JPS6347272B2 - - Google Patents
Info
- Publication number
- JPS6347272B2 JPS6347272B2 JP57066822A JP6682282A JPS6347272B2 JP S6347272 B2 JPS6347272 B2 JP S6347272B2 JP 57066822 A JP57066822 A JP 57066822A JP 6682282 A JP6682282 A JP 6682282A JP S6347272 B2 JPS6347272 B2 JP S6347272B2
- Authority
- JP
- Japan
- Prior art keywords
- coining
- lead
- leads
- inner lead
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000002184 metal Substances 0.000 description 7
- 238000005530 etching Methods 0.000 description 5
- 230000007547 defect Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000004080 punching Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000000750 progressive effect Effects 0.000 description 2
- 229910001111 Fine metal Inorganic materials 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6682282A JPS58182858A (ja) | 1982-04-21 | 1982-04-21 | リ−ドフレ−ム |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6682282A JPS58182858A (ja) | 1982-04-21 | 1982-04-21 | リ−ドフレ−ム |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS58182858A JPS58182858A (ja) | 1983-10-25 |
JPS6347272B2 true JPS6347272B2 (de) | 1988-09-21 |
Family
ID=13326920
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6682282A Granted JPS58182858A (ja) | 1982-04-21 | 1982-04-21 | リ−ドフレ−ム |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58182858A (de) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0648872Y2 (ja) * | 1986-02-21 | 1994-12-12 | 住友金属鉱山株式会社 | リ−ドフレ−ム |
JPH03187252A (ja) * | 1989-12-15 | 1991-08-15 | Sanyo Electric Co Ltd | リードフレームの製造方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS501658A (de) * | 1973-05-07 | 1975-01-09 | ||
JPS5666061A (en) * | 1979-11-05 | 1981-06-04 | Hitachi Ltd | Lead frame |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5840614Y2 (ja) * | 1981-01-16 | 1983-09-13 | セイコーインスツルメンツ株式会社 | 半導体装置 |
-
1982
- 1982-04-21 JP JP6682282A patent/JPS58182858A/ja active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS501658A (de) * | 1973-05-07 | 1975-01-09 | ||
JPS5666061A (en) * | 1979-11-05 | 1981-06-04 | Hitachi Ltd | Lead frame |
Also Published As
Publication number | Publication date |
---|---|
JPS58182858A (ja) | 1983-10-25 |
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