JPS6354222B2 - - Google Patents

Info

Publication number
JPS6354222B2
JPS6354222B2 JP57228953A JP22895382A JPS6354222B2 JP S6354222 B2 JPS6354222 B2 JP S6354222B2 JP 57228953 A JP57228953 A JP 57228953A JP 22895382 A JP22895382 A JP 22895382A JP S6354222 B2 JPS6354222 B2 JP S6354222B2
Authority
JP
Japan
Prior art keywords
resin
conductor pattern
integrated circuit
circuit element
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57228953A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59120884A (ja
Inventor
Kunio Sakuma
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP57228953A priority Critical patent/JPS59120884A/ja
Priority to CH694183A priority patent/CH660551GA3/fr
Publication of JPS59120884A publication Critical patent/JPS59120884A/ja
Priority to US06/891,084 priority patent/US4644445A/en
Publication of JPS6354222B2 publication Critical patent/JPS6354222B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W74/012—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H10W74/15—
    • H10W70/681—
    • H10W72/07236—
    • H10W72/856—
    • H10W74/00—

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Clocks (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP57228953A 1982-12-27 1982-12-27 回路ブロツクの樹脂封止構造 Granted JPS59120884A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP57228953A JPS59120884A (ja) 1982-12-27 1982-12-27 回路ブロツクの樹脂封止構造
CH694183A CH660551GA3 (cg-RX-API-DMAC10.html) 1982-12-27 1983-12-27
US06/891,084 US4644445A (en) 1982-12-27 1986-07-31 Resin mounting structure for an integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57228953A JPS59120884A (ja) 1982-12-27 1982-12-27 回路ブロツクの樹脂封止構造

Publications (2)

Publication Number Publication Date
JPS59120884A JPS59120884A (ja) 1984-07-12
JPS6354222B2 true JPS6354222B2 (cg-RX-API-DMAC10.html) 1988-10-27

Family

ID=16884439

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57228953A Granted JPS59120884A (ja) 1982-12-27 1982-12-27 回路ブロツクの樹脂封止構造

Country Status (1)

Country Link
JP (1) JPS59120884A (cg-RX-API-DMAC10.html)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62184494U (cg-RX-API-DMAC10.html) * 1986-05-15 1987-11-24
JPH0749433Y2 (ja) * 1987-10-02 1995-11-13 セイコーエプソン株式会社 電子時計用回路ブロック
US5438216A (en) * 1992-08-31 1995-08-01 Motorola, Inc. Light erasable multichip module
JP3683996B2 (ja) * 1996-07-30 2005-08-17 株式会社東芝 半導体装置およびその製造方法

Also Published As

Publication number Publication date
JPS59120884A (ja) 1984-07-12

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