JPH0528744B2 - - Google Patents

Info

Publication number
JPH0528744B2
JPH0528744B2 JP62221668A JP22166887A JPH0528744B2 JP H0528744 B2 JPH0528744 B2 JP H0528744B2 JP 62221668 A JP62221668 A JP 62221668A JP 22166887 A JP22166887 A JP 22166887A JP H0528744 B2 JPH0528744 B2 JP H0528744B2
Authority
JP
Japan
Prior art keywords
silica
less
particles
filler
weight
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP62221668A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6462362A (en
Inventor
Teijiro Matsumoto
Ryusuke Araki
Masamichi Hayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Seika Chemicals Co Ltd
Original Assignee
Sumitomo Seika Chemicals Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Seika Chemicals Co Ltd filed Critical Sumitomo Seika Chemicals Co Ltd
Priority to JP22166887A priority Critical patent/JPS6462362A/ja
Publication of JPS6462362A publication Critical patent/JPS6462362A/ja
Publication of JPH0528744B2 publication Critical patent/JPH0528744B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Silicon Compounds (AREA)
  • Sealing Material Composition (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Pigments, Carbon Blacks, Or Wood Stains (AREA)
JP22166887A 1987-09-03 1987-09-03 Filler and polymer composition containing same Granted JPS6462362A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22166887A JPS6462362A (en) 1987-09-03 1987-09-03 Filler and polymer composition containing same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22166887A JPS6462362A (en) 1987-09-03 1987-09-03 Filler and polymer composition containing same

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2416152A Division JPH062569B2 (ja) 1990-12-31 1990-12-31 シリカ微粉末

Publications (2)

Publication Number Publication Date
JPS6462362A JPS6462362A (en) 1989-03-08
JPH0528744B2 true JPH0528744B2 (https=) 1993-04-27

Family

ID=16770394

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22166887A Granted JPS6462362A (en) 1987-09-03 1987-09-03 Filler and polymer composition containing same

Country Status (1)

Country Link
JP (1) JPS6462362A (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01294765A (ja) * 1988-05-20 1989-11-28 Nippon Retsuku Kk エポキシ樹脂組成物
JP2513529B2 (ja) * 1990-09-19 1996-07-03 東芝セラミックス株式会社 電子部品封止用充填材の製造方法
JPH062569B2 (ja) * 1990-12-31 1994-01-12 住友精化株式会社 シリカ微粉末
CA2087911C (en) * 1992-01-24 1999-06-29 Kiyoshi Abe Spherical granules of porous silica or silicate, process for the production thereof, and applications thereof

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5829858A (ja) * 1981-08-13 1983-02-22 Nitto Electric Ind Co Ltd 電子部品封止用樹脂組成物
JPS58138740A (ja) * 1982-02-15 1983-08-17 Denki Kagaku Kogyo Kk 樹脂組成物
JPS5922955A (ja) * 1982-07-29 1984-02-06 Toshiba Chem Corp 半導体封止用樹脂組成物
JPH0651786B2 (ja) * 1985-09-30 1994-07-06 株式会社東芝 半導体装置封止用エポキシ樹脂組成物
JPS6296567A (ja) * 1985-10-24 1987-05-06 Denki Kagaku Kogyo Kk 半導体封止用エポキシ樹脂組成物

Also Published As

Publication number Publication date
JPS6462362A (en) 1989-03-08

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