JPS6462362A - Filler and polymer composition containing same - Google Patents
Filler and polymer composition containing sameInfo
- Publication number
- JPS6462362A JPS6462362A JP22166887A JP22166887A JPS6462362A JP S6462362 A JPS6462362 A JP S6462362A JP 22166887 A JP22166887 A JP 22166887A JP 22166887 A JP22166887 A JP 22166887A JP S6462362 A JPS6462362 A JP S6462362A
- Authority
- JP
- Japan
- Prior art keywords
- filler
- silica
- particles
- diameter
- polymer composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000945 filler Substances 0.000 title abstract 4
- 239000000203 mixture Substances 0.000 title abstract 2
- 229920000642 polymer Polymers 0.000 title 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 10
- 239000002245 particle Substances 0.000 abstract 7
- 239000000377 silicon dioxide Substances 0.000 abstract 5
- 239000012736 aqueous medium Substances 0.000 abstract 2
- 239000000843 powder Substances 0.000 abstract 1
- 238000007789 sealing Methods 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 abstract 1
- 229920001187 thermosetting polymer Polymers 0.000 abstract 1
- 239000004634 thermosetting polymer Substances 0.000 abstract 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Silicon Compounds (AREA)
- Sealing Material Composition (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Pigments, Carbon Blacks, Or Wood Stains (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22166887A JPS6462362A (en) | 1987-09-03 | 1987-09-03 | Filler and polymer composition containing same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22166887A JPS6462362A (en) | 1987-09-03 | 1987-09-03 | Filler and polymer composition containing same |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2416152A Division JPH062569B2 (ja) | 1990-12-31 | 1990-12-31 | シリカ微粉末 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6462362A true JPS6462362A (en) | 1989-03-08 |
| JPH0528744B2 JPH0528744B2 (https=) | 1993-04-27 |
Family
ID=16770394
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22166887A Granted JPS6462362A (en) | 1987-09-03 | 1987-09-03 | Filler and polymer composition containing same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6462362A (https=) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01294765A (ja) * | 1988-05-20 | 1989-11-28 | Nippon Retsuku Kk | エポキシ樹脂組成物 |
| JPH03247635A (ja) * | 1990-12-31 | 1991-11-05 | Sumitomo Seika Chem Co Ltd | シリカ微粉末 |
| JPH04130161A (ja) * | 1990-09-19 | 1992-05-01 | Toshiba Ceramics Co Ltd | 電子部品封止用充填材の製造方法 |
| US5342876A (en) * | 1992-01-24 | 1994-08-30 | Misuzawa Industrial Chemicals, Ltd. | Spherical granules of porous silica or silicate, process for the production thereof, and applications thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5829858A (ja) * | 1981-08-13 | 1983-02-22 | Nitto Electric Ind Co Ltd | 電子部品封止用樹脂組成物 |
| JPS58138740A (ja) * | 1982-02-15 | 1983-08-17 | Denki Kagaku Kogyo Kk | 樹脂組成物 |
| JPS5922955A (ja) * | 1982-07-29 | 1984-02-06 | Toshiba Chem Corp | 半導体封止用樹脂組成物 |
| JPS6274924A (ja) * | 1985-09-30 | 1987-04-06 | Toshiba Corp | 半導体装置封止用エポキシ樹脂組成物 |
| JPS6296567A (ja) * | 1985-10-24 | 1987-05-06 | Denki Kagaku Kogyo Kk | 半導体封止用エポキシ樹脂組成物 |
-
1987
- 1987-09-03 JP JP22166887A patent/JPS6462362A/ja active Granted
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5829858A (ja) * | 1981-08-13 | 1983-02-22 | Nitto Electric Ind Co Ltd | 電子部品封止用樹脂組成物 |
| JPS58138740A (ja) * | 1982-02-15 | 1983-08-17 | Denki Kagaku Kogyo Kk | 樹脂組成物 |
| JPS5922955A (ja) * | 1982-07-29 | 1984-02-06 | Toshiba Chem Corp | 半導体封止用樹脂組成物 |
| JPS6274924A (ja) * | 1985-09-30 | 1987-04-06 | Toshiba Corp | 半導体装置封止用エポキシ樹脂組成物 |
| JPS6296567A (ja) * | 1985-10-24 | 1987-05-06 | Denki Kagaku Kogyo Kk | 半導体封止用エポキシ樹脂組成物 |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01294765A (ja) * | 1988-05-20 | 1989-11-28 | Nippon Retsuku Kk | エポキシ樹脂組成物 |
| JPH04130161A (ja) * | 1990-09-19 | 1992-05-01 | Toshiba Ceramics Co Ltd | 電子部品封止用充填材の製造方法 |
| JPH03247635A (ja) * | 1990-12-31 | 1991-11-05 | Sumitomo Seika Chem Co Ltd | シリカ微粉末 |
| US5342876A (en) * | 1992-01-24 | 1994-08-30 | Misuzawa Industrial Chemicals, Ltd. | Spherical granules of porous silica or silicate, process for the production thereof, and applications thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0528744B2 (https=) | 1993-04-27 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term | ||
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Year of fee payment: 15 Free format text: PAYMENT UNTIL: 20080427 |