JPS635429B2 - - Google Patents

Info

Publication number
JPS635429B2
JPS635429B2 JP60025921A JP2592185A JPS635429B2 JP S635429 B2 JPS635429 B2 JP S635429B2 JP 60025921 A JP60025921 A JP 60025921A JP 2592185 A JP2592185 A JP 2592185A JP S635429 B2 JPS635429 B2 JP S635429B2
Authority
JP
Japan
Prior art keywords
resin
synthetic
resin composition
electronic components
parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP60025921A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61190556A (ja
Inventor
Sumio Satsuka
Masafumi Myake
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Risho Kogyo Co Ltd
Original Assignee
Risho Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Risho Kogyo Co Ltd filed Critical Risho Kogyo Co Ltd
Priority to JP60025921A priority Critical patent/JPS61190556A/ja
Priority to US06/829,095 priority patent/US4683253A/en
Publication of JPS61190556A publication Critical patent/JPS61190556A/ja
Publication of JPS635429B2 publication Critical patent/JPS635429B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP60025921A 1985-02-12 1985-02-12 電子部品封止用樹脂組成物 Granted JPS61190556A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP60025921A JPS61190556A (ja) 1985-02-12 1985-02-12 電子部品封止用樹脂組成物
US06/829,095 US4683253A (en) 1985-02-12 1986-02-12 Resin molding compound for sealing electronic parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60025921A JPS61190556A (ja) 1985-02-12 1985-02-12 電子部品封止用樹脂組成物

Publications (2)

Publication Number Publication Date
JPS61190556A JPS61190556A (ja) 1986-08-25
JPS635429B2 true JPS635429B2 (https=) 1988-02-03

Family

ID=12179240

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60025921A Granted JPS61190556A (ja) 1985-02-12 1985-02-12 電子部品封止用樹脂組成物

Country Status (2)

Country Link
US (1) US4683253A (https=)
JP (1) JPS61190556A (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4999699A (en) * 1990-03-14 1991-03-12 International Business Machines Corporation Solder interconnection structure and process for making
AUPN124595A0 (en) * 1995-02-21 1995-03-16 University Of Queensland, The An RF resonator for NMR
JP4004160B2 (ja) * 1998-09-21 2007-11-07 協和化学工業株式会社 ウラン（ｕ）含量の少ないハイドロタルサイト類化合物およびその製造法
KR100968102B1 (ko) * 1998-09-21 2010-07-06 교와 가가꾸고교 가부시키가이샤 낮은 우라늄(u) 함량의 히드로탈사이트 화합물 및 그것의 제조 방법
US7457037B2 (en) 2004-09-27 2008-11-25 Corning Incorporated Transparent polarizing optical products and fabrication thereof
KR101152545B1 (ko) * 2010-02-10 2012-06-01 삼성모바일디스플레이주식회사 터치 스크린 패널이 구비된 평판표시장치
CN109411311B (zh) * 2018-10-16 2021-02-02 南京萨特科技发展有限公司 一种熔断器用灭弧浆料及其制备方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2941895A (en) * 1956-09-11 1960-06-21 Du Pont Pigmentary product and process for making same
NL283472A (https=) * 1959-02-27 1900-01-01
US4068024A (en) * 1970-11-24 1978-01-10 Deutsche Gold- Und Silber-Scheideanstalt Vormals Roessler Process for preparing finely divided hydrophobic oxide particles
JPS53102361A (en) * 1977-02-18 1978-09-06 Toray Silicone Co Ltd Thermosetting resin composition
JPS5443021A (en) * 1977-09-12 1979-04-05 Minolta Camera Co Ltd F/stop digital value display device of cameras
JPS6015152B2 (ja) * 1980-01-09 1985-04-17 株式会社日立製作所 樹脂封止半導体メモリ装置
JPS56116647A (en) * 1980-02-20 1981-09-12 Hitachi Ltd Manufacturing of silica-alumina type filler for semiconductor memory element covering resin
JPS57195151A (en) * 1981-05-27 1982-11-30 Denki Kagaku Kogyo Kk Low-radioactive resin composition
JPS58138740A (ja) * 1982-02-15 1983-08-17 Denki Kagaku Kogyo Kk 樹脂組成物
JPS58140142A (ja) * 1982-02-16 1983-08-19 Shin Etsu Chem Co Ltd 電子部品被覆用組成物
JPS58151318A (ja) * 1982-02-26 1983-09-08 Shin Etsu Chem Co Ltd 合成シリカおよびこれを含有してなる電子部品封止用樹脂組成物
JPS5923403A (ja) * 1982-07-30 1984-02-06 信越化学工業株式会社 合成シリカおよびこれを含有してなる電子部品封止用樹脂組成物
JPS6026505B2 (ja) * 1982-09-30 1985-06-24 新日本製鐵株式会社 無機充填樹脂組成物の製造方法
JPS5991137A (ja) * 1982-11-15 1984-05-25 Matsushita Electric Works Ltd 樹脂組成物
JPS59168043A (ja) * 1983-03-15 1984-09-21 Matsushita Electric Works Ltd 樹脂組成物
JPS59204633A (ja) * 1983-05-06 1984-11-20 Denki Kagaku Kogyo Kk 低放射能樹脂組成物
JPS60210643A (ja) * 1983-11-30 1985-10-23 Denki Kagaku Kogyo Kk 充填剤及びその組成物

Also Published As

Publication number Publication date
US4683253A (en) 1987-07-28
JPS61190556A (ja) 1986-08-25

Similar Documents

Publication Publication Date Title
CN1080746C (zh) 无机填料、环氧树脂组合物和半导体器件
JP4614214B2 (ja) 半導体装置素子用中空パッケージ
JP3800277B2 (ja) 半導体封止用エポキシ樹脂組成物及び半導体装置
JP3821173B2 (ja) エポキシ樹脂組成物
US4931852A (en) High thermal conductivity/low alpha emission molding compound containing high purity semiconductor filler and integrated circuit package
JPS6157347B2 (https=)
JPS644540B2 (https=)
US4677026A (en) Resin composition for sealing electronic parts, and hydration-resistant magnesia powder and process for preparation thereof
JPS635429B2 (https=)
JPS58127354A (ja) 半導体素子封止用樹脂組成物
JPH07206983A (ja) エポキシ樹脂組成物及びその製造方法及びそれを用いた半導体装置
JP2000063636A (ja) 半導体封止用エポキシ樹脂組成物及び半導体装置
KR910003773B1 (ko) 전자부품 봉지용 수지조성물
JPH0369939B2 (https=)
JP2021138864A (ja) 封止用樹脂組成物および電子装置
JPS62209128A (ja) 半導体装置封止用エポキシ樹脂組成物
JPH02145416A (ja) 溶融球状シリカ及びこれを用いた封止用樹脂組成物
JP2002338788A (ja) エポキシ樹脂組成物およびそれを用いた半導体素子収納中空パッケージ
JPH0528744B2 (https=)
JPS60124647A (ja) 低放射線性エポキシ樹脂組成物
JPH02158637A (ja) シリカフィラーおよびこれを用いた封止用樹脂組成物
JPH07103263B2 (ja) 封止樹脂充填用シリカ
JPS60219756A (ja) 樹脂封止型半導体装置
JPS6310846B2 (https=)
JP2025017299A (ja) 封止用樹脂組成物、電子装置および電子装置の製造方法