JPS6349387B2 - - Google Patents
Info
- Publication number
- JPS6349387B2 JPS6349387B2 JP53141800A JP14180078A JPS6349387B2 JP S6349387 B2 JPS6349387 B2 JP S6349387B2 JP 53141800 A JP53141800 A JP 53141800A JP 14180078 A JP14180078 A JP 14180078A JP S6349387 B2 JPS6349387 B2 JP S6349387B2
- Authority
- JP
- Japan
- Prior art keywords
- type
- film
- forming
- polycrystalline silicon
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/01—Manufacture or treatment
- H10D84/0123—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs
- H10D84/0126—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs
- H10D84/0165—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs the components including complementary IGFETs, e.g. CMOS devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/01—Manufacture or treatment
- H10D84/02—Manufacture or treatment characterised by using material-based technologies
- H10D84/03—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology
- H10D84/038—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology using silicon technology, e.g. SiGe
Landscapes
- Electrodes Of Semiconductors (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14180078A JPS5568675A (en) | 1978-11-17 | 1978-11-17 | Fabrication of complementary mos transistor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14180078A JPS5568675A (en) | 1978-11-17 | 1978-11-17 | Fabrication of complementary mos transistor |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5568675A JPS5568675A (en) | 1980-05-23 |
JPS6349387B2 true JPS6349387B2 (enrdf_load_stackoverflow) | 1988-10-04 |
Family
ID=15300420
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14180078A Granted JPS5568675A (en) | 1978-11-17 | 1978-11-17 | Fabrication of complementary mos transistor |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5568675A (enrdf_load_stackoverflow) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57106068A (en) * | 1980-12-23 | 1982-07-01 | Seiko Epson Corp | Manufacture of semiconductor device |
JPS57113269A (en) * | 1980-12-29 | 1982-07-14 | Seiko Epson Corp | Complementary-metal oxide semiconductor type semiconductor device |
US4374700A (en) * | 1981-05-29 | 1983-02-22 | Texas Instruments Incorporated | Method of manufacturing silicide contacts for CMOS devices |
CA1194614A (en) * | 1982-03-04 | 1985-10-01 | Nan-Hsiung Tsai | Process of ion implant masking in cmos manufacture and resultant structure |
DE3218309A1 (de) * | 1982-05-14 | 1983-11-17 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zum herstellen von integrierten mos-feldeffekttransistoren mit einer aus metallsiliziden bestehenden zusaetzlichen leiterbahnebene |
JPS592363A (ja) * | 1982-06-09 | 1984-01-07 | テキサス・インスツルメンツ・インコ−ポレイテツド | 相補型絶縁ゲート電界効果型装置 |
JPS5957469A (ja) * | 1982-09-28 | 1984-04-03 | Fujitsu Ltd | 半導体装置 |
JPS59119863A (ja) * | 1982-12-27 | 1984-07-11 | Seiko Epson Corp | 半導体装置 |
JPS6014461A (ja) * | 1983-07-04 | 1985-01-25 | Hitachi Ltd | 相補型絶縁ゲート電界効果トランジスタの製造方法 |
JPS59197162A (ja) * | 1983-04-22 | 1984-11-08 | Nec Corp | 半導体装置 |
JPS6041259A (ja) * | 1983-08-17 | 1985-03-04 | Nec Corp | 半導体装置 |
JPS60117766A (ja) * | 1983-11-30 | 1985-06-25 | Nec Corp | 半導体装置 |
IT1213120B (it) * | 1984-01-10 | 1989-12-14 | Ates Componenti Elettron | Processo per la fabbricazione di transistori mos complementari a basse tensioni di soglia in circuiti integrati ad alta densita' e struttura da esso risultante. |
JPH0626235B2 (ja) * | 1984-06-20 | 1994-04-06 | 株式会社日立製作所 | 半導体集積回路装置 |
US4740479A (en) * | 1985-07-05 | 1988-04-26 | Siemens Aktiengesellschaft | Method for the manufacture of cross-couplings between n-channel and p-channel CMOS field effect transistors of static write-read memories |
JPH01217945A (ja) * | 1988-02-26 | 1989-08-31 | Toshiba Corp | 半導体装置の製造方法 |
JPH0273628A (ja) * | 1988-09-08 | 1990-03-13 | Oki Electric Ind Co Ltd | 半導体装置の製造方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5241099B2 (enrdf_load_stackoverflow) * | 1973-03-07 | 1977-10-17 | ||
JPS5847860B2 (ja) * | 1973-06-30 | 1983-10-25 | 株式会社東芝 | ハンドウタイソウチ |
JPS5843912B2 (ja) * | 1975-05-06 | 1983-09-29 | 松下電器産業株式会社 | 半導体集積回路装置の製造方法 |
JPS5388581A (en) * | 1977-01-14 | 1978-08-04 | Toshiba Corp | Complementary type field effect transistor |
-
1978
- 1978-11-17 JP JP14180078A patent/JPS5568675A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS5568675A (en) | 1980-05-23 |
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