JPS6351542B2 - - Google Patents
Info
- Publication number
- JPS6351542B2 JPS6351542B2 JP57016232A JP1623282A JPS6351542B2 JP S6351542 B2 JPS6351542 B2 JP S6351542B2 JP 57016232 A JP57016232 A JP 57016232A JP 1623282 A JP1623282 A JP 1623282A JP S6351542 B2 JPS6351542 B2 JP S6351542B2
- Authority
- JP
- Japan
- Prior art keywords
- lead
- tab
- semiconductor device
- package body
- leads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10W70/421—
-
- H10W74/016—
-
- H10W72/07551—
-
- H10W72/50—
-
- H10W74/00—
-
- H10W90/756—
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (9)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57016232A JPS58134452A (ja) | 1982-02-05 | 1982-02-05 | 半導体装置およびその製造方法 |
| DE3303165A DE3303165C2 (de) | 1982-02-05 | 1983-01-31 | Halbleitervorrichtung mit Gehäusekörper und Verbindungsleitern |
| GB08302730A GB2115220B (en) | 1982-02-05 | 1983-02-01 | Semiconductor device and method of producing the same |
| IT19414/83A IT1161869B (it) | 1982-02-05 | 1983-02-03 | Dispositivo a semiconduttori e procedimento per la sua fabbricazione |
| KR1019830000433A KR900001989B1 (ko) | 1982-02-05 | 1983-02-04 | 반도체장치 |
| SG362/87A SG36287G (en) | 1982-02-05 | 1987-04-23 | Semiconductor device and method of producing the same |
| HK707/87A HK70787A (en) | 1982-02-05 | 1987-10-01 | Semiconductor device and method of producing the same |
| MY616/87A MY8700616A (en) | 1982-02-05 | 1987-12-30 | Semiconductor device and method of producing the same |
| KR1019900000785A KR900001988B1 (ko) | 1982-02-05 | 1990-01-24 | 반도체장치에 사용되는 리이드 프레임 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57016232A JPS58134452A (ja) | 1982-02-05 | 1982-02-05 | 半導体装置およびその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58134452A JPS58134452A (ja) | 1983-08-10 |
| JPS6351542B2 true JPS6351542B2 (cg-RX-API-DMAC10.html) | 1988-10-14 |
Family
ID=11910801
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57016232A Granted JPS58134452A (ja) | 1982-02-05 | 1982-02-05 | 半導体装置およびその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58134452A (cg-RX-API-DMAC10.html) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0464982U (cg-RX-API-DMAC10.html) * | 1990-10-12 | 1992-06-04 | ||
| JPH08502389A (ja) * | 1992-10-13 | 1996-03-12 | オリン コーポレイション | シール幅を縮小した金属電子パッケージ |
-
1982
- 1982-02-05 JP JP57016232A patent/JPS58134452A/ja active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0464982U (cg-RX-API-DMAC10.html) * | 1990-10-12 | 1992-06-04 | ||
| JPH08502389A (ja) * | 1992-10-13 | 1996-03-12 | オリン コーポレイション | シール幅を縮小した金属電子パッケージ |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58134452A (ja) | 1983-08-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2875139B2 (ja) | 半導体装置の製造方法 | |
| US6104086A (en) | Semiconductor device having lead terminals bent in J-shape | |
| CN100466241C (zh) | 半导体器件 | |
| US20020113325A1 (en) | Semiconductor package and mounting structure on substrate thereof and stack structure thereof | |
| US4706105A (en) | Semiconductor device and method of producing the same | |
| USRE37707E1 (en) | Leadframe with heat dissipator connected to S-shaped fingers | |
| KR0179834B1 (ko) | 컬럼형 패키지 | |
| JP2009071154A (ja) | 半導体装置 | |
| JPS6351542B2 (cg-RX-API-DMAC10.html) | ||
| JPS63296252A (ja) | 樹脂封止型半導体装置 | |
| JP3136029B2 (ja) | 半導体装置 | |
| JPH079960B2 (ja) | 半導体装置 | |
| KR900001989B1 (ko) | 반도체장치 | |
| KR0148078B1 (ko) | 연장된 리드를 갖는 리드 온 칩용 리드프레임 | |
| KR910000018B1 (ko) | 리이드프레임을 갖춘 반도체장치 및 그 제조방법 | |
| KR0124827Y1 (ko) | 기판실장형 반도체 패키지 | |
| JP3747991B2 (ja) | 半導体装置の製造方法 | |
| JPS62298146A (ja) | 電子装置 | |
| KR100819794B1 (ko) | 리드프레임 및, 그것을 이용한 반도체 패키지 제조 방법 | |
| JP3224224B2 (ja) | 半導体装置の製造方法 | |
| KR100478679B1 (ko) | 고밀도실장용반도체패키지및이를성형하는반도체패키지제조금형 | |
| KR900001988B1 (ko) | 반도체장치에 사용되는 리이드 프레임 | |
| JP3289000B2 (ja) | 半導体装置の製造方法 | |
| KR200334397Y1 (ko) | 핀이 없는 반도체 부품 패키지 구조개선 | |
| KR100537893B1 (ko) | 리드 프레임과 이를 이용한 적층 칩 패키지 |