JPS6324073B2 - - Google Patents
Info
- Publication number
- JPS6324073B2 JPS6324073B2 JP16019782A JP16019782A JPS6324073B2 JP S6324073 B2 JPS6324073 B2 JP S6324073B2 JP 16019782 A JP16019782 A JP 16019782A JP 16019782 A JP16019782 A JP 16019782A JP S6324073 B2 JPS6324073 B2 JP S6324073B2
- Authority
- JP
- Japan
- Prior art keywords
- etching
- mask
- metal layer
- metal strip
- coating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910052751 metal Inorganic materials 0.000 claims description 44
- 239000002184 metal Substances 0.000 claims description 44
- 238000005530 etching Methods 0.000 claims description 43
- 239000011248 coating agent Substances 0.000 claims description 18
- 238000000576 coating method Methods 0.000 claims description 18
- 239000002131 composite material Substances 0.000 claims description 16
- 238000000034 method Methods 0.000 claims description 12
- 239000010953 base metal Substances 0.000 claims description 7
- 238000003825 pressing Methods 0.000 claims description 6
- 239000000126 substance Substances 0.000 claims description 5
- 239000013013 elastic material Substances 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 8
- 150000002739 metals Chemical class 0.000 description 7
- 230000003628 erosive effect Effects 0.000 description 6
- 239000007788 liquid Substances 0.000 description 5
- 239000004809 Teflon Substances 0.000 description 3
- 229920006362 Teflon® Polymers 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229920002379 silicone rubber Polymers 0.000 description 3
- 239000004945 silicone rubber Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical group [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 238000005097 cold rolling Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- -1 polyethylene Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 238000003908 quality control method Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Landscapes
- ing And Chemical Polishing (AREA)
- Weting (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16019782A JPS5950180A (ja) | 1982-09-14 | 1982-09-14 | 機械的マスクを用いたエツチング法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16019782A JPS5950180A (ja) | 1982-09-14 | 1982-09-14 | 機械的マスクを用いたエツチング法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5950180A JPS5950180A (ja) | 1984-03-23 |
| JPS6324073B2 true JPS6324073B2 (enrdf_load_stackoverflow) | 1988-05-19 |
Family
ID=15709903
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16019782A Granted JPS5950180A (ja) | 1982-09-14 | 1982-09-14 | 機械的マスクを用いたエツチング法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5950180A (enrdf_load_stackoverflow) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6340325A (ja) * | 1986-08-05 | 1988-02-20 | Tokuyama Soda Co Ltd | 半導体ウエハの切り出し方法 |
-
1982
- 1982-09-14 JP JP16019782A patent/JPS5950180A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5950180A (ja) | 1984-03-23 |
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