JPS6336686Y2 - - Google Patents

Info

Publication number
JPS6336686Y2
JPS6336686Y2 JP1982062579U JP6257982U JPS6336686Y2 JP S6336686 Y2 JPS6336686 Y2 JP S6336686Y2 JP 1982062579 U JP1982062579 U JP 1982062579U JP 6257982 U JP6257982 U JP 6257982U JP S6336686 Y2 JPS6336686 Y2 JP S6336686Y2
Authority
JP
Japan
Prior art keywords
chip
semiconductor device
terminal
terminal chip
stage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1982062579U
Other languages
English (en)
Japanese (ja)
Other versions
JPS58164240U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1982062579U priority Critical patent/JPS58164240U/ja
Publication of JPS58164240U publication Critical patent/JPS58164240U/ja
Application granted granted Critical
Publication of JPS6336686Y2 publication Critical patent/JPS6336686Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W70/682—
    • H10W72/5473—
    • H10W72/884—
    • H10W90/756—

Landscapes

  • Die Bonding (AREA)
JP1982062579U 1982-04-28 1982-04-28 半導体装置 Granted JPS58164240U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982062579U JPS58164240U (ja) 1982-04-28 1982-04-28 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982062579U JPS58164240U (ja) 1982-04-28 1982-04-28 半導体装置

Publications (2)

Publication Number Publication Date
JPS58164240U JPS58164240U (ja) 1983-11-01
JPS6336686Y2 true JPS6336686Y2 (cg-RX-API-DMAC10.html) 1988-09-28

Family

ID=30072727

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982062579U Granted JPS58164240U (ja) 1982-04-28 1982-04-28 半導体装置

Country Status (1)

Country Link
JP (1) JPS58164240U (cg-RX-API-DMAC10.html)

Also Published As

Publication number Publication date
JPS58164240U (ja) 1983-11-01

Similar Documents

Publication Publication Date Title
JP3499202B2 (ja) 半導体装置の製造方法
US7008824B2 (en) Method of fabricating mounted multiple semiconductor dies in a package
US6297547B1 (en) Mounting multiple semiconductor dies in a package
US6707141B2 (en) Multi-chip module substrate for use with leads-over chip type semiconductor devices
US5637828A (en) High density semiconductor package
JP2641869B2 (ja) 半導体装置の製造方法
US6916682B2 (en) Semiconductor package device for use with multiple integrated circuits in a stacked configuration and method of formation and testing
JPH1084069A (ja) ボトムリード型半導体パッケージ
US6987313B2 (en) Semiconductor device
JPS6336686Y2 (cg-RX-API-DMAC10.html)
JPH0563138A (ja) 半導体集積回路装置
KR20010017143A (ko) 캐리어 테이프를 이용한 적층형 플립 칩 패키지
JPH11260850A (ja) 半導体装置およびその製造方法
CN100382311C (zh) 堆叠式双芯片封装结构
JP3275787B2 (ja) 樹脂封止型半導体装置およびその製造方法
JP2003318362A (ja) 樹脂封止形半導体装置
JPH04139737A (ja) 半導体チップの実装方法
KR100352115B1 (ko) 반도체패키지
JPH11135669A (ja) Ｃｓｐ型半導体装置
JPH07142631A (ja) 半導体装置およびその製造方法
JPS60262434A (ja) 半導体装置
JPH041737Y2 (cg-RX-API-DMAC10.html)
JPS6159846A (ja) 半導体装置
JPH0513624A (ja) 半導体装置
JPH0493051A (ja) 薄型モジュール