JPS6347272B2 - - Google Patents

Info

Publication number
JPS6347272B2
JPS6347272B2 JP57066822A JP6682282A JPS6347272B2 JP S6347272 B2 JPS6347272 B2 JP S6347272B2 JP 57066822 A JP57066822 A JP 57066822A JP 6682282 A JP6682282 A JP 6682282A JP S6347272 B2 JPS6347272 B2 JP S6347272B2
Authority
JP
Japan
Prior art keywords
coining
lead
leads
inner lead
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57066822A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58182858A (ja
Inventor
Shoichi Ogura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP6682282A priority Critical patent/JPS58182858A/ja
Publication of JPS58182858A publication Critical patent/JPS58182858A/ja
Publication of JPS6347272B2 publication Critical patent/JPS6347272B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495Lead-frames or other flat leads
    • H01L23/49541Geometry of the lead-frame
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP6682282A 1982-04-21 1982-04-21 リ−ドフレ−ム Granted JPS58182858A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6682282A JPS58182858A (ja) 1982-04-21 1982-04-21 リ−ドフレ−ム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6682282A JPS58182858A (ja) 1982-04-21 1982-04-21 リ−ドフレ−ム

Publications (2)

Publication Number Publication Date
JPS58182858A JPS58182858A (ja) 1983-10-25
JPS6347272B2 true JPS6347272B2 (de) 1988-09-21

Family

ID=13326920

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6682282A Granted JPS58182858A (ja) 1982-04-21 1982-04-21 リ−ドフレ−ム

Country Status (1)

Country Link
JP (1) JPS58182858A (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0648872Y2 (ja) * 1986-02-21 1994-12-12 住友金属鉱山株式会社 リ−ドフレ−ム
JPH03187252A (ja) * 1989-12-15 1991-08-15 Sanyo Electric Co Ltd リードフレームの製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS501658A (de) * 1973-05-07 1975-01-09
JPS5666061A (en) * 1979-11-05 1981-06-04 Hitachi Ltd Lead frame

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5840614Y2 (ja) * 1981-01-16 1983-09-13 セイコーインスツルメンツ株式会社 半導体装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS501658A (de) * 1973-05-07 1975-01-09
JPS5666061A (en) * 1979-11-05 1981-06-04 Hitachi Ltd Lead frame

Also Published As

Publication number Publication date
JPS58182858A (ja) 1983-10-25

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