JPS5081475A - - Google Patents

Info

Publication number
JPS5081475A
JPS5081475A JP48131074A JP13107473A JPS5081475A JP S5081475 A JPS5081475 A JP S5081475A JP 48131074 A JP48131074 A JP 48131074A JP 13107473 A JP13107473 A JP 13107473A JP S5081475 A JPS5081475 A JP S5081475A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP48131074A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP48131074A priority Critical patent/JPS5081475A/ja
Publication of JPS5081475A publication Critical patent/JPS5081475A/ja
Pending legal-status Critical Current

Links

Classifications

    • H10W72/50
    • H10W72/884
    • H10W90/732
    • H10W90/752
    • H10W90/756

Landscapes

  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Wire Bonding (AREA)
JP48131074A 1973-11-19 1973-11-19 Pending JPS5081475A (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP48131074A JPS5081475A (enExample) 1973-11-19 1973-11-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP48131074A JPS5081475A (enExample) 1973-11-19 1973-11-19

Publications (1)

Publication Number Publication Date
JPS5081475A true JPS5081475A (enExample) 1975-07-02

Family

ID=15049372

Family Applications (1)

Application Number Title Priority Date Filing Date
JP48131074A Pending JPS5081475A (enExample) 1973-11-19 1973-11-19

Country Status (1)

Country Link
JP (1) JPS5081475A (enExample)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55111151A (en) * 1979-02-20 1980-08-27 Nec Corp Integrated circuit device
JPS5731166A (en) * 1980-07-31 1982-02-19 Fujitsu Ltd Semiconductor device
JPS57106230U (enExample) * 1980-12-22 1982-06-30
JPS57160155A (en) * 1981-03-27 1982-10-02 Mitsubishi Electric Corp Multi-layer semiconductor integrated circuit
JPS5837947A (ja) * 1981-08-31 1983-03-05 Toshiba Corp 半導体装置
JPS5892258A (ja) * 1981-11-27 1983-06-01 Mitsubishi Electric Corp 集積回路素子
JPS5892230A (ja) * 1981-11-27 1983-06-01 Mitsubishi Electric Corp 半導体装置
JPS59143354A (ja) * 1983-02-04 1984-08-16 Mitsubishi Electric Corp 半導体集積回路装置
JP2002217357A (ja) * 2001-01-19 2002-08-02 Kyocera Corp 半導体装置
JP2015153985A (ja) * 2014-02-18 2015-08-24 株式会社デンソー 半導体パッケージ

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55111151A (en) * 1979-02-20 1980-08-27 Nec Corp Integrated circuit device
JPS5731166A (en) * 1980-07-31 1982-02-19 Fujitsu Ltd Semiconductor device
JPS57106230U (enExample) * 1980-12-22 1982-06-30
JPS57160155A (en) * 1981-03-27 1982-10-02 Mitsubishi Electric Corp Multi-layer semiconductor integrated circuit
JPS5837947A (ja) * 1981-08-31 1983-03-05 Toshiba Corp 半導体装置
JPS5892258A (ja) * 1981-11-27 1983-06-01 Mitsubishi Electric Corp 集積回路素子
JPS5892230A (ja) * 1981-11-27 1983-06-01 Mitsubishi Electric Corp 半導体装置
JPS59143354A (ja) * 1983-02-04 1984-08-16 Mitsubishi Electric Corp 半導体集積回路装置
JP2002217357A (ja) * 2001-01-19 2002-08-02 Kyocera Corp 半導体装置
JP2015153985A (ja) * 2014-02-18 2015-08-24 株式会社デンソー 半導体パッケージ

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