JPS6347340B2 - - Google Patents

Info

Publication number
JPS6347340B2
JPS6347340B2 JP57224483A JP22448382A JPS6347340B2 JP S6347340 B2 JPS6347340 B2 JP S6347340B2 JP 57224483 A JP57224483 A JP 57224483A JP 22448382 A JP22448382 A JP 22448382A JP S6347340 B2 JPS6347340 B2 JP S6347340B2
Authority
JP
Japan
Prior art keywords
epoxy resin
resin
sealing layer
subassembly
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57224483A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59113648A (ja
Inventor
Toshuki Hidaka
Hisashi Sakamoto
Toshiaki Fukuhara
Sadao Fujeda
Yutaka Misawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP57224483A priority Critical patent/JPS59113648A/ja
Priority to US06/563,039 priority patent/US4540603A/en
Priority to EP83112853A priority patent/EP0111932B1/en
Priority to CA000443800A priority patent/CA1206819A/en
Priority to DE8383112853T priority patent/DE3377438D1/de
Publication of JPS59113648A publication Critical patent/JPS59113648A/ja
Publication of JPS6347340B2 publication Critical patent/JPS6347340B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W74/01—
    • H10W74/111—
    • H10W74/121—
    • H10W74/137—
    • H10W74/47—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
    • Y10T29/49171—Assembling electrical component directly to terminal or elongated conductor with encapsulating

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Epoxy Resins (AREA)
JP57224483A 1982-12-20 1982-12-20 樹脂モ−ルド型半導体装置 Granted JPS59113648A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP57224483A JPS59113648A (ja) 1982-12-20 1982-12-20 樹脂モ−ルド型半導体装置
US06/563,039 US4540603A (en) 1982-12-20 1983-12-19 Resin-molded semiconductor device and a process for manufacturing the same
EP83112853A EP0111932B1 (en) 1982-12-20 1983-12-20 Resin-molded semiconductor devices and a process for manufacturing the same
CA000443800A CA1206819A (en) 1982-12-20 1983-12-20 Resin-molded semiconductor device and a process for manufacturing the same
DE8383112853T DE3377438D1 (en) 1982-12-20 1983-12-20 Resin-molded semiconductor devices and a process for manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57224483A JPS59113648A (ja) 1982-12-20 1982-12-20 樹脂モ−ルド型半導体装置

Publications (2)

Publication Number Publication Date
JPS59113648A JPS59113648A (ja) 1984-06-30
JPS6347340B2 true JPS6347340B2 (en:Method) 1988-09-21

Family

ID=16814499

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57224483A Granted JPS59113648A (ja) 1982-12-20 1982-12-20 樹脂モ−ルド型半導体装置

Country Status (5)

Country Link
US (1) US4540603A (en:Method)
EP (1) EP0111932B1 (en:Method)
JP (1) JPS59113648A (en:Method)
CA (1) CA1206819A (en:Method)
DE (1) DE3377438D1 (en:Method)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5994041A (en) * 1985-04-06 1999-11-30 Eastman Kodak Company Process for buffering concentrated aqueous slurries
JPS63283054A (ja) * 1987-03-11 1988-11-18 Fuji Plant Kogyo Kk ピン保持部付リードフレームの製造方法
US4985747A (en) * 1988-06-09 1991-01-15 Oki Electric Industry Co., Ltd. Terminal structure and process of fabricating the same
US5219795A (en) * 1989-02-07 1993-06-15 Fujitsu Limited Dual in-line packaging and method of producing the same
DE4110318C2 (de) * 1991-03-28 2001-10-11 Bosch Gmbh Robert Verfahren zum Zusammenlöten zweier Bauteile
US5609998A (en) * 1994-12-29 1997-03-11 Eastman Kodak Company Process for dispersing concentrated aqueous slurries
US5550086A (en) * 1995-12-27 1996-08-27 Tai; George Ceramic chip form semiconductor diode fabrication method
US6477037B1 (en) * 1998-04-03 2002-11-05 Medtronic, Inc. Implantable medical device having flat electrolytic capacitor with miniaturized epoxy connector droplet
US6008535A (en) * 1998-09-17 1999-12-28 Advanced Ceramic X Corp. Method of making a semiconductor diode from laminated ceramic tape
US6384487B1 (en) * 1999-12-06 2002-05-07 Micron Technology, Inc. Bow resistant plastic semiconductor package and method of fabrication
US6700210B1 (en) * 1999-12-06 2004-03-02 Micron Technology, Inc. Electronic assemblies containing bow resistant semiconductor packages
DE102017130342A1 (de) * 2017-12-18 2019-06-19 Melexis Bulgaria Ltd. Verstärkte elektronische Vorrichtung für einen Elektromotor

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3492157A (en) * 1966-06-20 1970-01-27 Tokyo Shibaura Electric Co Resin-sealed semiconductor device and manufacturing method for the same
DE2027105C3 (de) * 1970-06-03 1981-03-26 Robert Bosch Gmbh, 70469 Stuttgart Verfahren zur Herstellung eines Halbleiterbauelements
JPS4831965U (en:Method) * 1971-08-20 1973-04-18
US3751724A (en) * 1972-04-28 1973-08-07 C Mcgrath Encapsulated electrical component
JPS5619086B2 (en:Method) * 1974-03-08 1981-05-06
JPS531469A (en) * 1976-06-26 1978-01-09 Hitachi Ltd Glass seal type semiconductor device
JPS55111344U (en:Method) * 1979-01-29 1980-08-05
JPS551174A (en) * 1979-03-28 1980-01-07 Hitachi Ltd Semiconductor apparatus
US4282136A (en) * 1979-04-09 1981-08-04 Hunt Earl R Flame retardant epoxy molding compound method and encapsulated device
DE2944922C2 (de) * 1979-11-07 1981-11-12 Standard Elektrik Lorenz Ag, 7000 Stuttgart Elektrisches Bauelement
JPS5749126A (en) * 1980-09-08 1982-03-20 Hitachi Ltd Bushing
JPS57152125A (en) * 1981-03-12 1982-09-20 Nippon Electric Co Method of sheathing electronic part

Also Published As

Publication number Publication date
EP0111932A3 (en) 1985-08-28
EP0111932A2 (en) 1984-06-27
JPS59113648A (ja) 1984-06-30
EP0111932B1 (en) 1988-07-20
DE3377438D1 (en) 1988-08-25
US4540603A (en) 1985-09-10
CA1206819A (en) 1986-07-02

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