JPS632157B2 - - Google Patents
Info
- Publication number
- JPS632157B2 JPS632157B2 JP56178802A JP17880281A JPS632157B2 JP S632157 B2 JPS632157 B2 JP S632157B2 JP 56178802 A JP56178802 A JP 56178802A JP 17880281 A JP17880281 A JP 17880281A JP S632157 B2 JPS632157 B2 JP S632157B2
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- insulating substrate
- motherboard
- resistant film
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 claims description 29
- 229920005989 resin Polymers 0.000 claims description 14
- 239000011347 resin Substances 0.000 claims description 14
- 238000000576 coating method Methods 0.000 claims description 11
- 239000011248 coating agent Substances 0.000 claims description 10
- 239000004020 conductor Substances 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 2
- 238000005452 bending Methods 0.000 description 8
- 229910000679 solder Inorganic materials 0.000 description 6
- 230000000873 masking effect Effects 0.000 description 5
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Combinations Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17880281A JPS5879799A (ja) | 1981-11-06 | 1981-11-06 | 混成集積回路の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17880281A JPS5879799A (ja) | 1981-11-06 | 1981-11-06 | 混成集積回路の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5879799A JPS5879799A (ja) | 1983-05-13 |
| JPS632157B2 true JPS632157B2 (zh) | 1988-01-18 |
Family
ID=16054898
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17880281A Granted JPS5879799A (ja) | 1981-11-06 | 1981-11-06 | 混成集積回路の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5879799A (zh) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4812556B1 (zh) * | 1969-05-27 | 1973-04-21 | ||
| JPS4819148B1 (zh) * | 1970-10-12 | 1973-06-11 | ||
| JPS4822154B1 (zh) * | 1970-09-07 | 1973-07-04 | ||
| JPS4822747B1 (zh) * | 1970-12-10 | 1973-07-09 | ||
| JPS5225264A (en) * | 1975-08-21 | 1977-02-25 | Matsushita Electric Ind Co Ltd | Hybrid miniature parts |
| JPS5426671B2 (zh) * | 1976-02-26 | 1979-09-05 | ||
| JPS57193094A (en) * | 1981-05-18 | 1982-11-27 | Matsushita Electric Ind Co Ltd | Electronic circuit part and method of mounting same |
| JPS6011809A (ja) * | 1983-06-30 | 1985-01-22 | Ricoh Co Ltd | オ−トフオ−カス方法 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4812556U (zh) * | 1971-06-21 | 1973-02-12 | ||
| JPS4819148U (zh) * | 1971-07-13 | 1973-03-03 | ||
| JPS4822154U (zh) * | 1971-07-21 | 1973-03-13 | ||
| JPS5124520Y2 (zh) * | 1971-07-23 | 1976-06-23 | ||
| JPS5228067U (zh) * | 1975-08-20 | 1977-02-26 | ||
| JPS5279565U (zh) * | 1975-12-12 | 1977-06-14 | ||
| JPS5426671U (zh) * | 1977-07-26 | 1979-02-21 | ||
| JPS5833708Y2 (ja) * | 1978-10-02 | 1983-07-28 | 松下電器産業株式会社 | フレキシブル印刷基板 |
| JPS5565890U (zh) * | 1978-10-30 | 1980-05-07 | ||
| JPS5834770Y2 (ja) * | 1978-12-25 | 1983-08-04 | 松下電器産業株式会社 | プリント基板装置 |
-
1981
- 1981-11-06 JP JP17880281A patent/JPS5879799A/ja active Granted
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4812556B1 (zh) * | 1969-05-27 | 1973-04-21 | ||
| JPS4822154B1 (zh) * | 1970-09-07 | 1973-07-04 | ||
| JPS4819148B1 (zh) * | 1970-10-12 | 1973-06-11 | ||
| JPS4822747B1 (zh) * | 1970-12-10 | 1973-07-09 | ||
| JPS5225264A (en) * | 1975-08-21 | 1977-02-25 | Matsushita Electric Ind Co Ltd | Hybrid miniature parts |
| JPS5426671B2 (zh) * | 1976-02-26 | 1979-09-05 | ||
| JPS57193094A (en) * | 1981-05-18 | 1982-11-27 | Matsushita Electric Ind Co Ltd | Electronic circuit part and method of mounting same |
| JPS6011809A (ja) * | 1983-06-30 | 1985-01-22 | Ricoh Co Ltd | オ−トフオ−カス方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5879799A (ja) | 1983-05-13 |
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