch
US7053485B2 (en) 2002-08-16 2006-05-30 Tessera, Inc. Microelectronic packages with self-aligning features
US7046420B1 (en) 2003-02-28 2006-05-16 Silicon Light Machines Corporation MEM micro-structures and methods of making the same
US7061096B2 (en) * 2003-09-24 2006-06-13 Silicon Pipe, Inc. Multi-surface IC packaging structures and methods for their manufacture
US7061121B2 (en) 2003-11-12 2006-06-13 Tessera, Inc. Stacked microelectronic assemblies with central contacts
US7652381B2 (en) * 2003-11-13 2010-01-26 Interconnect Portfolio Llc Interconnect system without through-holes
US8324725B2 (en) 2004-09-27 2012-12-04 Formfactor, Inc. Stacked die module
JP5056051B2 (ja) * 2007-02-19 2012-10-24 パナソニック株式会社 カード型情報装置
JP5243284B2 (ja) * 2009-01-30 2013-07-24 株式会社新川 補正位置検出装置、補正位置検出方法及びボンディング装置
US8354743B2 (en) * 2010-01-27 2013-01-15 Honeywell International Inc. Multi-tiered integrated circuit package
US9741644B2 (en) 2015-05-04 2017-08-22 Honeywell International Inc. Stacking arrangement for integration of multiple integrated circuits
CN106206458B (zh) * 2016-07-17 2018-09-25 高燕妮 一种叠层集成电路封装结构
CN107889355B (zh) * 2017-11-10 2020-12-01 Oppo广东移动通信有限公司 一种电路板组件以及电子设备

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5081475A (enExample) * 1973-11-19 1975-07-02
JPS5561041A (en) * 1978-10-30 1980-05-08 Mitsubishi Electric Corp Packaging device for semiconductor integrated circuit

Also Published As

Publication number Publication date
JPS5731166A (en) 1982-02-19

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