JPH0460053B2 - - Google Patents
Info
- Publication number
- JPH0460053B2 JPH0460053B2 JP11761287A JP11761287A JPH0460053B2 JP H0460053 B2 JPH0460053 B2 JP H0460053B2 JP 11761287 A JP11761287 A JP 11761287A JP 11761287 A JP11761287 A JP 11761287A JP H0460053 B2 JPH0460053 B2 JP H0460053B2
- Authority
- JP
- Japan
- Prior art keywords
- silica
- particles
- fine powder
- powder particles
- particle size
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 100
- 239000002245 particle Substances 0.000 claims description 49
- 239000000377 silicon dioxide Substances 0.000 claims description 37
- 239000000843 powder Substances 0.000 claims description 35
- 238000000034 method Methods 0.000 claims description 19
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 11
- 238000003825 pressing Methods 0.000 claims description 9
- 239000012736 aqueous medium Substances 0.000 claims description 8
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 6
- 229910002026 crystalline silica Inorganic materials 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 235000012239 silicon dioxide Nutrition 0.000 claims description 6
- 239000000203 mixture Substances 0.000 claims description 5
- 230000006378 damage Effects 0.000 claims description 2
- 239000000945 filler Substances 0.000 description 7
- 239000002994 raw material Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 239000005350 fused silica glass Substances 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 229920003002 synthetic resin Polymers 0.000 description 5
- 239000000057 synthetic resin Substances 0.000 description 5
- 239000013078 crystal Substances 0.000 description 4
- 238000000635 electron micrograph Methods 0.000 description 4
- 238000000227 grinding Methods 0.000 description 4
- 239000011256 inorganic filler Substances 0.000 description 4
- 229910003475 inorganic filler Inorganic materials 0.000 description 4
- 239000002609 medium Substances 0.000 description 4
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 238000011109 contamination Methods 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 239000010419 fine particle Substances 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 238000010298 pulverizing process Methods 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229910001018 Cast iron Inorganic materials 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 230000003139 buffering effect Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 229920005749 polyurethane resin Polymers 0.000 description 2
- 239000004576 sand Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000010297 mechanical methods and process Methods 0.000 description 1
- 238000010309 melting process Methods 0.000 description 1
- 239000002480 mineral oil Substances 0.000 description 1
- 235000010446 mineral oil Nutrition 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000011164 primary particle Substances 0.000 description 1
- 238000007670 refining Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/113—Silicon oxides; Hydrates thereof
- C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Silicon Compounds (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Pigments, Carbon Blacks, Or Wood Stains (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11761287A JPS63282109A (ja) | 1987-05-13 | 1987-05-13 | シリカ微粉末粒子の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11761287A JPS63282109A (ja) | 1987-05-13 | 1987-05-13 | シリカ微粉末粒子の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63282109A JPS63282109A (ja) | 1988-11-18 |
| JPH0460053B2 true JPH0460053B2 (https=) | 1992-09-25 |
Family
ID=14716069
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11761287A Granted JPS63282109A (ja) | 1987-05-13 | 1987-05-13 | シリカ微粉末粒子の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63282109A (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0750760B2 (ja) * | 1988-12-21 | 1995-05-31 | 松下電工株式会社 | 半導体封止用樹脂成形材料 |
| JPH02187055A (ja) * | 1989-01-13 | 1990-07-23 | Nitto Denko Corp | 半導体装置 |
| JPH08124956A (ja) * | 1995-10-06 | 1996-05-17 | Nitto Denko Corp | 半導体装置 |
-
1987
- 1987-05-13 JP JP11761287A patent/JPS63282109A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63282109A (ja) | 1988-11-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US3781172A (en) | Process for the manufacture of microcrystalline fused abrasives | |
| JPH02275713A (ja) | 球状シリカ粒子の製造方法 | |
| US5643347A (en) | Process for manufacture of silica granules | |
| JPS61155343A (ja) | 直接圧縮加工用粒状マンニトールおよびその製造方法 | |
| US20090139149A1 (en) | Abrasive Grain Based on Melted Spherical Corundum | |
| US3875282A (en) | Production of high bulk density spray dried hydrous sodium silicate | |
| JPH0460053B2 (https=) | ||
| KR100926916B1 (ko) | 수산화알루미늄 분말의 제조 방법 | |
| CN108394903A (zh) | 一种纳米级碳化硅微粉的制备方法 | |
| JP7474221B2 (ja) | 球状シリカ粉末の製造方法 | |
| JPH0528744B2 (https=) | ||
| JPH03135453A (ja) | 無機粉体の製造方法 | |
| JP3774652B2 (ja) | 固形物原料用粉体及びその製造方法 | |
| JPH02144186A (ja) | 浸出防止凝集体の製造方法 | |
| JPH062569B2 (ja) | シリカ微粉末 | |
| KR100427260B1 (ko) | 미크론 사이즈 실리카의 제조방법 | |
| WO1999029623A1 (en) | Precipitated amorphous silicas having improved physical properties | |
| KR100894590B1 (ko) | 수산화 알루미늄 및 이의 제조방법 | |
| JPH01107855A (ja) | 粉粒体の微粉砕方法 | |
| JPS6140724B2 (https=) | ||
| JPH0323484B2 (https=) | ||
| JPH07165434A (ja) | 発泡シリカガラスの製造方法 | |
| JPH01270530A (ja) | ガラス成形体の製造方法 | |
| JPH03137012A (ja) | 耐摩耗性シリカメディアの製造法 | |
| JPH0283224A (ja) | 合成石英ガラス粉末の製造方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| EXPY | Cancellation because of completion of term | ||
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20070925 Year of fee payment: 15 |