JPS6347345B2 - - Google Patents
Info
- Publication number
- JPS6347345B2 JPS6347345B2 JP16019882A JP16019882A JPS6347345B2 JP S6347345 B2 JPS6347345 B2 JP S6347345B2 JP 16019882 A JP16019882 A JP 16019882A JP 16019882 A JP16019882 A JP 16019882A JP S6347345 B2 JPS6347345 B2 JP S6347345B2
- Authority
- JP
- Japan
- Prior art keywords
- etching
- metal strip
- composite metal
- aluminum
- mask
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005530 etching Methods 0.000 claims description 48
- 229910052751 metal Inorganic materials 0.000 claims description 43
- 239000002184 metal Substances 0.000 claims description 43
- 239000002131 composite material Substances 0.000 claims description 27
- 238000000034 method Methods 0.000 claims description 17
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical group [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 claims description 14
- 229910052782 aluminium Inorganic materials 0.000 claims description 13
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 13
- 239000004065 semiconductor Substances 0.000 claims description 11
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 239000010953 base metal Substances 0.000 claims description 8
- 238000004080 punching Methods 0.000 claims description 7
- 239000000126 substance Substances 0.000 claims description 5
- 239000013013 elastic material Substances 0.000 claims description 4
- 238000003825 pressing Methods 0.000 claims description 3
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 claims description 2
- 229910045601 alloy Inorganic materials 0.000 claims description 2
- 239000000956 alloy Substances 0.000 claims description 2
- 239000007788 liquid Substances 0.000 description 9
- 238000000576 coating method Methods 0.000 description 7
- 150000002739 metals Chemical class 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 6
- 230000003628 erosive effect Effects 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 2
- 229920006362 Teflon® Polymers 0.000 description 2
- 238000005253 cladding Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 229920002379 silicone rubber Polymers 0.000 description 2
- 239000004945 silicone rubber Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- -1 polyethylene Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
- H01L21/4828—Etching
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16019882A JPS5948945A (ja) | 1982-09-14 | 1982-09-14 | 半導体用リ−ドフレ−ムの製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16019882A JPS5948945A (ja) | 1982-09-14 | 1982-09-14 | 半導体用リ−ドフレ−ムの製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5948945A JPS5948945A (ja) | 1984-03-21 |
| JPS6347345B2 true JPS6347345B2 (ko) | 1988-09-21 |
Family
ID=15709922
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16019882A Granted JPS5948945A (ja) | 1982-09-14 | 1982-09-14 | 半導体用リ−ドフレ−ムの製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5948945A (ko) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2867606B1 (fr) | 2004-03-10 | 2006-06-02 | Soitec Silicon On Insulator | Procede et dispositif de traitement de la couche utile d'une structure multicouche |
-
1982
- 1982-09-14 JP JP16019882A patent/JPS5948945A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5948945A (ja) | 1984-03-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5683943A (en) | Process for etching a semiconductor lead frame | |
| JPH05343600A (ja) | 半導体装置用スタビライザ／スペーサ | |
| JPS591683A (ja) | ダイス型とその製法 | |
| JPS6347345B2 (ko) | ||
| JPS6347346B2 (ko) | ||
| JP2003078097A (ja) | リードフレーム及びその製造方法 | |
| US5945259A (en) | Method for lead frame etching | |
| JPS5858439B2 (ja) | リ−ドフレ−ムの製造方法 | |
| JPH0139655B2 (ko) | ||
| JPS6324073B2 (ko) | ||
| KR0147652B1 (ko) | 리이드 프레임의 제조방법 | |
| JPS6315992B2 (ko) | ||
| JPH05326788A (ja) | リードフレーム素材及びこれを用いた半導体装置 | |
| JP2784352B2 (ja) | リードフレームの製造方法 | |
| JPH07231062A (ja) | リードフレームの加工方法 | |
| JP2648354B2 (ja) | リードフレームの製造方法 | |
| JPH02106059A (ja) | リードフレームの製造方法 | |
| JPS5987845A (ja) | リ−ドフレ−ムの製造方法 | |
| JP2972016B2 (ja) | リードフレームの製造方法 | |
| JPH0671058B2 (ja) | 微少点状めっき部を有するリ−ドフレ−ムの製造方法 | |
| JPH08319584A (ja) | エッチング部品の製造方法 | |
| JPH01147848A (ja) | Ｉｃ用リードフレームの製造方法 | |
| JP2963245B2 (ja) | 厚膜型サーマルプリントヘッドの製造方法 | |
| JPS61241957A (ja) | リードフレームの製造方法およびリードフレームを用いた半導体装置の製造方法 | |
| JP2520610Y2 (ja) | リードフレーム |