JPS6347346B2 - - Google Patents

Info

Publication number
JPS6347346B2
JPS6347346B2 JP16019982A JP16019982A JPS6347346B2 JP S6347346 B2 JPS6347346 B2 JP S6347346B2 JP 16019982 A JP16019982 A JP 16019982A JP 16019982 A JP16019982 A JP 16019982A JP S6347346 B2 JPS6347346 B2 JP S6347346B2
Authority
JP
Japan
Prior art keywords
etching
metal strip
composite metal
aluminum
mask
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP16019982A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5948946A (ja
Inventor
Yoshihiro Matsuyama
Masaru Watanabe
Mitsuhiko Sugyama
Kenji Konishi
Mamoru Onda
Takashi Suzumura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Cable Ltd
Original Assignee
Hitachi Cable Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Cable Ltd filed Critical Hitachi Cable Ltd
Priority to JP16019982A priority Critical patent/JPS5948946A/ja
Publication of JPS5948946A publication Critical patent/JPS5948946A/ja
Publication of JPS6347346B2 publication Critical patent/JPS6347346B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H01L21/4828—Etching

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP16019982A 1982-09-14 1982-09-14 半導体用リ−ドフレ−ムの製造方法 Granted JPS5948946A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16019982A JPS5948946A (ja) 1982-09-14 1982-09-14 半導体用リ−ドフレ−ムの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16019982A JPS5948946A (ja) 1982-09-14 1982-09-14 半導体用リ−ドフレ−ムの製造方法

Publications (2)

Publication Number Publication Date
JPS5948946A JPS5948946A (ja) 1984-03-21
JPS6347346B2 true JPS6347346B2 (enrdf_load_stackoverflow) 1988-09-21

Family

ID=15709943

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16019982A Granted JPS5948946A (ja) 1982-09-14 1982-09-14 半導体用リ−ドフレ−ムの製造方法

Country Status (1)

Country Link
JP (1) JPS5948946A (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0765703B1 (en) * 1994-06-14 2001-10-10 Kabushiki Kaisha Toshiba Sleeve for die casting machines and die casting machine using the same

Also Published As

Publication number Publication date
JPS5948946A (ja) 1984-03-21

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